Back to results...

LEC-BW

SMARC Short Size Module
  • Details
  • Specification
  • Order information
* NA
Discontinued product
Please contact us for availability or replacement options


  • Dual or quad-core Intel Atom, Pentium and Celeron Processor N3000 Series SoC
  • Up to 8 GB DDR3L at 1333/1600 MT/s
  • LVDS, HDMI
  • Operating Temperature Standard: 0°C to +60°C

The SMARC ("Smart Mobility ARChitecture") is a versatile small form factor computer Module definition targeting applications that require low power, low costs, and high performance. The Modules will typically use ARM SOCs similar or the same as those used in many familiar devices such as tablet computers and smart phones. Alternative low power SOCs and CPUs, such as tablet oriented X86 devices and other RISC CPUs may be used as well. The Module power envelope is typically under 6W. 

The Modules are used as building blocks for portable and stationary embedded systems. The core CPU and support circuits, including DRAM, boot flash, power sequencing, CPU power supplies, GBE and a single channel LVDS display transmitter are concentrated on the Module. The Modules are used with application specific Carrier Boards that implement other features such as audio CODECs, touch controllers, wireless devices, etc. The modular approach allows scalability, fast time to market and upgradability while still maintaining low costs, low power and small physical size. The 

ADLINK LEC-BTS computer-on-module with built-in SEMA Cloud functionality is ready-made for Internet of Things (IoT) applications. The LEC-BTS is able to connect legacy industrial devices and other IoT systems to the cloud, extract raw data from these devices, determine which data to save locally and which to send to the cloud for further analysis. The results these analyses can provide valuable information for policy decision making and generate innovative business opportunities. To stress on its low power consumption feature, ADLINK has named SMARC products as LEC (Low Energy Computer on module) series.

Technical specifications

Core System

CPU Intel Atom x5-E8000, 4 cores
Intel Pentium N3710, 4 cores, 2.6GHz, 6W TDP
Intel Celeron N3160, 4 cores, 2.2GHz, 6W TDP
Intel Celeron N3060, 2 cores, 2.5GHz, 6W TDP
Intel Celeron N3010, 2cores, 2.2GHz, 4W TDP
Memory Up to 8 GB DDR3L at 1600 MT/s single channel, 64bit
Embedded BIOS AMI UEFI with CMOS backup in 8 MB SPI BIOS, Fast Boot support
Cache 2 MB L2 cache
SEMA Board Controller Supports: Voltage/Current monitoring, Power Sequence debug support, AT/ATX mode control, Logistics and Forensic information, Flat Panel Control, General Purpose I2C, Failsafe BIOS (dual BIOS), Watchdog Timer and Fan Control

Video

GPU Feature Support 8th generation Intel® graphics core architecture with sixteen execution units, supports three independent displays
4K video (up to 3840 x 2160 @ 30fps)
2D and 3D graphics hardware acceleration
Support for DirectX 12/11.2, OpenGL 4.2/3.3, OpenCL 1.2
Video decode HW acceleration for H.265, H.264, MPEG2, MVC, VC-1, WMV9, JPEG, VP8
Video encode HW acceleration for H.264, MVC, JPEG
LVDS Single channel 18/24-bit LVDS
HDMI HDMI (3840 x 2160 @ 30Hz)
Custom option 3rd display HDMI/DP, 2nd LVDS channel

Audio

Port Intel® HD Audio for Audio codec on carrier
Audio Codec I2S and HDA for audio codec on carrier

Ethernet

Intel® MAC/PHY 1x Intel® i211 Ethernet controller
Interface 10/100/1000 GbE

I/O Interfaces

PCIe 3x PCIe x1 Gen2
USB 1x USB 3.0 host, 2x USB 2.0 host, 1x USB 2.0 client
SATA 2x SATA3 6 Gbit/s
Flash storage 1x SDIO (4bit), 1x eMMC (8bit)
GPIO 12x GPIO
Camera 2x MIPI CSI 4L/2L
Serial 2x SPI, 4x I2C, 2x UART, 1x SMBus, 1x LPC, 1x DB40

Power

Standard Input 3.0 V ~ 5.25 V DC ±5%
Power States Supports C0-C6, S0, S3, S4, S5

Other

Form Factor SMARC Specification v1.1
Dimension SMARC short size module, 82 mm x 50 mm
Operating Systems Standard Support: Windows 7/8.1/10, Linux, Android
On request: QNX, VxWorks

Environmental and physical specifications

Operating Temperature Standard: 0°C to +60°C
Humidity 5-90% RH operating, non-condensing
5-95% RH storage (and operating with conformal coating)
Shock and Vibration IEC 60068-2-64 and IEC-60068-2-27
MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D
HALT Thermal Stress, Vibration Stress, Thermal Shock and Combined Test
Model Description
LEC‑BW43‑4G‑CT SMARC Short Size Module with Intel Atom x5-E8000, Quad core, 4 GB DDR3L, 0°C to 60°C
LEC‑BW42‑4G‑CT SMARC Short Size Module with Intel Pentium N3710, Quad core, 4 GB DDR3L, 0°C to 60°C
LEC-BW42-8G-CT SMARC Short Size Module with Intel Pentium N3710, Quad core, 8 GB DDR3L, 0°C to 60°C
LEC-BW41-4G-CT SMARC Short Size Module with Intel Celeron N3160, Quad core, 4 GB DDR3L, 0°C to 60°C
LEC‑BW21‑2G‑CT SMARC Short Size Module with Intel Celeron N3010, Dual core, 2 GB DDR3L, 0°C to 60°C
LEC-BW22-2G-CT SMARC Short Size Module with Intel Celeron N3060, Dual core, 2 GB DDR3L, 0°C to 60°C
Accessories
LEC-BW-HS Heatspreader for LEC-BW
LEC-BW-HS2 Passive Heatsink for LEC-BW
Login / Registration
укажите почту
введите пароль
Forgot password?
By clicking «#SUBMIT_NAME»,
you agree to our Privacy Policy
Loading data...
Subscribe to our newsletter
specify your contacts

By clicking «#SUBMIT_NAME»,
you agree to our Privacy Policy

You have successfully subscribed
Now you can receive newsletters