The Module Computing Product Segment (MCPS) is pleased to introduce its latest COM Express Type 2 Module with Intel Core i7/i5/i3 Processor and QM77 Chipset, the Express-IBE2.
The Express-IBE2 is a COM Express COM.0 R2.1 Type 2 module with a 3rd Generation Intel Core i7/i5/3 processor and support for error-correcting code (ECC) memory.
Based on the latest Mobile Intel® QM77 Express Chipset, the Express-IBE2 is specifically designed for customers who need a highly reliable platform and/or continued support for PCI-bus and PATA IDE in a long product life solution.
The Express-IBE2 features the Intel Core i7/i5/i3 processor supporting Intel® Hyper-Threading Technology (up to 4 cores, 8 threads) and DDR3 dual-channel memory at 1066/1333/1600 MHz with error-correcting code (ECC). Integrated HD Graphics 4000 includes features such as OpenGL 3.1, DirectX11, Intel® Clear Video HD Technology, Advanced Scheduler 2.0, 1.0, XPDM support, and DirectX Video Acceleration (DXVA) support for full AVC/VC1/MPEG2 hardware decode. Graphics outputs include VGA, LVDS and SDVO.
In addition to the onboard integrated graphics, a multiplexed PCI Express® x16 Graphics bus is available for discrete graphics expansion or general purpose x8 or x4 PCI Express® connectivity. The Express-IBE2 features a single onboard Gigabit Ethernet port, eights USB 2.0 ports, two SATA 6 Gb/s ports, two SATA 3 Gb/s ports and one PATA IDE port. Support is provided for SMBus and I2C.
The module is equipped with an SPI AMI EFI BIOS and supports SEMA (Smart Embedded Management Agent). SEMA functionality is consistent over ADLINK"s whole COM product line and provides the following embedded features : BIOS failsafe, voltage/current/temperature monitoring, power sequence control and monitoring, watchdog control, board info and statistics. SEMA comes with extensive software and library support for Windows, Linux, VxWorks and QNX.
The ADLINK Express-IBE2 computer-on-module with built-in SEMA Cloud functionality is ready-made for Internet of Things (IoT) applications. The Express-IBE2 is able to connect legacy industrial devices and other IoT systems to the cloud, extract raw data from these devices, determine which data to save locally and which to send to the cloud for further analysis. The results these analyses can provide valuable information for policy decision making and generate innovative business opportunities.
Technical specifications | |
Core System |
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CPU |
3rd Generation Intel® “Ivy Bridge” 22nm process, BGA type Intel® Core™ i7-3615QE 2.3GHz, 6MB L3 cache, 45W (4C) Intel® Core™ i7-3612QE 2.1GHz, 6MB L3 cache, 35W (4C) Intel® Core™ i7-3555LE 2.5GHz, 4MB L3 cache, 25W (2C) Intel® Core™ i7-3517UE 1.7GHz, 4MB L3 cache, 17W (2C) Intel® Core™ i5-3610ME 2.7GHz, 3MB L3 cache, 35W (2C) Intel® Core™ i3-3120ME 2.4GHz, 3MB L3 cache, 35W (2C) Intel® Core™ i3-3217UE 1.6GHz, 3MB L3 cache, 17W (2C) Intel® Celeron® 1020E 2.2 GHz (no Turbo) 35W (2C) Intel® Celeron® 1047UE 1.4 GHz (no Turbo) 17W (2C) Intel® Celeron® 927UE 1.5 GHz (no Turbo) 17W (1C) |
Memory |
Dual channel 1333/1600 MHz DDR3 memory with ECC support up to 16GB in dual stacked SODIMM socket |
Chipset | Intel® Mobile QM77 Express Chipset |
L3 Cache | 6MB (i7-3615QE and i7-3612QE), 4MB (i7-3555LE and i7-3517UE), 3MB (i5-3610ME, i3-3120ME and i3-3217UE) |
BIOS | AMI EFI with CMOS backup in 16 Mbit SPI flash |
Hardware Monitor | Supply voltages and CPU temperature |
Debug Interface | XDP SFF-26 extension for ICE debug |
Watchdog Timer | Programmable timer range to generate RESET |
Expansion Busses |
PCI Express x16 (Gen3) bus for discrete graphics solution or general purpose PCI Express (2 x8 or 1 x8 with 2 x4) 5 PCI Express x1: Lanes 0/1/2/3/4 are free, lane 5 is occupied by PATA, lane 6 is occupied by PCI bus and lane 7 is occupied by GbE LPC bus, SMBus (system) , I2C (user) |
