ADLINK’s Express-ADP COM Express Type 6 Basic size module is based on the 12th Gen Intel Core processor and is the first COM Express module to support advanced hybrid architecture with up to 6 Performance-cores (P-cores) for IoT workloads and up to 8 Efficient-cores (E-cores) for background task management, boosting productivity and fueling IoT innovation across a wide variety of deployments.
The modules provide support for PCIe 4.0 and DDR5 memory with up to 4800 MT/s combined with increased cache, as well as security and manageability features, AI enablement to deliver intelligent workload optimization, enhanced graphics, AI, computer vision, and enhanced peripheral, connectivity, and fast memory access capabilities.
The integrated Intel Iris Xe graphics, with up to 96EUs, offers four concurrent 4K60 HDR displays and Intel Deep Learning Boost to deliver superior AI performance. Using DDI, eDP 1.4b and USB4/TBT4, the four independent displays support Display Alternative mode, providing premium graphics features for superior content support, display and I/O virtualization.
Technical specifications | |
Core System |
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CPU |
12th Gen Intel Core processors (formerly Alder Lake-P) Core i7-12800HE, Cores/Threads: 6P+8E/20T, Cache: 24MB, TDP: 45W(35W cTDP), Graphics: Iris Xe GPU Core i5-12600HE, Cores/Threads: 4P+8E/16T, Cache: 18MB, TDP: 45W(35W cTDP), Graphics: Iris Xe GPU Core i3-12300HE, Cores/Threads: 4P+4E/12T, Cache: 12MB, TDP: 45W(35W cTDP), Graphics: UHD GPU Note: Some processor SKUs are supported by project basis only. Please contact us for more information. Supports: Intel® VT (including VT-x, VT-d, VT-x with Extended Page Tables), Intel® HT Technology, Intel® SSE4.2, Intel® 64 Architecture, Intel® Turbo Boost Technology 2.0, Intel® AVX512-VNNI, Intel® TXT, Execute Disable Bit, Intel® Data Protection Technology with Intel® Secure Key, Intel® AES-NI Note: Availability of features may vary between processor SKUs. |
Memory | Up to 64GB (2x 32GB) DDR5 non-ECC SO-DIMM memory, max. 4800MT/s 2 memory channels with 1DPC design |
Embedded BIOS | AMI UEFI with CMOS backup in 32 or 16MB (TBC) SPI BIOS |
Expansion Busses |
PCIe x8 Gen4, lanes 16-23, available for 45W(35W cTDP SKUs) PCIe x4 Gen4, lanes 24-27 PCIe x4 Gen4, lanes 28-31 5x PCIe x1 Gen3, lanes 0-3 (configurable to x1, x2, x4), lane 4 (additional PCIe x1, lanes 5-7 via PCIe switch, build option by project basis) LPC bus (via ESPI-to-LPC bridge IC) SMBus (system) I2C (user) GP_SPI(TBC) |
SEMA Board Controller | Supports: Voltage/Current monitoring, Power Sequence debug support, AT/ATX mode control, Logistics and Forensic information, Flat Panel Control, General Purpose I2C, Failsafe BIOS (dual BIOS), Watchdog Timer and Fan Control |
Debug Headers | 30-pin multipurpose flat cable connector for use with DB30-x86 debug module providing BIOS POST code LED, SEMA Board Controller access, SPI BIOS flashing, power testpoints, debug LEDs |
Video |
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GPU Feature Support |
Intel® Iris Xe or UHD Graphics Core Architecture, max. 96EUs, supporting 4 concurrent display combinations of DisplayPort/HDMI/LVDS/eDP/VGA and Display alternative mode through USB4/Thunderbolt4 outputs (4x 4K60) Hardware video encode/decode, up to 8K60 HEVC DirectX 12, OpenGL 4.6, Vulkan 1.2, Mesa 3D support OneVPL HDCP 2.3 Graphics Hardware Virtualization (SRIOV) |
Digital Display Interface | DDI 1/2/3 supporting DP 1.4a, HDMI 2.0b, DVI |
VGA | Supported by build option via DP-to-VGA IC (in place of DDI 3), max. resolution 1920x1200@60Hz |
LVDS | Single/dual channel 18/24-bit LVDS from eDP-to-LVDS IC, max. resolution 1920x1200@60Hz in dual mode |
eDP | Build option in place of LVDS, 4 lanes, eDP 1.4b |
USB4 |
Max. 2x USB4 in place of DDI 1/2, supports DP 1.4a by DP alternative mode, Thunderbolt 4 capable (TBC) Requires BIOS code modification by project basis, re-timer with PD on carrier |
Audio |
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Chipset | Integrated on SoC |
Audio Codec | On carrier Express-BASE6 (ALC886 standard support) |
Ethernet |
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Intel MAC/PHY | Intel Ethernet Connection I225 series (I225-IT supports TSN by build option, TBC) |
Interface |
2.5GbE and 1000/100/10 Mbit/s Ethernet connection GbE0_SDP if TSN support enabled (TBC) |
I/O Interfaces and storage |
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USB |
4x USB 3.2/2.0/1.1 (USB 0-3), 4x USB 2.0/1.1 (USB 4-7) Max. two USB4 (in place of DDI 1/2) by project basis, Thunderbolt 4 capable (TBC) |
SATA | 2x SATA 6Gb/s (SATA 0-1) |
On-board Storage | NVMe SSD in place of PCIe lanes 28-31 (build option, project basis) |
Serial | 2x UART ports with console redirection |
GPIO | 12x GPIO (GPI with interrupt, TBC) |
Super I/O | Supported on carrier if needed (standard support W83627DHG-P, other Super I/O supported by project basis) |
TPM |
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Chipset | Infineon |
Type | TPM 2.0 (SPI based) |
Power |
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Standard Input | ATX = 12V ±5% / 5Vsb ±5% or AT = 12V ±5% |
Wide Input | ATX = 8.5-20 V / 5Vsb ±5% or AT = 8.5-20V |
Management | ACPI 5.0 compliant, Smart Battery support (TBC) |
Power States | C1-C6, S0, S1, S3, S4, S5 , S5 ECO mode (Wake on USB S3/S4, WOL S3/S4/S5) (TBC) |
ECO mode | Supports deep S5 mode for power saving |
Other |
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Form Factor | PICMG COM.0: Rev 3.0 Type 6 |
Dimension | Basic size: 125 mm x 95 mm |
Operating Systems | Windows 10 IOT Enterprise LTSC, Yocto project based Linux 64-bit, Ubuntu 64-bit (TBC), VxWorks (TBC) |
Environmental and physical specifications |
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Operating temperature |
Standard: 0°C to 60°C (storage: -20°C to 80°C) Extreme Rugged: -40°C to 85°C (storage: -40°C to 85°C, TBC, build option, selected SKUs) |
Humidity |
5-90% RH operating, non-condensing 5-95% RH storage (and operating with conformal coating) |
Shock and Vibration |
IEC 60068-2-64 and IEC-60068-2-27 MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D (TBC) |
HALT | Thermal Stress, Vibration Stress, Thermal Shock and Combined Test |
Model | Description |
Express-ADP | COM Express Basic Size Type 6 Module with 12th Gen Intel Core Processor |
COM Express Type 6 Starter Kit Plus | Starter kit for COM Express Type 6 |