MicroMax's Solutions
MicroMax's Solutions
MicroMax's Solutions
nanoX-BT
COM Express Mini Size Type 10 Module
The nanoX-BT is a COM Express COM.0 R2.1 Type 10 module supporting Intel Atom processor E3800 Series and Intel Celeron N2930/J1900 processor SoC (codename: Bay Trail).
The nanoX-BT is specifically designed for customers who need high-level processing and graphics performance with low power consumption in a long product life solution.
The nanoX-BT features Intel Atom processor E3800 and Intel Celeron N2930/J1900 processor supporting non-ECC type DDR3L dual-channel memory at 1066/1333 MHz to provide excellent overall performance. Integrated Intel Gen7 HD Graphics includes features such as OpenGL 3.1, DirectX 11, OpenCL 1.1 and support for H.264, MPEG2, VC1, VP8 hardware decode. Graphics outputs include DDI ports supporting HDMI/DVI/DisplayPort and single-channel 18/24-bit LVDS (eDP is optional). The nanoX-BT is specifically designed for customers with high-performance processing graphics requirements who want to outsource the custom core logic of their systems for reduced development time.
The nanoX-BT has soldered type non-ECC DDR3L memory for up to 4 GB. In addition, onboard eMCC memory (8/16/32GB) and SDIO signals are optionally supported.
The nanoX-BT features a single onboard Gigabit Ethernet port, USB 3.0 ports and USB 2.0 ports, and SATA 3 Gb/s ports. Support is provided for SMBus and I2C. The module is equipped with SPI AMI EFI BIOS, supporting embedded features such as remote console, CMOS backup, hardware monitor, and watchdog timer.
Q7-BASE
Qseven Reference Carrier Board
Qseven is a Computer-on-Module (COM) standard for small sized and highly integrated systems adopted by SGET.
The Qseven concept is an off-the-shelf, multivendor, Computer-on-Module that integrates all the core components of a common PC and is mounted onto an application specific carrier board. Qseven modules have a standardized form factor of 70 mm x 70 mm or 40 mm x 70 mm and have specified pinouts based on the high-speed MXM connector, regardless of the vendor. The Qseven module provides the functional requirements for an embedded application, which include, but are not limited to, graphics, audio, mass storage, network and multiple USB ports. A single ruggedized 230 pin MXM connector provides the carrier board interface to carry all the I/O signals to and from the Qseven module. This MXM connector is a well-known and proven high-speed signal interface connector that is commonly used for -PCI Express graphics cards in notebooks.
The Qseven footprint is smaller than that of COM Express, ETX or XTX, responding to system designers' needs for minimal space. Qseven's power consumption envelope is below a 12 watts target, whereas SMARC's target is below 6 watts and COM Express can be well above 20 watts. Therefore, Qseven designs provide mid-range power values between those of SMARC and COM Express.
The Qseven pincount is 230 compared to 314 and 440 for SMARC and COM Express (Type 2), respectively. Thus, it is optimized for designs with lower board-to-board pin requirements.
LEC-BTS
SMARC Short Size Module
The SMARC ("Smart Mobility ARChitecture") is a versatile small form factor computer Module definition targeting applications that require low power, low costs, and high performance. The Modules will typically use ARM SOCs similar or the same as those used in many familiar devices such as tablet computers and smart phones. Alternative low power SOCs and CPUs, such as tablet oriented X86 devices and other RISC CPUs may be used as well. The Module power envelope is typically under 6W.
The Modules are used as building blocks for portable and stationary embedded systems. The core CPU and support circuits, including DRAM, boot flash, power sequencing, CPU power supplies, GBE and a single channel LVDS display transmitter are concentrated on the Module. The Modules are used with application specific Carrier Boards that implement other features such as audio CODECs, touch controllers, wireless devices, etc. The modular approach allows scalability, fast time to market and upgradability while still maintaining low costs, low power and small physical size.
The ADLINK LEC-BTS computer-on-module with built-in SEMA Cloud functionality is ready-made for Internet of Things (IoT) applications. The LEC-BTS is able to connect legacy industrial devices and other IoT systems to the cloud, extract raw data from these devices, determine which data to save locally and which to send to the cloud for further analysis. The results these analyses can provide valuable information for policy decision making and generate innovative business opportunities.
To stress on its low power consumption feature, ADLINK has named SMARC products as LEC (Low Energy Computer on module) series.
Express-SL/SLE
COM Express Basic Size Type 6 Module
ADLINK’s COM Express computer-on-module (COM) offerings include the cExpress-SL and Express-SL in PICMG COM.0 Type 6 Compact and Basic Size form factors, respectively. Both Basic and Compact size modules are available with 6th generation Intel® Core™ i7, i5 or i3 processors and accompanying Intel® QM170 and HM170 Chipset. ECC memory is supported by models utilizing the Intel® Xeon® processor E3-15XX v5 family and Intel® CM236 chipset. DDR4 memory is supported up to a total of 32GB, with a lower voltage compared to DDR3 resulting in a reduction in overall power consumption and heat dissipation. These new COMs also provide support for three independent UHD/4K displays and are well-suited for applications in automation, medical, and infotainment, with extended operating temperature range optionally available for transportation and defense applications.
