Express-HLE

COM Express Basic Size Type 6 Module with 4th Generation Intel Core i7/i5/i3 Processor with ECC memory (codename: Haswell)
  • Details
  • Specification
  • Order information
  • 4th Generation Intel® i7/i5/i3 Processor with Mobile Intel® QM87 Express Chipset
  • Dual channel 1600/1333 MHz DDR3L up to 16GB with ECC support in dual SODIMM sockets
  • Seven PCIe x1, one PCIe x16
  • Extreme Rugged™ operating temperature: -40°C to +85°C (optional)

The Express-HLE is a COM Express COM.0 R2.1 Type 6 module supporting the 64-bit 4th Generation Intel Core i7/i5/3 processor with CPU (formerly codenamed Haswell), memory controller, and graphics processor on the same chip. Based on the latest Mobile Intel QM87 Express chipset, the Express-HLE is specifically designed for customers who need high-level processing and graphics performance in a long product life solution.

The Express-HLE features the Intel Core i7/i5/i3 processor supporting Intels Hyper-Threading Technology (up to 4 cores, 8 threads) and DDR3 dual-channel memory at 1333/1600 MHz to provide excellent overall performance with ECC memory supported. Intel Flexible Display Interface and Direct Media Interface provide high speed connectivity to the Intel QM77 Express chipset.

Integrated Intel Generation 7.5 includes features such as OpenGL 3.1, DirectX11, Intel Clear Video HD Technology, Advanced Scheduler 2.0, 1.0, XPDM support, and DirectX Video Acceleration (DXVA) support for full AVC/VC1/MPEG2 hardware decode. Graphics outputs include VGA, LVDS and three DDI ports supporting HDMI / DVI / DisplayPort. The Express-HLE is specifically designed for customers with high-performance processing graphics requirements who want to outsource the custom core logic of their systems for reduced development time.

The Express-HLE has dual stacked SODIMM sockets for up to 16 GB DDR3 memory. The Intel Mobile QM87 Express chipset integrates VGA and dual-channel 18/24-bit LVDS display output. In addition to the onboard integrated graphics, a multiplexed PCI Express? x16 Graphics bus is available for discrete graphics expansion or general purpose x8 or x4 PCI Express connectivity.

The Express-HLE features a single onboard Gigabit Ethernet port, four USB 3.0 ports and four USB 2.0 ports, and 4 SATA 6 Gb/s ports. Support is provided for SMBus and I2C. The module is equipped with SPI AMI EFI BIOS with CMOS backup, supporting embedded features such as remote console, CMOS backup, hardware monitor, and watchdog timer.

The ADLINK Express-HLE computer-on-module with built-in SEMA Cloud functionality is ready-made for Internet of Things (IoT) applications. The Express-HLE is able to connect legacy industrial devices and other IoT systems to the cloud, extract raw data from these devices, determine which data to save locally and which to send to the cloud for further analysis. The results these analyses can provide valuable information for policy decision making and generate innovative business opportunities.

  • Show more
Technical specifications

Core System

CPU 4th Generation Intel® Core™ i7 Processors (Mobile) - 22nm (also known as “Haswell” Platform)
i7-4700EQ 2.4 GHz (3.4 GHz Turbo), 47W (4C/GT2)
i5-4400E 2.7 GHz (3.3 GHz Turbo), 37W (2C/GT2)
i5-4402E 1.6 GHz (2.7 GHz Turbo), 25W (2C/GT2)
i3-4100E 2.4 GHz (no Turbo) 3MB, 37W (2C/GT2)
i3-4102E 1.6 GHz (no Turbo) 3MB, 25W (2C/GT2)
i7-4860EQ 2.4 GHz (3.2 GHz Turbo), 47W (4C/GT3)
Celeron® 2000E 2.2 GHz (no Turbo) 35W (2C/GT1)
Celeron® 2002E 1.5 GHz (no Turbo) 25W (2C/GT1)

Supports: Intel® VT, Intel® TXT, Intel® SSE4.2, Intel® HT Technology, Intel® 64 Architecture, Execute Disable Bit, Intel® Turbo Boost Technology 2.0, Intel® AVX2, Intel® AES-NI, PCLMULQDQ Instruction, Intel® Secure Key and Intel® TSX.

Note: Availability of the features may vary between processor SKUs.
Memory Dual channel with ECC 1600/1333 MHz DDR3L memory up to 16GB in dual SODIMM socket
Embedded BIOS AMI EFI with CMOS backup in 8MB SPI BIOS with Intel® AMT 9.0 support
L3 Cache 6MB for i7-4700EQ, 3MB for i5-4400E, i5-4402E, i3-4100E and i3-4102E
Expansion Busses PCI Express x16 (Gen3) or PCI Express (2 x8 or 1 x8 with 2 x4)
6 PCI Express x1 (AB): lanes 0/1/2/3/4/5
1 PCI Express x1 (CD): lane 6
LPC bus, SMBus (system) , I2C (user)
SEMA Board Controller Supports: Voltage/Current monitoring, Power Sequence debug support, AT/ATX mode control, Logistics and Forensic information, Flat Panel Control, General Purpose I2C, Failsafe BIOS (dual BIOS), Watchdog Timer and Fan Control
Debug Headers 40-pin multipurpose flat cable connector
Use in combination with DB-40 debug module
Providing BIOS POST code LED, BMC access, SPI BIOS flashing, Power Testpoints, Debug LEDs
60-pin XDP header for ICE debug of CPU/chipset

