EPSM-10GX4

• On-board Memory: 4MB packet memory
• Power consumption: 20W max, all ports active
• Form Factor: 55x84mm / 2.17x3.31” (Same as COM Express Type 10)
• Operating Temperature: -40°C to +85°C (-40°F to +185°F)

The EPSM-10GX4 is a managed Ethernet switch module in an ultra-compact 2.2″ x 3.3″ (55×84mm) size offering 24x 10/100/1000Mbps copper ports + 4x 10Gbps SFI ports. The module is intended to be used on a carrier board, such as Diamond’s EPS-24G4X, to implement a complete Ethernet switching solution. The core Ethernet switching technology is almost fully encapsulated on the module; for many applications, only the «last inch» of magnetics and I/O connectors is required to complete the circuit, enabling easy development of custom form factor compact, rugged Ethernet switch solutions.

The small size, based on the industry-standard COM Express Mini form factor, makes EPSM-10GX a perfect choice for use as a building block for creating custom Ethernet switch solutions in a variety of space-demanding applications, such as drones, ground and underwater vehicles, and robots.

Customers looking for a complete off-the-shelf solution may be interested in our EPS-24G4X, which provides all of the switch’s features in the industry standard 3.5 inch form factor with integrated latching I/O connectors and SFP+ sockets. Diamond Systems also offers custom carrier board design services to provide a perfect fit solution for your application.

Two software packages are available, Layer 2+ switching and Layer 3 routing/switching. In addition, IEEE-1588 precision time protocol support is available with a minor modification to support an external precision clock circuit and 1pps signal source provided by the carrier board. All software features are manageable via a GUI web interface accessible over any port, as well as with a command language accessed via a built-in RS-232 port.

Two cooling accessory options are available: A heat sink provides convection cooling in a low profile, while a heat spreader provides improved conduction cooling for superior high temperature performance in applications where physical contact with the system enclosure is available.

Two high-speed fine-pitch connectors provide all power and data communications between the module and the carrier board. The first connector provides power, 9 10/100/1000 ports, the serial interface, and a serial LED data stream. Applications requiring 9 ports or less may use just this connector. The second connector contains 3 more 10/100/1000 ports, QSGMII signals for an additional 12-port PHY to provide 12 additional 10/100/1000 ports, and the 4 10G SFI ports.

EPSM-10GX4 is designed to meet the challenges of vehicle environments with its 50% thicker PCB, −40/+85°C operating temperature range, and MIL-STD-202G shock/vibration resistance.