Express-IBE2

COM Express® Basic Size Type 2 Module with Intel® Core™ i7/i5/i3 Processor
  • Details
  • Specification
  • Order information
  • Quad/dual-core Intel® Core™ i7/i5/i3 Processor with Mobile Intel® QM77 Express Chipset
  • Up to 16GB Dual Channel DDR3 SDRAM at 1600MHz with ECC memory
  • Five PCIe x1, one PCIe x16 (Gen3) for graphics (or general purpose x8/4/1)
  • Extreme Rugged™ operating temperature: -40°C to +85°C (optional)

The Module Computing Product Segment (MCPS) is pleased to introduce its latest COM Express® Type 2 Module with Intel® Core™ i7/i5/i3 Processor and QM77 Chipset, the Express-IBE2.

The Express-IBE2 is a COM Express® COM.0 R2.1 Type 2 module with a 3rd Generation Intel® Core™ i7/i5/3 processor and support for error-correcting code (ECC) memory.

Based on the latest Mobile Intel® QM77 Express Chipset, the Express-IBE2 is specifically designed for customers who need a highly reliable platform and/or continued support for PCI-bus and PATA IDE in a long product life solution.

The Express-IBE2 features the Intel® Core™ i7/i5/i3 processor supporting Intel® Hyper-Threading Technology (up to 4 cores, 8 threads) and DDR3 dual-channel memory at 1066/1333/1600 MHz with error-correcting code (ECC). Integrated HD Graphics 4000 includes features such as OpenGL 3.1, DirectX11, Intel® Clear Video HD Technology, Advanced Scheduler 2.0, 1.0, XPDM support, and DirectX Video Acceleration (DXVA) support for full AVC/VC1/MPEG2 hardware decode. Graphics outputs include VGA, LVDS and SDVO.

In addition to the onboard integrated graphics, a multiplexed PCI Express® x16 Graphics bus is available for discrete graphics expansion or general purpose x8 or x4 PCI Express® connectivity. The Express-IBE2 features a single onboard Gigabit Ethernet port, eights USB 2.0 ports, two SATA 6 Gb/s ports, two SATA 3 Gb/s ports and one PATA IDE port. Support is provided for SMBus and I2C.

The module is equipped with an SPI AMI EFI BIOS and supports SEMA (Smart Embedded Management Agent). SEMA functionality is consistent over ADLINK"s whole COM product line and provides the following embedded features : BIOS failsafe, voltage/current/temperature monitoring, power sequence control and monitoring, watchdog control, board info and statistics. SEMA comes with extensive software and library support for Windows, Linux, VxWorks and QNX.

The ADLINK Express-IBE2 computer-on-module with built-in SEMA Cloud functionality is ready-made for Internet of Things (IoT) applications. The Express-IBE2 is able to connect legacy industrial devices and other IoT systems to the cloud, extract raw data from these devices, determine which data to save locally and which to send to the cloud for further analysis. The results these analyses can provide valuable information for policy decision making and generate innovative business opportunities.

  • Show more
Technical specifications

Core System

CPU 3rd Generation Intel® “Ivy Bridge” 22nm process, BGA type
Intel® Core™ i7-3615QE 2.3GHz, 6MB L3 cache, 45W (4C)
Intel® Core™ i7-3612QE 2.1GHz, 6MB L3 cache, 35W (4C)
Intel® Core™ i7-3555LE 2.5GHz, 4MB L3 cache, 25W (2C)
Intel® Core™ i7-3517UE 1.7GHz, 4MB L3 cache, 17W (2C)
Intel® Core™ i5-3610ME 2.7GHz, 3MB L3 cache, 35W (2C)
Intel® Core™ i3-3120ME 2.4GHz, 3MB L3 cache, 35W (2C)
Intel® Core™ i3-3217UE 1.6GHz, 3MB L3 cache, 17W (2C)
Intel® Celeron® 1020E 2.2 GHz (no Turbo) 35W (2C)
Intel® Celeron® 1047UE 1.4 GHz (no Turbo) 17W (2C)
Intel® Celeron® 927UE 1.5 GHz (no Turbo) 17W (1C)
Memory Dual channel 1333/1600 MHz DDR3 memory with ECC
support up to 16GB in dual stacked SODIMM socket
Chipset Intel® Mobile QM77 Express Chipset
L3 Cache 6MB (i7-3615QE and i7-3612QE), 4MB (i7-3555LE and i7-3517UE), 3MB (i5-3610ME, i3-3120ME and i3-3217UE)
BIOS AMI EFI with CMOS backup in 16 Mbit SPI flash
Hardware Monitor Supply voltages and CPU temperature
Debug Interface XDP SFF-26 extension for ICE debug
Watchdog Timer Programmable timer range to generate RESET
Expansion Busses PCI Express x16 (Gen3) bus for discrete graphics solution or general purpose PCI Express (2 x8 or 1 x8 with 2 x4)
5 PCI Express x1: Lanes 0/1/2/3/4 are free, lane 5 is occupied by PATA, lane 6 is occupied by PCI bus and lane 7 is occupied by GbE
LPC bus, SMBus (system) , I2C (user)
SEMA BMC Voltage and Current Monitoring, Flat Panel Control, I2C bus 100/200/400, Failsafe Dual BIOS, Module Logistics, Runtime information, User Flash Area, Power Control, and ECO mode support

