nanoX-AL

COM Express Mini Size Type 10 Module with Intel® Atom™ E3900 series, Pentium®, and Celeron® SoC
  • Details
  • Specification
  • Order information
  • Intel® Atom™ E3900 Series, Pentium® and Celeron® SoC
  • 2/4/8GB Dual Channel soldered DDR3L at up to 1867/1600MHz
  • Intel® Gen9 Low Power graphics, 4k resolution/H.265 codec
  • Extreme Rugged operating temperature: -40°C to +85°C (build option for selected SKUs)

The nanoX-AL is a COM Express® COM.0 R2.1 Type 10 module supporting Intel® Atom™ processor E3900 series system-on-chip (SoC). The nanoX-AL is specifically designed for customers who need optmized processing and graphics performance with low power consumption in a long product life solution.

The nanoX-AL features the dual/quad core Intel® Atom™ processor E3900 series supporting non-ECC type DDR3L single-channel or dualchannel memory at 1600/1867 MHz to provide excellent overall performance. Integrated Intel® Gen9 LP Graphics includes features such as OpenGL 4.3, DirectX 12, OpenCL 2.0 and support for H.265/HEVC, H.264, MPEG2, VC1, VP9, MVC, JPEG/MJPEG hardware decode.

Graphics outputs include DDI ports supporting HDMI/DVI/DisplayPort and single-channel 18/24-bit LVDS (eDP by build option). The nanoX-AL is specifically designed for customers with balanced performance and power consumption requirements who want to outsource the custom core logic of their systems for reduced development time.

The nanoX-AL has soldered type non-ECC DDR3L memory up to 8GB. In addition, onboard eMMC memory (8GB/16GB/32GB) and SD signals are available as build options. The nanoX-AL features a single onboard Gigabit Ethernet port, USB 3.0 ports and USB 2.0 ports, and SATA 6 Gb/s ports. Support is provided for SMBus and I2C. The module is equipped with SPI AMI EFI BIOS, supporting embedded features such as remote console, CMOS backup, hardware monitor, and watchdog timer.



Technical specifications

Core System

CPU Intel® Atom™ E3900 series SoC - 14nm process
Atom™ E3950 1.6/2.0GHz (Turbo), 12W (4C/1866)
Atom™ E3940 1.6/1.8GHz (Turbo), 9W (4C/1866)
Atom™ E3930 1.3/1.8GHz (Turbo), 6W (2C/1866)
Supports: Intel® TXT, Intel® SSE4.2, Intel® 64 Architecture, IA 32-bit, Intel® AES-NI, dual or quad Out-of-Order Execution (OOE) processor cores, PCLMULQDQ Instruction DRNG
Note: Availability of features may vary between processor SKUs.
Memory Up to 8 GB Dual channel DDR3L at 1867/1600 MHz non-ECC
Embedded BIOS AMI EFI with CMOS backup in 16MB SPI BIOS
Cache 2MB for all SKUs
Expansion Busses 4 PCI Express x1 Gen2: Lanes 0/1/2/3 (configurable to x2, x4)
LPC bus, SMBus (system) , I2C (user)
SEMA Board Controller Supports : Voltage/current monitoring, power sequence debug support, AT/ATX mode control, logistics and forensic information, flat panel control, general purpose I2C, failsafe BIOS (dual BIOS), watchdog timer and fan control
Debug Headers 40-pin multipurpose flat cable connector for use with DB-40 debug module providing BIOS POST code LED, BMC access, SPI BIOS flashing, power testpoints, debug LEDs
60-pin XDP header for ICE debug of CPU/chipset on break out board
GPU Feature Support Intel® Generation 9 LP Graphics Core Architecture, supporting 2 independent and simultaneous display combinations of DisplayPort, HDMI, LVDS or eDP outputs
Hardware encode/transcode (including HEVC)
DirectX 12, DirectX 11.3, DirectX 10, DirectX 9.3 support
OpenGL 4.3 and ES 3.0 support
OpenCL 2.0 support
Digital Display Interface DDI0 supportts DisplayPort/HDMI/DVI
LVDS Single channel 18/24-bit LVDS from eDP-to-LVDS IC
eDP 4 lane support (build option, in place of LVDS)