Video

GPU Feature Support Generation 7.5 graphics core architecture, supporting 3 independent and simultaneous display combinations of DisplayPort /HDMI / LVDS monitors
Encode/transcode HD content
Digital Display Interface DDI1 supporting DisplayPort / HDMI / DVI
DDI2 supporting DisplayPort / HDMI / DVI
DDI3 supporting DisplayPort / HDMI / DVI
VGA Analog VGA support with 300 MHz DAC
Analog monitor support up to QXGA (2048 x 1536)
LVDS Single/dual channel 18/24-bit LVDS from eDP (two lanes)

Audio

Chipset Intel® HD Audio integrated in chipset
Audio Codec Located on carrier Express-BASE6 (ALC886 standard supported)

Ethernet

Intel® MAC/PHY I217LM (Enterprise SKU) with AMT 9.0 support
Interface 10/100/1000 GbE connection

I/O Interfaces

USB 4x USB 3.0 (USB 0,1,2,3)
4x USB 2.0 (USB 4,5,6,7)
SATA Four ports SATA 6Gb/s (SATA0, SATA1, SATA2, SATA3)
Serial 2 UART ports COM1/2 with console redirection
GPIO 4 GPO and 4 GPI with interrupt
Super I/O Standard support for W83627DHG-P
Supported on carrier if needed

TPM

Chipset Atmel AT97SC3204
Type TPM 1.2

Power

Standard Input ATX = 12V±5% / 5Vsb ±5% or AT = 12V ±5%
Wide Input ATX = 8.5~20 V / 5Vsb ±5% or AT = 8.5~20V
Management ACPI 4.0 compliant, Smart Battery support
Power States C1-C6, S0, S1, S4, S3, S5 , S5 ECO mode (Wake on USB S3/S4, WOL S3/S4/S5)
ECO mode Supports deep S5 mode for power saving

Other

Form Factor PICMG COM.0: Rev 2.1 Type 6
Dimension Basic size: 125 mm x 95 mm
Operating Systems Standard Support: Windows 7/8 32/64-bit, Linux 32/64-bit
Extended Support (BSP): WES7/8, Linux , VxWorks, QNX

Environmental and physical specifications

Operating Temperature Standard: 0°C to 60°C
Extreme Rugged™: -40°C to +85°C (optional)
Humidity 5-90% RH operating, non-condensing
5-95% RH storage (and operating with conformal coating)
Shock and Vibration IEC 60068-2-64 and IEC-60068-2-27
MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D
HALT Thermal Stress, Vibration Stress, Thermal Shock and Combined Test
  • Show more
Model Description
Express-HLE-i7-4860EQ COM Express® Basic Size Type 6 Module with Intel® Core™ i7-4860EQ at 2.4GHz with GT3 level graphics and ECC
Express-HLE-i7-4700EQ COM Express® Basic Size Type 6 Module with Intel® Core™ i7-4700EQ at 2.4/1.7 GHz with GT2 level graphics and ECC
Express-HLE-i5-4400E COM Express® Basic Size Type 6 Module with Intel® Core™ i5-4400E at 2.7 GHz with GT2 level graphics and ECC
Express-HLE-i3-4100E COM Express® Basic Size Type 6 Module with Intel® Core™ i3-4100E at 2.4 GHz with GT2 level graphics and ECC
Express-HLE-i5-4402E COM Express® Basic Size Type 6 Module with Intel® Core™ i5-4402E at 1.6 GHz with GT2 level graphics and ECC
Express-HLE-i3-4102E COM Express® Basic Size Type 6 Module with Intel® Core™ i3-4102E at 1.6 GHz with GT2 level graphics and ECC
Express-HLE-2000E COM Express® Basic Size Type 6 Module with Celeron® 2000E 2.2 GHz (no Turbo) 35W (2C/GT1) with ECC
Express-HLE-2002E COM Express® Basic Size Type 6 Module with Celeron® 2002E 1.5 GHz (no Turbo) 25W (2C/GT1) with ECC
Accessory
HTS-HL-B Heatspreader for Express-HL with threaded standoffs for bottom mounting
HTS-HL-BT Heatspreader for Express-HL with through hole standoffs for top mounting
THS-HL-BL Low profile heatsink for Express-HL with threaded standoffs for bottom mounting
THS-HL-BLT Low profile heatsink for Express-HL with through hole standoffs for top mounting
THSH-HL-BL High profile heatsink for Express-HL with threaded standoffs for bottom mounting
THSF-HL-BL High profile heatsink with Fan for Express-HL with threaded standoffs for bottom mounting
COM Express Type 6 Starter Kit Plus COM Express Type 6 Starter Kit Plus for Eexpress-HLE


  • Show more
Login / Registration
укажите почту
введите пароль
Forgot password?
CAPTCHA
Loading data...
Subscribe to newsletter
specify your contacts