Express-SL/SLE

COM Express Basic Size Type 6 Module with 6th Gen Intel Core, Xeon and Celeron Processors (codename: Skylake)
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  • 6th Gen Intel Core, Xeon and Celeron Processor with Intel QM170/HM170/CM236 Chipset (codename: Skylake)
  • Up to 32GB dual channel ECC or non-ECC DDR4 at 2133 MHz
  • 8 PCIe x1 and 1 PCIe x16
  • Extreme Rugged operating temperature: -40°C to +85°C (opt.)

ADLINK's COM Express computer-on-module (COM) offerings include the cExpress-SL and Express-SL in PICMG COM.0 Type 6 Compact and Basic Size form factors, respectively. Both Basic and Compact size modules are available with 6th generation Intel® Core™ i7, i5 or i3 processors and accompanying Intel® QM170 and HM170 Chipset. ECC memory is supported by models utilizing the Intel® Xeon® processor E3-15XX v5 family and Intel® CM236 chipset. DDR4 memory is supported up to a total of 32GB, with a lower voltage compared to DDR3 resulting in a reduction in overall power consumption and heat dissipation. These new COMs also provide support for three independent UHD/4K displays and are well-suited for applications in automation, medical, and infotainment, with extended operating temperature range optionally available for transportation and defense applications.

The ADLINK Express-SL/SLE computer-on-module with built-in SEMA Cloud functionality is ready-made for Internet of Things (IoT) applications. The Express-SL/SLE is able to connect legacy industrial devices and other IoT systems to the cloud, extract raw data from these devices, determine which data to save locally and which to send to the cloud for further analysis. The results these analyses can provide valuable information for policy decision making and generate innovative business opportunities.

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Technical specifications

Core System

CPU Mobile 6th Generation Intel® Xeon® and Core™ Processors - 14nm (formerly “Skylake-H”)
Xeon® E3-1515M v5 2.8/3.7GHz (Turbo), 0.35-1.0GHz (Graphics), 8MB, 45W(35W cTDP) (4C/GT4e)
Xeon® E3-1505M v5 2.8/3.7GHz (Turbo), 0.35-1.0GHz (Graphics), 8M, 45/35W (cTDP) (4C/GT2)
Xeon® E3-1505L v5 2.0/2.8GHz (Turbo), 0.35-1.0GHz (Graphics), 8M, 25W (4C/GT2)
Core™ i7-6820EQ 2.8/3.5GHz (Turbo), 0.35-1.0GHz (Graphics), 8M, 45/35W (cTDP) (4C/GT2)
Core™ i7-6822EQ 2.0/2.8GHz (Turbo), 0.35-1.0GHz (Graphics), 8M, 25W (4C/GT2)
Core™ i5-6440EQ 2.7/3.4GHz (Turbo), 0.35-1.0GHz (Graphics), 6M, 45/35W (cTDP) (4C/GT2)
Core™ i5-6442EQ 1.9/2.7GHz (Turbo), 0.35-1.0GHz (Graphics), 6M, 25W (4C/GT2)
Core™ i3-6100E 2.7GHz, 0.35-0.95GHz (Graphics), 3M, 35W (2C/GT2)
Core™ i3-6102E 1.9GHz, 0.35-0.95GHz (Graphics), 3M, 25W (2C/GT2)
Celeron® G3900E 2.4GHz, 0.35-0.95GHz(Graphics), 2MB, 35W (2C/GT1) Celeron® G3902E 1.6GHz, 0.35-0.95GHz(Graphics), 2MB, 25W (2C/GT1)

Supports: Intel® VT, Intel® TXT, Intel® SSE4.2, Intel® HT Technology, Intel® 64 Architecture, Execute Disable Bit, Intel® Turbo Boost Technology 2.0, Intel® AVX2, Intel® AES-NI, PCLMULQDQ Instruction, Intel® Secure Key and Intel® TSX.

Note: Availability of the features may vary between processor SKUs.
Memory Dual channel 1867/2133 MHz DDR4 memory up to 32GB in dual SODIMM sockets
(ECC/non-ECC support dependent on selected CPU/PCH)
Embedded BIOS AMI EFI with CMOS backup in 16MB SPI BIOS with Intel® AMT 11.0 support
Cache 8MB for Xeon® and Core™ i7, 6MB for Core™ i5, 3MB for Core™ i3, 2MB for Celeron®
PCH CM236 (supports ECC memory, Intel® AMT)
QM170 (supports non-ECC memory, Intel® AMT)
HM170 (supports non-ECC memory, no Intel® AMT support)
Expansion Busses PCIe x16 or 2 PCIe x8 or 1 PCIe x8 with 2 PCIe x4 (Gen3)
6 PCI Express x1 (Gen3); AB connector, Lanes 0/1/2/3/4/5
2 PCI Express x2 (Gen3): CD connector, Lanes 6/7
LPC bus, SMBus (system) , I2C (user)
SEMA Board Controller Supports: Voltage/Current monitoring, Power Sequence debug support, AT/ATX mode control, Logistics and Forensic information, Flat Panel Control, General Purpose I2C, Failsafe BIOS (dual BIOS), Watchdog Timer and Fan Control
Debug Headers 40-pin multipurpose flat cable connector for use with DB-40 debug module providing BIOS POST code LED, BMC access, SPI BIOS flashing, power testpoints, debug LEDs
60-pin XDP header for ICE debug of CPU/chipset

