cExpress-WL
COM Express Compact Size Type 6 Module with Up to Quadcore Intel Core and Celeron Processors
Vendor:ADLINK Technology Inc.
- Details
- Specification
- Order information
- 8th Gen quad/dual-core Intel Core Processors
- Up to 64GB Dual Channel non-ECC DDR4 at 2133/2400MHz
- Supports up to 3 independent displays
- Extreme Rugged operating temperature: -45°C to +85°C
ADLINK introduces its latest COM Express Type 6 modules to fulfill the needs of size, weight, and power (SWaP)-constrained edge computing applications. ADLINK’s cExpress-WL modules feature the 8th generation Intel Core and Celeron processors (formerly codenamed Whiskey Lake-U) with up to 4 cores and up to 64GB memory capacity, offering edge computing applications uncompromising performance and responsiveness despite SWaP constraints. The cExpress-WL is suited for applications such as data acquisition and analysis, image processing, and 4K video transcoding and streaming at the edge.
cExpress-WL modules are equipped with the 8th generation Intel Core processor and Celeron processor. These quad-core processors support up to 8 threads and an impressive turbo boost of up to 4.8 GHz, delivering 40% performance at increase at 15 watt of thermal design power (TDP) at a similar cost. ADLINK’s cExpress-WL provides standard support for up to 64GB non-ECC DDR4 in two SO-DIMMs, while still fully complying with PICMG COM.0 mechanical specifications.
| Technical specifications | |
|
Core System |
|
|---|---|
| CPU |
8th Gen Intel Core and Celeron Processors - Mobile 14nm process (formerly “Whiskey Lake-U”) Core i7-8665UE, 1.7 (4.4 Turbo) GHz, 8MB, 15W (25W-12.5W cTDP), 4C/GT2 Core i5-8365UE, 1.6 (4.1 Turbo) GHz, 6MB, 15W (25W-12.5W cTDP), 4C/GT2 Core i3-8145UE, 2.2 (3.9 Turbo) GHz, 4MB, 15W (25W-12.5W cTDP), 2C/GT2 Celeron 4305UE, 2.0GHz, 2MB, 15W, 2C/GT1 Supports: Intel VT, Intel VT-d, Intel TXT, Intel SSE4.2, Intel HT Technology, Intel 64 Architecture, Execute Disable Bit, Intel Turbo Boost Technology 2.0, Intel AVX2, Intel AES-NI, PCLMULQDQ Instruction, Intel Secure Key and Intel TSX-NI. Notes: Availability of features may vary between processor SKUs. |
| Memory | Dual channel 2133/2400 MHz non-ECC DDR4 memory up to 64GB in two SODIMM sockets |
| Embedded BIOS | AMI EFI with CMOS backup in 32 or 16MB SPI BIOS with Intel AMT 11.0 support (AMT support available on Core i7/i5 only) |
| Cache | 8MB for Core i7, 6MB for Core i5, 4MB for Core i3, 2MB for Celeron |
| Expansion Busses |
6 PCI Express x1 Gen3 (AB): Lanes 0/1/2/3/4/5 (configurable to x2, x4) 2 PCI Express x1 Gen3 (CD): Lanes 6/7 1 PCI Express x1 Gen3 (CD): Lane 16 (muxed with SATA port 3, by build option) Note: Maximum of 5 PCIe devices supported. LPC bus, SMBus (system), I2C (user) |
| SEMA Board Controller | Supports: Voltage/current monitoring, power sequence debug support, AT/ATX mode control, logistics and forensic information, flat panel control, general purpose I2C, failsafe BIOS (dual BIOS), watchdog timer and fan control |
| Debug Headers | 40-pin multipurpose flat cable connector for use with DB-40 debug module providing BIOS POST code LED, BMC access, SPI BIOS flashing, power testpoints, debug LEDs |
|
Video |
|
| GPU Feature Support |
Intel Generation 9 LP Graphics Core Architecture, supporting 3 independent and simultaneous display combinations of DisplayPort/HDMI/LVDS or VGA/eDP outputs Hardware encode/transcode HD content (including HEVC) DirectX 12, DirectX 11.2, DirectX 11.1, DirectX 11, DirectX 10.1, DirectX 10, DirectX 9 support OpenGL 4.5, 4.4/4.3 and ES 2.0 support OpenCL 2.1, 2.0/1.2 support |
| Digital Display Interface | DDI1/2 supporting DisplayPort/HDMI/DVI |
| VGA | Build option support through DP-to-VGA IC (in place of DDI2, max. resolution 1920x1200 @60Hz) |
| LVDS | Single/dual channel 18/24-bit LVDS from eDP-to-LVDS IC (max. resolution 1920x1200 @60Hz in dual mode) |