Audio

Chipset Intel® HD Audio integrated in SoC
Audio Codec On carrier miniBASE-10R

Ethernet

Ethernet Intel® MAC/PHY: Intel® Ethernet i210
Interface: 10/100/1000 GbE connection
Note: Intel® Ethernet i211 is supported by project basis

I/O Interfaces

USB 2x USB 1.1/2.0/3.0 (USB 0,1) and 6x USB 1.1/2.0 (USB 2,3,4,5,6,7)
SATA Two ports SATA 6Gb/s (SATA0,1)
Serial 2 UART ports (console redirection is TBD)
eMMC eMMC 5.0 (8/16/32GB, build option)
SD SD signal is a build option supported by project basis
GPIO 4 GPO and 4 GPI
Super I/O Supported on carrier if needed (standard support for W83627DHG-P)

TPM (build option)

Chipset Infineon
Type TPM 2.0

Power

Standard Input ATX: 12V±5%, 5Vsb ±5%; AT: 12V±5%
Wide Input ATX: 4.75-20 V, 5Vsb ±5%
AT: 4.75-20V (Standard Temp. only)
Management ACPI 5.0 compliant, Smart Battery support
Power States: C1-C6, S0, S3, S4, S5 and S5 ECO mode (Wake on USB S3/S4, WOL S3/S4/S5)
ECO mode Supports deep S5 mode for power saving

Operating Systems

Standard Support Windows 10 64-bit, Linux 64-bit, VxWorks 64-bit (TBD)
Extended Support (BSP) Linux 64-bit, VxWorks 64-bit (TBD)

Mechanical

Form Factor PICMG COM.0 Rev 2.1, Type 10
Dimension Compact size: 84 mm x 55 mm

Environmental and physical specifications

Operating Temperature Standard: 0°C to +60°C
Extreme Rugged: -45°C to +85°C (build option with selected SoC SKUs)
Humidity 5-90% RH operating, non-condensing
5-95% RH storage (and operating with conformal coating)
Shock and Vibration IEC 60068-2-64 and IEC-60068-2-27
MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D
HALT Thermal Stress, Vibration Stress, Thermal Shock and Combined Test
Note: “build option” indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product.
Be aware that these “build option” part numbers will need to be newly created and this will result in production lead times.
Model Description
nanoX-AL-E3950-2G Mini COM Express Type10 with Intel Apollo Lake-I Atom E3950 (4C), 2G memory
nanoX-AL-E3940-2G Mini COM Express Type10 with Intel Apollo Lake-I Atom E3940 (4C), 2G memory
nanoX-AL-E3930-2G Mini COM Express Type10 with Intel Apollo Lake-I Atom E3930 (2C), 2G memory
nanoX-AL-N4200-2G Mini COM Express Type10 with Intel Apollo Lake Pentium N4200 (4C), 2G memory
nanoX-AL-N3350-2G Mini COM Express Type10 with Intel Apollo Lake Celeron N3350 (2C), 2G memory
Accessories
HTS-nXAL-B-I Heatspreader for nanoX-AL Atom with threaded standoffs for bottom mounting
HTS-nXAL-B Heatspreader for nanoX-AL Pentium/Celeron with threaded standoffs for bottom mounting
HTS-nXAL-BT Heatspreader for nanoX-AL Pentium/Celeron with through hole standoffs for top mounting
THS-nXAL-B-I Low profile heatsink for nanoX-AL Atom with threaded standoffs for bottom mounting
THS-nXAL-BT-I Low profile heatsink for nanoX-AL Atom with through hole standoffs for top mounting
THS-nXAL-B Low profile heatsink for nanoX-AL Pentium/Celeron with threaded standoffs for bottom mounting
THS-nXAL-BT Low profile heatsink for nanoX-AL Pentium/Celeron with through hole standoffs for top mounting
THSH-cAL-B-I High profile heatsink for nanoX-AL Atom with threaded standoffs for bottom mounting
THSH-cAL-B High profile heatsink for nanoX-AL Pentium/Celeron with threaded standoffs for bottom mounting
HTS-nXAL-BT-I Heatspreader for nanoX-AL Atom with through hole standoffs for top mounting
Starter Kit
COM Express Type 10 Starter Kit Plus Starter kit for COM Express Type 10

Login / Registration
укажите почту
введите пароль
Forgot password?
CAPTCHA
Loading data...
Subscribe to newsletter
specify your contacts