cExpress-SL
Vendor:ADLINK Technology Inc.
- Details
- Specification
- Order information
- 6th Generation Intel® Core™ and Celeron® Processors
- Up to 32GB Dual Channel non-ECC DDR4 at 1867/2133MHz
- Five PCIe x1 Gen2 (configurable to x2, x4), GbE
- Extreme Rugged™ operating temperature: -40°C to +85°C (optional)
ADLINK's COM Express computer-on-module (COM) offerings include the cExpress-SL and Express-SL in PICMG COM.0 Type 6 Compact and Basic Size form factors, respectively. Both Basic and Compact size modules are available with 6th generation Intel® Core™ i7, i5 or i3 processors and accompanying Intel® QM170 and HM170 Chipset. ECC memory is supported by models utilizing the Intel® Xeon® processor E3-15XX v5 family and Intel® CM236 chipset. DDR4 memory is supported up to a total of 32GB, with a lower voltage compared to DDR3 resulting in a reduction in overall power consumption and heat dissipation. These new COMs also provide support for three independent UHD/4K displays and are well-suited for applications in automation, medical, and infotainment, with extended operating temperature range optionally available for transportation and defense applications.
The ADLINK cExpress-SL computer-on-module with built-in SEMA Cloud functionality is ready-made for Internet of Things (IoT) applications. The cExpress-SL is able to connect legacy industrial devices and other IoT systems to the cloud, extract raw data from these devices, determine which data to save locally and which to send to the cloud for further analysis. The results these analyses can provide valuable information for policy decision making and generate innovative business opportunities.
| Technical specifications | |
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Core System |
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|---|---|
| CPU |
6th Generation Intel® Core™ and Celeron® Processors - Mobile 14nm process (formerly “Skylake-U”) Core™ i7-6600U 2.6/3.4GHz (Turbo), 4M, 15W (7.5W cTDP) (2C/GT2) Core™ i5-6300U 2.4/3.0GHz (Turbo), 3M, 15W (7.5W cTDP) (2C/GT2) Core™ i3-6100U 2.3GHz, 3M, 15W (7.5W cTDP) (2C/GT2) Celeron® 3955U 2GHz, 2M, 15W (10W cTDP) (2C/GT1) Supports: Intel® VT, Intel® TXT, Intel® SSE4.2, Intel® HT Technology, Intel® 64 Architecture, Execute Disable Bit, Intel® Turbo Boost Technology 2.0, Intel® AVX2, Intel® AES-NI, PCLMULQDQ Instruction, Intel® Secure Key and Intel® TSX. Note: Availability of features may vary between processor SKUs. |
| Memory | Dual channel 1867/2133 MHz non-ECC DDR4 memory up to 32GB in dual SODIMM socket |
| Embedded BIOS | AMI EFI with CMOS backup in 8MB SPI BIOS with Intel® AMT 11.0 support (AMT support available on Core™ i7/i5 only) |
| Cache | 4MB for Core™ i7, 3MB for Core™ i5 and Core™ i3, 2MB for Celeron® |
| Expansion Busses |
5 PCI Express x1 Gen3 (AB): Lanes 0/1/2/3/4 (configurable to x2, x4) LPC bus, SMBus (system), I2C (user) |
| SEMA Board Controller | Supports: Voltage/Current monitoring, Power Sequence debug support, AT/ATX mode control, Logistics and Forensic information, Flat Panel Control, General Purpose I2C, Failsafe BIOS (dual BIOS), Watchdog Timer and Fan Control |
| Debug Headers |
40-pin multipurpose flat cable connector for use with DB-40 debug module providing BIOS POST code LED, BMC access, SPI BIOS flashing, power testpoints, debug LEDs 60-pin XDP header for ICE debug of CPU/chipset |
|
Video |
|
| GPU Feature Support |