Video

Integrated in Processor Intel® HD Graphics 4000 at 650–1200 MHz (depending on processor)
Integrated Video DirectX 11, OpenGL 3.1, OpenCL 1.1
Feature Support Intel® Clear Video HD Technology
Advanced Scheduler 2.0, 1.0, XPDM support
DirectX Video Acceleration (DXVA) support for full AVC/VC1/MPEG2 hardware decode
VGA Analog VGA support with 300 MHz DAC
Analog monitor support up to QXGA (2048 x 1536) and VGA hot plug
LVDS Single/dual channel 18/24-bit LVDS
SDVO SDVO multiplexed with PCIe x16 lane 0-7

Audio

Chipset Integrated in Intel® PCH QM77
Audio Codec On Express-BASE carrier (ALC886)

Ethernet

Chipset Intel® Gigabit Ethernet PHY WG82579LM
Interface 10/100/1000 Mbps Ethernet

I/O Interfaces

Chipset Integrated in Mobile Intel® QM77
USB 8 ports USB 2.0 (USB0~7)
SATA Supports two SATA ports at 6 Gb/s and two ports at 3 Gb/s with support for RAID 0,1,5,10
IDE (PATA) SATA to PATA bridge on SATA channel 1, Master only
Super I/O Connected to LPC bus on carrier if needed

TPM (optional)

Chipset Atmel AT97SC3209
Type TPM 1.2

Power

Input Power AT mode (12 V +/- 5%) and ATX mode (12 V and 5 Vsb +/- 5%)
Power States Supports S0, S1, S3, S4, S5
Smart Battery Support Yes
Power Consumption 43W with i7-3612QE and 8GB memory typical

Other

Compatibility COM Express® Type 2, Basic form factor 125mm x 95mm
Dimension Basic size: 125 mm x 95 mm
Operating Systems Standard Support: Windows 7, Linux
Extended Support (BSP): Embedded XP support package, Linux BSP, VxWorks 6.x, AIDI Library for Windows and Linux

Environmental and physical specifications

Operating Temperature Standard: 0°C to +60°C
Extreme Rugged™: -40°C to +85°C (optional)
Storage Temperature -20°C to +80°C
Humidity 90% at +60°C
Shock 15G peak-to-peak, 11ms duration, non-operating
Vibration Non-operating: 1.88Grms, 5-500Hz, each axis
Operating: 0.5Grms, 5-500Hz, each axis
Certification CE, FCC, HALT
  • Show more
Model Description
Express-IBE2-i7-3615QE COM Express® Basic Size Type 2 Module with Intel® Core™ i7-3615QE SV at 2.3 GHz
Express-IBE2-i7-3612QE COM Express® Basic Size Type 2 Module with Intel® Core™ i7-3612QE SV at 2.1 GHz
Express-IBE2-i7-3555LE COM Express® Basic Size Type 2 Module with Intel® Core™ i7-3555LE LV at 2.5 GHz
Express-IBE2-i7-3517UE COM Express® Basic Size Type 2 Module with Intel® Core™ i7-3517UE ULV at 1.7 GHz
Express-IBE2-i5-3610ME COM Express® Basic Size Type 2 Module with Intel® Core™ i5-3610ME SV 2.7 GHz
Express-IBE2-i3-3120ME COM Express® Basic Size Type 2 Module with Intel® Core™ i3-3120ME SV at 2.4 GHz
Express-IBE2-i3-3217UE COM Express® Basic Size Type 2 Module with Intel® Core™ i3-3217UE ULV at 1.6 GHz
Express-IBE2-1020E COM Express® Basic Size Type 2 Module with Intel® Celeron® 1020E at 2.2GHz
Express-IBE2-1047UE COM Express® Basic Size Type 2 Module with Inte® Celeron® 1047UE 1.4 GHz
Express-IBE2-927UE COM Express® Basic Size Type 2 Module with Intel® Celeron® 927UE 1.5 GHz
Accessory
HTS-IBE2-B Heatspreader for Express-IBE2 for bottom mounting
THS-IBE2-BL Low Profile Heatsink for Express-IBE2 for bottom mounting
THSH-IBE2-BL High Profile Heatsink for Express-IBE2 for bottom mounting
THSF-IBE2-BL High Performance Heatsink with Fan for Express-IBE2 for bottom mountning


  • Show more
Login / Registration
укажите почту
введите пароль
Forgot password?
CAPTCHA
Loading data...
Subscribe to newsletter
specify your contacts