cExpress-EL
COM Express Compact Size Type 6 Module with Next Generation Intel Atom Processor SoC
Vendor:ADLINK Technology Inc.
- Details
- Specification
- Order information
- 6th Gen Intel Atom Processor (formerly “Elkhart Lake”)
- Up to 32GB Dual Channel DDR4
- Intel Gen11 LP Graphics Core Architecture
- Extreme Rugged operating temperature: -40°C to +85°C
ADLINK cExpress-EL supports next generation Intel Atom x6000 processors (Elkhart Lake) combined with Intel UHD graphics at low power envelope and high speed interfaces. cExpress-EL modules support In-Band ECC dual channel DDR4 memory up to 32GB, and are also available in rugged operating temperature range and low power envelope, making them a perfect match for mission critical fanless edge computing applications that require safety and reliability at all times.
| Technical specifications | |
|
Core System |
|
|---|---|
| CPU |
6th Gen Intel Atom Processor (formerly “Elkhart Lake”) Intel Atom x6425E, 2.0(3.0) GHz, 12W, 4C/32EU Intel Atom x6413E, 1.5(3.0) GHz, 9W, 4C/16EU Intel Atom x6211E, 1.3(3.0) GHz, 6W, 2C/16EU Intel Atom x6425RE, 1.9 GHz, 12W, 4C/32EU Intel Atom x6414RE, 1.5 GHz, 9W, 4C/16EU Intel Atom x6212RE, 1.2 GHz, 6W, 2C/16EU Intel Atom x6200FE, 1.0 GHz, 4.5W, 2C,no GPU Intel Pentium J6426, 2.0(3.0) GHz, 10W, 4C/32EU Intel Celeron J6413, 1.8(3.0) GHz, 10W, 4C/16EU Intel Pentium N6415, 1.2(3.0) GHz, 6.5W, 4C/16EU Intel Celeron N6211, 1.2(3.0) GHz, 6.5W, 2C/16EU Supports: Intel VT, Intel VT-d, Intel TXT, Intel SSE4.2, Intel 64 Architecture, Execute Disable Bit, Intel AES-NI, PCLMULQDQ Instruction, Intel Secure Key Notes: Availability of features may vary between processor SKUs. Some of the SKUs listed above are supported by project basis only. Please contact us for availability. Intel Atom x6200FE, x6425RE, x6414RE, x6412RE support Intel TCC |
| Memory |
Dual channel DDR4 memory up to 3200 MT/s IBECC/non-ECC, max. 32GB in two SODIMM sockets (2x 16GB) Intel In-Band ECC (IBECC), provides ECC protection with normal type SO-DIMM memory (on Intel Atom SKUs only, BIOS configurable) |
| Embedded BIOS | AMI UEFI with CMOS backup in 32 or 16MB SPI BIOS (dual BIOS by build option) |
| Cache | 1.5MB |
| Expansion Busses |
6 PCI Express x1 Gen3 (AB): Lanes 0/1/2/3/4/5 (configurable to x2, x4) 2 PCI Express x1 Gen3 (CD): Lanes 6/7 1 PCI Express x1 Gen3 (CD): Lane 16 (muxed with SATA port 3, by build option) Note: I2C can be managed by ARM M7 processor or x86 processor by BIOS setting. I2C managed by ARM M7 core is for real-time usage. (TBC) Requires HW build option, by project basis. |
| SEMA Board Controller | Supports: Voltage/current monitoring, power sequence debug support, AT/ATX mode control, logistics and forensic information, flat panel control, general purpose I2C, failsafe BIOS (dual BIOS by build option), watchdog timer and fan control |
| Debug Headers | 30-pin multipurpose flat cable connector for use with DB-30 x86 debug module providing BIOS POST code LED, EC access, SPI BIOS flashing, power testpoints, debug LEDs |
|
Video |
|
| GPU Feature Support |
Intel Gen11 LP Graphics Core Architecture, supporting 3 independent and simultaneous display combinations of DisplayPort/HDMI/LVDS, eDP or VGA outputs (3x 4K60) Hardware encode/transcode of HD content (including HEVC) DirectX 12 support and Vulkan v1.1 support OpenGL 4.5 and ES 3.2 support OpenCL 1.2 support |