| eDP | Optional 4 lane support, in place of LVDS (max. resolution 4096x2304 @60Hz, 24bpp) |
|
Audio |
|
| Chipset | Intel HD Audio integrated in SoC |
| Audio Codec | On carrier Express-BASE6 (ALC886 standard support) |
|
Ethernet |
|
| Intel MAC/PHY | Intel I219-LM/V (LM supports AMT 12.x) |
| Interface | 10/100/1000 GbE connection |
|
I/O Interfaces and storage |
|
| USB | 4x USB 3.1 Gen2/2.0/1.1 (USB 0,1,2,3) and 4x USB 2.0/1.1 (USB 4,5,6,7) |
| SATA | 3x SATA 6Gb/s (SATA 0,1,2), SATA port 3 muxed with PCIe lane 16 (SATA port 3 is default) |
| Serial | 2x UART ports with console redirection, from a LPC to UART IC (opt. HSUART from SOC by build option) |
| eMMC | eMMC 5.0 (8/16/32GB by build option) |
| GPIO/SD |
4x GPO and 4x GPI from BMC (GPI with interrupt) SD/GPIO muxed design, switched by BIOS setting, SD functions as storage device only Notes: USB 3.1 Gen2 support dependent on carrier design. |
| Super I/O | Supported on carrier if needed (standard support for W83627DHG-P) |
|
TPM |
|
| Chipset | Infineon |
| Type | TPM 2.0 |
|
Power |
|
| Standard Input | ATX = 12V±5% / 5Vsb ±5% or AT = 12V±5% |
| Wide Input | ATX = 5-20 V / 5Vsb ±5% or AT=5-20V |
| Management | ACPI 5.0 compliant, Smart Battery support |
| Power States | C1-C6, S0, S1, S3, S4, S5 , S5 ECO mode (Wake on USB S3/S4, WOL S3/S4/S5) |
| ECO mode | Supports deep S5 mode for power saving |
|
Other |
|
| Form Factor | PICMG COM.0: Rev 3.0 Type 6 |
| Dimension | Compact size: 95 mm x 95 mm |
| Operating Systems |
Standard Support: Windows 10 64-bit, Yocto project based Linux 64-bit, Ubuntu LTS 64-bit (TBD), CentOS 64-bit (TBD) Extended Support (BSP): Yocto project based Linux 64-bit |
|
Environmental and physical specifications |
|
| Operating temperature |
Standard: 0°C to 60°C Extreme Rugged: -45°C to 85°C (optional, selected SKUs) |
| Humidity |
5-90% RH operating, non-condensing 5-95% RH storage (and operating with conformal coating) |
| Shock and Vibration |
IEC 60068-2-64 and IEC-60068-2-27 MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D |
| HALT | Thermal Stress, Vibration Stress, Thermal Shock and Combined Test |
| Model | Description |
| cExpress-WL-i7-8665UE | Compact COM Express Type 6 module with 8th Intel Core i7-8665UE quad core at 1.7GHz/4.4GHz, with GT2 level graphics. |
| cExpress-WL-i5-8365UE | Compact COM Express Type 6 module with 8th Intel Core i5-8365UE quad core at 1.6GHz/4.1GHz, with GT2 level graphics. |
| cExpress-WL-i3-8145UE | Compact COM Express Type 6 module with 8th Intel Core i3-8145UE dual core at 2.2GHz/3.9GHz, with GT2 level graphics. |
| cExpress-WL-Pentium | Compact size COM Express Type6 module with 8th Intel Pentium SOC |
| cExpress-WL-4305UE | Compact COM Express Type 6 module with 8th Intel Celeron 4305UE dual core at 2.0GHz, with GT1 level graphics. |
| cExpress-WL-i7-8665UE-VGA | Compact size COM Express Type6 module with 8th Intel Core i7-8665UE SOC, VGA |
| cExpress-WL-i5-8365UE-VGA | Compact size COM Express Type6 module with 8th Intel Core i5-8364UE SOC, VGA |
| cExpress‑WL‑i3‑8145UE‑VGA | Compact size COM Express Type6 module with 8th Intel Core i3-8145UE SOC, VGA |
| Accessories | |
| HTS-cWL-B | Heatspreader for cExpress-WL with threaded standoffs for bottom mounting |
| HTS-cWL-BT | Heatspreader for cExpress-WL with through hole standoffs for top mounting |
| THS-cWL-B | Low profile heatsink for cExpress-WL with threaded standoffs for bottom mounting |
| THS-cWL-BT | Low profile heatsink for cExpress-WL with through hole standoffs for top mounting |
| THSF-cWL-B | High profile heatsink with Fan for cExpress-WL with threaded standoffs for bottom mounting |
| THSH-cWL-B | High profile heatsink for cExpress-WL with threaded standoffs for bottom mounting |
| COM Express Type 6 Starter Kit Plus | COM Express form factor starter kit with Express-BASE6 board, power supply, and accessory kit |