SEMA BMC | Voltage and Current Monitoring, Flat Panel Control, I2C bus 100/200/400, Failsafe Dual BIOS, Module Logistics, Runtime information, User Flash Area, Power Control, and ECO mode support |
Video |
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Integrated in Processor | Intel® HD Graphics 4000 at 650–1200 MHz (depending on processor) |
Integrated Video | DirectX 11, OpenGL 3.1, OpenCL 1.1 |
Feature Support |
Intel® Clear Video HD Technology Advanced Scheduler 2.0, 1.0, XPDM support DirectX Video Acceleration (DXVA) support for full AVC/VC1/MPEG2 hardware decode |
VGA |
Analog VGA support with 300 MHz DAC Analog monitor support up to QXGA (2048 x 1536) and VGA hot plug |
LVDS | Single/dual channel 18/24-bit LVDS |
SDVO | SDVO multiplexed with PCIe x16 lane 0-7 |
Audio |
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Chipset | Integrated in Intel® PCH QM77 |
Audio Codec | On Express-BASE carrier (ALC886) |
Ethernet |
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Chipset | Intel® Gigabit Ethernet PHY WG82579LM |
Interface | 10/100/1000 Mbps Ethernet |
I/O Interfaces |
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Chipset | Integrated in Mobile Intel® QM77 |
USB | 8 ports USB 2.0 (USB0~7) |
SATA | Supports two SATA ports at 6 Gb/s and two ports at 3 Gb/s with support for RAID 0,1,5,10 |
IDE (PATA) | SATA to PATA bridge on SATA channel 1, Master only |
Super I/O | Connected to LPC bus on carrier if needed |
TPM (optional) |
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Chipset | Atmel AT97SC3209 |
Type | TPM 1.2 |
Power |
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Input Power | AT mode (12 V +/- 5%) and ATX mode (12 V and 5 Vsb +/- 5%) |
Power States | Supports S0, S1, S3, S4, S5 |
Smart Battery Support | Yes |
Power Consumption | 43W with i7-3612QE and 8GB memory typical |
Other |
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Compatibility | COM Express® Type 2, Basic form factor 125mm x 95mm |
Dimension | Basic size: 125 mm x 95 mm |
Operating Systems |
Standard Support: Windows 7, Linux Extended Support (BSP): Embedded XP support package, Linux BSP, VxWorks 6.x, AIDI Library for Windows and Linux |
Environmental and physical specifications |
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Operating Temperature |
Standard: 0°C to +60°C Extreme Rugged™: -40°C to +85°C (optional) |
Storage Temperature | -20°C to +80°C |
Humidity | 90% at +60°C |
Shock | 15G peak-to-peak, 11ms duration, non-operating |
Vibration |
Non-operating: 1.88Grms, 5-500Hz, each axis Operating: 0.5Grms, 5-500Hz, each axis |
Certification | CE, FCC, HALT |
Model | Description |
Express-IBE2-i7-3615QE | COM Express® Basic Size Type 2 Module with Intel® Core™ i7-3615QE SV at 2.3 GHz |
Express-IBE2-i7-3612QE | COM Express® Basic Size Type 2 Module with Intel® Core™ i7-3612QE SV at 2.1 GHz |
Express-IBE2-i7-3555LE | COM Express® Basic Size Type 2 Module with Intel® Core™ i7-3555LE LV at 2.5 GHz |
Express-IBE2-i7-3517UE | COM Express® Basic Size Type 2 Module with Intel® Core™ i7-3517UE ULV at 1.7 GHz |
Express-IBE2-i5-3610ME | COM Express® Basic Size Type 2 Module with Intel® Core™ i5-3610ME SV 2.7 GHz |
Express-IBE2-i3-3120ME | COM Express® Basic Size Type 2 Module with Intel® Core™ i3-3120ME SV at 2.4 GHz |
Express-IBE2-i3-3217UE | COM Express® Basic Size Type 2 Module with Intel® Core™ i3-3217UE ULV at 1.6 GHz |
Express-IBE2-1020E | COM Express® Basic Size Type 2 Module with Intel® Celeron® 1020E at 2.2GHz |
Express-IBE2-1047UE | COM Express® Basic Size Type 2 Module with Inte® Celeron® 1047UE 1.4 GHz |
Express-IBE2-927UE | COM Express® Basic Size Type 2 Module with Intel® Celeron® 927UE 1.5 GHz |
Accessory | |
HTS-IBE2-B | Heatspreader for Express-IBE2 for bottom mounting |
THS-IBE2-BL | Low Profile Heatsink for Express-IBE2 for bottom mounting |
THSH-IBE2-BL | High Profile Heatsink for Express-IBE2 for bottom mounting |
THSF-IBE2-BL | High Performance Heatsink with Fan for Express-IBE2 for bottom mountning |