Express-IB

COM Express® Basic Size Type 6 Module with 3rd Generation Intel® Core™ i7/i5/i3 Processor
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  • Specification
  • Order information
  • Quad/dual core 3rd Generation Intel® Core™ i7/i5/i3 Processor with Mobile Intel® QM77 Express Chipset
  • Up to 16GB Dual Channel DDR3 SDRAM at 1600MHz
  • Seven PCIe x1, one PCIe x16 (Gen3) for graphics (or general purpose x8/4/1)
  • Operating Temperature Standard: 0°C to +60°C

The Express-IB is a high performance COM.0 R2.0 Type 6 module featuring an Intel® Core™ i7/i5/i3 processor supporting Intel® HD Graphics integrated on the CPU with three independent displays. A PCI Express x16 Generation 3.0 bus is available for discrete graphics expansion or general purpose PCIe (optionally configure as 2 x8 or 1 x8 + 2 x4).

The Express-IB targets applications in Government, Military, Medical, Digital Signage and Communications and is ideal for customers with advanced processing performance and graphics requirements looking to reduce development time by outsourcing the base design of their system and focusing on application functionality. The Express-IB supports Intel® Advance Vector Extensions (Intel® AVX v1.0), with its improved Floating Point Intensive Applications, and also offers the benefits of increased bandwidth provided by USB 3.0.

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Technical specifications

Core System

CPU 3rd Generation Intel® Core™ i7/i5/i3, 22nm process, BGA type
Intel® Core™ i7-3615QE 2.3GHz, 6MB L3 cache, 45W (4C)
Intel® Core™ i7-3612QE 2.1GHz, 6MB L3 cache, 35W (4C)
Intel® Core™ i7-3555LE 2.5GHz, 4MB L3 cache, 25W (2C)
Intel® Core™ i7-3517UE 1.7GHz, 4MB L3 cache, 17W (2C)
Intel® Core™ i5-3610ME 2.7GHz, 3MB L3 cache, 35W (2C)
Intel® Core™ i3-3120ME 2.4GHz, 3MB L3 cache, 35W (2C)
Intel® Core™ i3-3217UE 1.6GHz, 3MB L3 cache, 17W (2C)
Intel® Celeron® 1020E 2.2 GHz (no Turbo) 35W (2C)
Intel® Celeron® 1047UE 1.4 GHz (no Turbo) 17W (2C)
Intel® Celeron® 927UE 1.5 GHz (no Turbo) 17W (1C)
Memory Dual channel 1333/1600 MHz DDR3 non-ECC memory up to 16GB in dual stacked SODIMM socket
Chipset Mobile Intel® QM77 Express Chipset
L3 Cache 6MB (i7-3615QE and i7-3612QE), 4MB (i7-3555LE and i7-3517UE), 3MB (i5-3610ME, i3-3120ME and i3-3217UE)
BIOS AMI EFI with CMOS backup in 16 Mbit SPI flash
Hardware Monitor Supply voltages and CPU temperature
Debug Interface XDP SFF-26 extension for ICE debug
Watchdog Timer Programmable timer range to generate RESET
Expansion Busses PCI Express x16 (Gen3) bus for discrete graphics solution or general purpose PCI Express (2 x8 or 1 x8 with 2 x4)
8 PCI Express x1: Lanes 0/1/2/3/4/5/6 are free, lane 7 is occupied by GbE
LPC bus, SMBus (system) , I2C (user)

Video

Integrated in Processor Intel® HD Graphics 4000 at 650–1200 MHz (depending on processor)
Integrated Video DirectX 11, OpenGL 3.1, OpenCL 1.1
Feature Support Intel® Clear Video HD Technology
Advanced Scheduler 2.0, 1.0, XPDM support
DirectX Video Acceleration (DXVA) support for full AVC/VC1/MPEG2 hardware decode
VGA Interface Analog VGA support with 300 MHz DAC
Analog monitor support up to QXGA (2048 x 1536) and VGA hot plug
LVDS Interface Dual channel 18/24-bit LVDS
Digital Display Interface Three DDI ports supporting HDMI/DVI/DisplayPort or SDVO

Audio

Chipset Integrated in Mobile Intel® QM77 PCH
Audio Codec On Express-BASE6 carrier (ALC886)

Ethernet

Chipset Intel® Gigabit Ethernet PHY WG82579LM
Interface 10/100/1000 Mbps Ethernet

I/O Interfaces

Chipset Integrated in Mobile Intel® QM77 PCH
USB 4 ports USB 3.0 (USB0~3) and 4 ports USB 2.0 (USB4~7)
SATA Supports two SATA ports at 6 Gb/s and two ports at 3 Gb/s with support for RAID 0,1,5,10
Super I/O Connected to LPC bus on carrier if needed

TPM (optional)

Chipset Infineon SLB9635TT1.2
Type TPM 1.2

Power

Input Power 8.5~20V only (AT), 8.5~20V and 5Vsb (ATX)
Power States Supports S0, S1, S3, S4, S5
Smart Battery Support Yes
Power Consumption 40W with i7-3612QE and 4GB memory typical

Other

Form Factor PICMG COM.0: Rev 2.1 Type 6
Compatibility COM Express Type 6, Basic form factor 125mm x 95mm
Dimension Basic size: 125 mm x 95 mm
Operating Systems Standard Support: Windows 7, Linux
Extended Support (BSP): Embedded XP support package, Linux BSP, VxWorks 6.x, AIDI Library for Windows and Linux

Environmental and physical specifications

Operating Temperature Standard: 0°C to +60°C
Storage Temperature -20°C to +80°C
Humidity 90% at +60°C
Shock 15G peak-to-peak, 11ms duration, non-operating
Vibration Non-operating: 1.88Grms, 5-500Hz, each axis
Operating: 0.5Grms, 5-500Hz, each axis
Certification CE, FCC, HALT
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Model Description
Express-IB-i7-3615QE COM Express® Basic Size Type 6 Module with Intel® Core™ i7-3615QE SV at 2.3 GHz
Express-IB-i7-3612QE COM Express® Basic Size Type 6 Module with Intel® Core™ i7-3612QE SV at 2.1 GHz
Express-IB-i7-3555LE COM Express® Basic Size Type 6 Module with Intel® Core™ i7-3555LE LV at 2.5 GHz
Express-IB-i7-3517UE COM ExpressR Basic Size Type 6 Module with Intel® Core™ i7-3517UE ULV at 1.7 GHz
Express-IB-i5-3610ME COM Express® Basic Size Type 6 Module with Intel® Core™ i5-3610ME SV 2.7 GHz
Express-IB-i3-3120ME COM Express® Basic Size Type 6 Module with Intel® Core™ i3-3120ME SV at 2.4 GHz
Express-IB-i3-3217UE COM Express® Basic Size Type 6 Module with Intel® Core™ i3-3217UE ULV at 1.6 GHz
Express-IB-1020E COM Express® Basic Size Type 6 Module with Intel® Celeron® 1020E at 2.2GHz
Express-IB-1047UE COM Express® Basic Size Type 6 Module with Intel® Celeron® 1047UE 1.4 GHz
Express-IB-927UE COM Express® Basic Size Type 6 Module with Intel7reg; Celeron® 927UE 1.5 GHz
Accessory
THSH-IB-B High Profile Heatsink for Express-IB with threaded standoffs
HTS-IB-B Heatspreader for Express-IB with threaded standoffs
THSF-IB-B High Performance Heatsink with Fan for Express-IB 2C with threaded standoffs
THS-IB-BL Low profile hearsink for Express-IB for bottom mounting
HTS-IB-BT Heatspreader for Express-IB with through hole for top mounting


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