Intel® Generation 9 LP Graphics Core Architecture, supporting 3 independent and simultaneous display combinations of DisplayPort/HDMI/LVDS or eDP outputs Hardware encode/transcode HD content (including HEVC DirectX 12, DirectX 11.2, DirectX 11.1, DirectX 11, DirectX 10.1, DirectX 10, DirectX 9 support OpenGL 5.0, 4.4/4.3 and ES 2.0 support OpenCL 2.1, 2.0/1.2 support |
| Digital Display Interface | DDI1/2 supporting DisplayPort/HDMI/DVI |
| LVDS | Single/dual channel 18/24-bit LVDS from eDP-to-LVDS IC |
| eDP | 4 lane support optional, in place of LVDS |
|
Audio |
|
| Chipset | Intel® HD Audio integrated in SoC |
| Audio Codec | On carrier Express-BASE6 (ALC886 standard support) |
|
Ethernet |
|
| Intel® MAC/PHY | I219LM with AMT 11.0 support |
| Interface | 10/100/1000 GbE connection |
|
I/O Interfaces |
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| USB | 4x USB 1.1/2.0/3.0 (USB 0,1,2,3) and 4x USB 1.1/2.0 (USB 4,5,6,7) |
| SATA | Up to three ports SATA 6 Gb/s (SATA 0,1,2; Core™ i3/Celeron® support two ports only) |
| Serial | 2 UART ports with console redirection |
| GPIO/SD | 4 GPO and 4 GPI from BMC (GPI with interrupt TBD) |
| Super I/O | Supported on carrier if needed (standard support for W83627DHG-P) |
|
TPM |
|
| Chipset | Atmel AT97SC3204 |
| Type | TPM 1.2 |
|
Power |
|
| Standard Input | ATX = 12V±5% / 5Vsb ±5% or AT = 12V±5% |
| Wide Input | ATX = 5-20V / 5Vsb ±5% or AT = 5-20V |
| Management | ACPI 5.0 compliant, Smart Battery support |
| Power States | C1-C6, S0, S1, S3, S4, S5 , S5 ECO mode (Wake on USB S3/S4, WOL S3/S4/S5) |
| ECO mode | support deep S5 mode for power saving |
|
Other |
|
| Form Factor | PICMG COM.0 Rev 2.1 Type 6 |
| Dimension | Compact size: 95 mm x 95 mm |
| Operating Systems |
Standard Support: Windows 7 32/64-bit, Windows 8.1 64-bit, Linux 64-bit Extended Support (BSP): WES7 32/64-bit, Linux 64-bit |
|
Environmental and physical specifications |
|
| Operating Temperature |
Standard: 0°C to 60°C Extreme Rugged™: -40°C to +85°C (optional) |
| Humidity |
5-90% RH operating, non-condensing 5-95% RH storage (and operating with conformal coating) |
| Shock and Vibration |
IEC 60068-2-64 and IEC-60068-2-27 MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D |
| HALT | Thermal Stress, Vibration Stress, Thermal Shock and Combined Test |
| Model | Description |
| cExpress-SL-i5-6300U | Compact COM Express Type 6 module with Intel i5-6300U with GT2 level graphics |
| cExpress-SL-i3-6100U | Compact COM Express Type 6 module with Intel i3-6100U with GT2 level graphics |
| cExpress-SL-i7-6600U | Compact COM Express Type 6 module with Intel i7-6600U with GT2 level graphics |
| cExpress-SL-3955U | Compact COM Express Type 6 module with Intel Celeron® 3955U and GT1 graphics |
| Accessories | |
| THS-cSL-B | Low profile heatsink for cExpress-SL with threaded standoffs for bottom mounting |
| HTS-cSL-B | Heatspreader for cExpress-SL with threaded standoffs for bottom mounting |
| HTS-cSL-BT | Heatspreader for cExpress-SL with through hole standoffs for top mounting |
| THS-cSL-BT | Low profile heatsink for cExpress-SL with through hole standoffs for top mounting |
| THSF-cSL-B | High profile heatsink with Fan for cExpress-SL with threaded standoffs for bottom mounting |
| THSH-cSL-B | High profile heatsink for cExpress-SL with threaded standoffs for bottom mounting |
| COM Express Type 6 Starter Kit Plus | Starter kit for cExpress-SL |