| Digital Display Interface | DDI1/2 supporting DisplayPort/HDMI/DVI |
| VGA | Build option support through DP-to-VGA IC (in place of DDI2, max. resolution 1920x1200 @60Hz) |
| LVDS | Single/dual channel 18/24-bit LVDS from eDP-to-LVDS IC (max. resolution 1920x1200 @60Hz in dual mode) |
| eDP | Optional 4 lane support, in place of LVDS (max. resolution 4096x2160 @60Hz) |
|
Audio |
|
| Chipset | Intel HD Audio integrated in SoC |
| Audio Codec | On carrier Express-BASE6 (ALC886 standard support) |
|
Ethernet |
|
| Intel MAC/PHY | Onboard Intel SoC, MaxLinear series (TSN support on Yocto Linux with selected SKUs) |
| Interface |
1000/100/10 Mbit/s or 2.5Gbit/s Ethernet connection GbE0_SDP available if TSN support enabled |
|
I/O Interfaces and storage |
|
| USB |
2x USB 3.2/2.0/1.1 (USB 0,1: max. 10Gbps) and 6x USB 2.0/1.1 (USB 2-7) USB Hub supported by project basis provides 4x USB 3.2/2.0/1.1 (USB 0-3) and 4x USB 2.0/1.1 (USB 4-7) |
| SATA | 2x SATA 6Gb/s (SATA 0, 1) |
| Serial | 2x UART ports with console redirection |
| eMMC | eMMC 5.0 (16/32/64GB by build option), functions as boot-up device on Windows 10 Enterprise and Yocto Linux |
| GPIO/SD |
4x GPO and 4x GPI from EC (GPI with interrupt TBC) SD/GPIO muxed design, switched by BIOS setting, SD functions as storage device only on Windows (support on Yocto Linux is TBC) Note: USB 3.2 Gen2 support dependent on carrier design 2x UART and 8x GPIO can be managed by ARM M7 processor or x86 processor. UART, GPIO managed by ARM M7 is for real-time usage (TBC). Requires HW build option, by project basis. |
| Super I/O | Supported on carrier if needed (standard support for W83627DHG-P, other Super I/O support is by project basis) |
|
TPM |
|
| Chipset | Infineon |
| Type | TPM 2.0 (SPI based) |
|
Power |
|
| Standard Input | ATX = 12V±5% / 5Vsb ±5% or AT = 12V±5% |
| Wide Input | ATX = 8.5-20 V / 5Vsb ±5% or AT=8.5-20V |
| Management | ACPI 5.0 compliant, Smart Battery support |
| Power States | C1-C6, S0, S1, S3, S4, S5 , S5 ECO mode (Wake on USB S3/S4, WOL S3/S4/S5) |
| ECO mode | Supports deep S5 mode for power saving |
|
Other |
|
| Form Factor | PICMG COM.0: Rev 3.0 Type 6 |
| Dimension | Compact size: 95 mm x 95 mm |
| Operating Systems | Standard Support: Windows 10 IOT Enterprise 64-bit, Yocto Linux 64-bit, VxWorks 64-bit (TBC), Ubuntu (TBC) |
|
Environmental and physical specifications |
|
| Operating temperature |
Standard: 0°C to 60°C Extreme Rugged: -40°C to 85°C (optional, selected SKUs) |
| Storage temperature |
Standard: -20°C to 80°C Extreme Rugged: -45°C to 85°C (optional, selected SKUs) |
| Humidity |
5-90% RH operating, non-condensing 5-95% RH storage (and operating with conformal coating) |
| Shock and Vibration |
IEC 60068-2-64 and IEC-60068-2-27 MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D |
| HALT | Thermal Stress, Vibration Stress, Thermal Shock and Combined Test |
| Model | Description |
| cExpress-EL-x6425E | Compact COM Express Type 6 with Intel Atom x6425E (4C) |
| cExpress-EL-x6413E | Compact COM Express Type 6 with Intel Atom x6413E (4C) |
| cExpress-EL-x6411E | Compact COM Express Type 6 with Intel Atom x6411E (2C) |
| cExpress‑EL‑x6200FE | Compact COM Express Type 6 with Intel Atom x6200FE (2C, no GPU) |