The ADLINK Express-SL/SLE computer-on-module with built-in SEMA Cloud functionality is ready-made for Internet of Things (IoT) applications. The Express-SL/SLE is able to connect legacy industrial devices and other IoT systems to the cloud, extract raw data from these devices, determine which data to save locally and which to send to the cloud for further analysis. The results these analyses can provide valuable information for policy decision making and generate innovative business opportunities.
cExpress-SL
COM Express Compact Size Type 6 Module
ADLINK's COM Express computer-on-module (COM) offerings include the cExpress-SL and Express-SL in PICMG COM.0 Type 6 Compact and Basic Size form factors, respectively. Both Basic and Compact size modules are available with 6th generation Intel® Core™ i7, i5 or i3 processors and accompanying Intel® QM170 and HM170 Chipset. ECC memory is supported by models utilizing the Intel® Xeon® processor E3-15XX v5 family and Intel® CM236 chipset. DDR4 memory is supported up to a total of 32GB, with a lower voltage compared to DDR3 resulting in a reduction in overall power consumption and heat dissipation. These new COMs also provide support for three independent UHD/4K displays and are well-suited for applications in automation, medical, and infotainment, with extended operating temperature range optionally available for transportation and defense applications.
The ADLINK cExpress-SL computer-on-module with built-in SEMA Cloud functionality is ready-made for Internet of Things (IoT) applications. The cExpress-SL is able to connect legacy industrial devices and other IoT systems to the cloud, extract raw data from these devices, determine which data to save locally and which to send to the cloud for further analysis. The results these analyses can provide valuable information for policy decision making and generate innovative business opportunities.
cExpress-BW
COM Express Compact Size Type 6 Module
ADLINK cExpress-BW provides two DDI channels (with up to 4K resolution) and one LVDS or DDI3 channel supporting three independent displays, enabling it to drive multiple HD screens without the need for a discrete graphics card. In addition, Embedded DisplayPort (eDP) is optionally available to support next generation displays. The cExpress-BW also offers optional on-board SSD support and up to five PCI Express lanes x1. A wide range of operating systems are supported, including Linux, Windows 7 and 8.1u, Windows Embedded Standard 7, Windows Embedded Industry 8.1 and VxWorks.
The ADLINK cExpress-BW computer-on-module with built-in SEMA Cloud functionality is ready-made for Internet of Things (IoT) applications. The cExpress-BW is able to connect legacy industrial devices and other IoT systems to the cloud, extract raw data from these devices, determine which data to save locally and which to send to the cloud for further analysis. The results these analyses can provide valuable information for policy decision making and generate innovative business opportunities.
cExpress-BT2
COM Express Compact Size Type 2 Module
The cExpress-BT2 is a COM Express COM.0 R2.1 Type 2 module supporting Intel Atom processor E3800 Series and Intel Celeron N2930/J1900 processor SoC (codename: Bay Trail).
The cExpress-BT2 is specifically designed for customers who need high-level processing and graphics performance with low power consumption in a long product life solution.
The cExpress-BT2 features Intel Atom processor E3800 and Intel Celeron N2930/J1900 processor supporting non-ECC type DDR3L dual-channel memory at 1066/1333 MHz to provide excellent overall performance. Integrated Intel Gen7 HD Graphics includes features such as OpenGL 3.1, DirectX 11, OpenCL 1.1 and support for H.264, MPEG2, VC1, VP8 hardware decode. Graphics outputs include DDI ports supporting HDMI/DVI/DisplayPort and single-channel 18/24-bit LVDS (eDP is optional). The cExpress-BT2 is specifically designed for customers with high-performance processing graphics requirements who want to outsource the custom core logic of their systems for reduced development time.
The cExpress-BT2 has soldered type non-ECC DDR3L memory for up to 4 GB. In addition, onboard eMCC memory (8/16/32GB) and SDIO signals are optionally supported.
The cExpress-BT2 features a single onboard Gigabit Ethernet port, USB 3.0 ports and USB 2.0 ports, and SATA 3 Gb/s ports. Support is provided for SMBus and I2C. The module is equipped with SPI AMI EFI BIOS, supporting embedded features such as remote console, CMOS backup, hardware monitor, and watchdog timer.
The ADLINK cExpress-BT2 computer-on-module with built-in SEMA Cloud functionality is ready-made for Internet of Things (IoT) applications. The cExpress-BT2 is able to connect legacy industrial devices and other IoT systems to the cloud, extract raw data from these devices, determine which data to save locally and which to send to the cloud for further analysis. The results these analyses can provide valuable information for policy decision making and generate innovative business opportunities.
CM3-BT4
PCI-104 Single Board Computer
The ADLINK CM3-BT4 with built-in SEMA Cloud functionality is ready-made for Internet of Things (IoT) applications. CM3-BT4 is able to connect legacy industrial devices and other IoT systems to the cloud, extract raw data from these devices, determine which data to save locally and which to send to the cloud for further analysis. The results these analyses can provide valuable information for policy decision making and generate innovative business opportunities.
CM1-86DX3
Extreme Rugged PC/104 Single Board Computer
The CM1-86DX3 features the Vortex86DX3 SoC and is a PC/104-based, Single Board Computer (SBC), fully compliant with the PC/104 Specification, Version 2.6. PC/104 SBCs are very compact and highly integrated computers.
CM2-BT2
Extreme Rugged PC/104-Plus Single Board Computer
The ADLINK CM2-BT2 with built-in SEMA Cloud functionality is ready-made for Internet of Things (IoT) applications. CM2-BT2 is able to connect legacy industrial devices and other IoT systems to the cloud, extract raw data from these devices, determine which data to save locally and which to send to the cloud for further analysis. The results these analyses can provide valuable information for policy decision making and generate innovative business opportunities.
Dual-core Intel Atom Processor System-on-Chip
Up to 4GB DDR3L at 1333MHz
Supports VGA and LVDS
GbE (optional 2x GbE)
1x SATA 3Gb/s (optional 2x SATA), 1x USB 3.0 + 2x USB 2.0, 8x GPIO
Extreme Rugged operating temperature: -40°C to +85°C
Supports Smart Embedded Management Agent (SEMA) functions