Video

GPU Feature Support Intel® Generation 9 LP Graphics Core Architecture, supporting 3 independent and simultaneous display combinations of DisplayPort/HDMI/LVDS or eDP outputs Hardware encode/transcode HD content (including HEVC) DirectX 12, DirectX 11.2, DirectX 11.1, DirectX 11, DirectX 10.1, DirectX 10, DirectX 9 support OpenGL 4.4/4.3 and ES 2.0 support OpenCL 2.1, 2.0/1.2 support
Digital Display Interface DDI1/2/3 supporting DisplayPort/HDMI/DVI
VGA Analog VGA support with 300 MHz DAC
Analog monitor support up to QXGA (2048 x 1536)
LVDS Single/dual channel 18/24-bit LVDS from eDP-to-LVDS IC
eDP 4 lane support optional, in place of LVDS

Audio

Chipset Intel® HD Audio integrated in chipset
Audio Codec Located on carrier Express-BASE6 (ALC886 standard supported)

Ethernet

Intel® MAC/PHY I219LM with AMT 11.0 support
Interface 10/100/1000 GbE connection

I/O Interfaces

USB 4x USB v. 3.0 (USB 0,1,2,3) and 4x USB 2.0 (USB 4,5,6,7)
SATA Four ports SATA 6Gb/s (SATA0,1,2,3)
Serial 2 UART ports with console redirection
GPIO 4 GPO and 4 GPI
Super I/O Supported on carrier if needed (standard support for W83627DHG-P)

TPM

Chipset Atmel AT97SC3204
Type TPM1.2/2.0 (TPM 2.0 release later)

Power

Standard Input ATX = 12V±5% / 5Vsb ±5% or AT = 12V±5%
Wide Input ATX = 8.5-20 V / 5Vsb ±5% or AT = 8.5 ~20V (Standard temp. only)
Management ACPI 5.0 compliant, Smart Battery support
Power States C1-C6, S0, S1, S3, S4, S5 , S5 ECO mode (Wake-on-USB S3/S4, WOL S3/S4/S5)
ECO mode Supports deep S5 mode for power saving

Other

Form Factor PICMG COM.0, Rev 2.1 Type 6
Dimension Basic size: 125 mm x 95 mm
Operating Systems Standard Support: Windows 10/8.1 64-bit, Windows 7 32/64-bit, Linux 64-bit, VxWorks (TBD)
Extended Support (BSP): WES 7 32/64-bit, Linux 64-bit, VxWorks (TBD)

Environmental and physical specifications

Operating Temperature Standard: 0°C to 60°C
Extreme Rugged: -40°C to +85°C (optional)
Humidity 5-90% RH operating, non-condensing
5-95% RH storage (and operating with conformal coating)
Shock and Vibration IEC 60068-2-64 and IEC-60068-2-27
MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D
HALT Thermal Stress, Vibration Stress, Thermal Shock and Combined Test
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Model Description
Express-SLE-E3-1515M v5 Basic COM Express Type 6 module with Intel Xeon, E3-1515M v5 and GT4e level graphics, CM236 chipset, support ECC
Express-SLE-E3-1505M v5 Basic COM Express Type 6 module with Intel Xeon, E3-1505M v5 and GT2 level graphics, CM236 chipset, support ECC
Express-SLE-E3-1505L v5 Basic COM Express Type 6 module with Intel Xeon, E3-1505L v5 and GT2 level graphics, CM236 chipset, support ECC
Express-SL-i7-6820EQ Basic COM Express Type 6 module with Intel Core, i7-6820EQ and GT2 level graphics, QM170 chipset
Express-SL-i7-6822EQ Basic COM Express Type 6 module with Intel Core, i7-6822EQ, Celeron G3900E, G3902E and Xeon 1515M and GT2 level graphics, QM170 chipset
Express-SL-i5-6440EQ Basic COM Express Type 6 module with Intel Core, i5-6440EQ and GT2 level graphics, QM170 chipset
Express-SL-i5-6442EQ Basic COM Express Type 6 module with Intel Core, i5-6442EQ and GT2 level graphics, QM170 chipset
Express-SL-i3-6100E Basic COM Express Type 6 module with Intel Core, i3-6100E and GT2 level graphics, HM170 chipset
Express-SL-i3-6102E Basic COM Express Type 6 module with Intel Core, i3-6102E and GT2 level graphics, HM170 chipset
Express-SL-G3900E Basic COM Express Type 6 module with Intel Celeron, G3900E and GT1 level graphics, HM170 chipset
Express-SL-G3902E Basic COM Express Type 6 module with Intel Celeron, G3902E and GT1 level graphics, HM170 chipset
Accessory
HTS-SL-B Heatspreader for Express-SL with threaded standoffs for bottom mounting
HTS-SL-BT Heatspreader for Express-SL with through hole standoffs for top mounting
THS-SL-BL Low profile heatsink for Express-SL with threaded standoffs for bottom mounting
THS-SL-BT Low profile heatsink for Express-SL with through hole standoffs for top mounting
THSH-SL-BL High profile heatsink for Express-SL with threaded standoffs for bottom mounting
THSF-SL-BL High profile heatsink with Fan for Express-SL with threaded standoffs for bottom mounting
COM Express Type 6 Starter Kit Plus COM Express Type 6 Starter Kit Plus


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