These compact, low-power, and powerful COM Express modules are suitable for powering a wide range of embedded applications. Additionally, to support real-world applications subject to temperature extremes these modules are rated for operation over enhanced (-20 to +71 °C) and extended (-40 to +85 °C) temperature ranges.
Each Diamond COM Express module integrates a complete set of PC-compatible functions, including a low-power, high-performance Intel processor and from 1GB to 4GB of soldered-on or SO-DIMM system memory. In addition, the modules provides interface controllers for high-resolution displays, gigabit Ethernet, and SATA storage devices, as well as multiple USB 2.0, parallel, digital I/O, and audio ports.
By plugging these powerful, plug-and-play COMs into standard or custom application baseboards, OEMs can reduce development costs, minimize design risks, and shorten time-to-revenue while benefiting from the latest embedded technologies.