Express-KL/KLE
Vendor:ADLINK Technology Inc.
- Details
- Specification
- Order information
- 7th Gen Intel® Core™ 7000 series and Intel® Xeon® Processors
- Up to 32 GB Dual Channel DDR4 at 1867/2133 MHz supports both ECC and non-ECC memory)
- 3x DDI channels, 1x LVDS (or 4 lanes eDP), supports up to 3 independent displays
- Extreme Rugged operating temperature: -40°C to +85°C (build option for selected SKUs)
The Express-KL/KLE is a COM Express COM.0 R2.1 Basic Size Type 6 module supporting the 64-bit 7th Generation Intel Core and Xeon processor E3 (codename «Kaby Lake‑H») with Mobile Intel QM175, HM175, CM238 Chipset. The Express-KL/KLE is specifically designed for customers who need excellent graphics performance and high-level processing performance in a long product life solution.
The Express-KL/KLE features Intel Hyper-Threading Technology (up to 4 cores, 8 threads) and DDR4 dual channel memory at 2133/2400 MHz with ECC/non-ECC support determined by CPU/chipset combination to provide excellent overall performance. Intel Flexible Display Interface and Direct Media Interface provide high speed connectivity from the CPU to the Intel QM175, HM175, CM238 Chipset.
Integrated Intel Generation 9 Graphics includes features such as OpenGL 4.4/4.3/4.2, DirectX 11, Intel Clear Video HD Technology, Advanced Scheduler 2.0, 1.0, XPDM support, and DirectX Video Acceleration (DXVA) support for full H.265/HEVC 10-bit, MPEG2 hardware codec. In addition, High Dynamic Range is supported for enhanced picture color and quality and digital content protection has been upgraded to HDCP 2.2. Graphics outputs include LVDS and three DDI ports supporting HDMI/DVI/DisplayPort and eDP as a build option. The Express-KL/KLE is specifically designed for customers with high-performance processing graphics requirements who want to outsource the custom core logic of their systems for reduced development time.
The Express-KL/KLE has dual stacked SODIMM sockets supporting up to 32 GB of DDR4 ECC/non-ECC memory. In addition to the onboard integrated graphics, a multiplexed PCIe x16 graphics bus is available for discrete graphics expansion. Input/output features include a single onboard Gigabit Ethernet port, eight PCIe x1 Gen3 lanes, USB 3.0 ports and USB 2.0 ports, and SATA 6 Gb/s ports. Support is provided for SMBus and I2C. The module is equipped with SPI AMI EFI BIOS with CMOS backup, supporting embedded features such as remote console, hardware monitor, and watchdog timer.
| Technical specifications | |
|
Core System |
|
|---|---|
| CPU |
Mobile Intel® Xeon®, Core™ Processors - 14nm Xeon® E3-1505M v6 3.0/4.0GHz (Turbo), 45W (4C/GT2) Xeon® E3-1505L v6 2.2/3.0GHz (Turbo), 25W (4C/GT2) Core™ i7-7820EQ 3.0/3.7GHz (Turbo), 45W (4C/GT2) Core™ i5-7440EQ 2.9/3.6GHz (Turbo), 45W (4C/GT2) Core™ i5-7442EQ 2.1/2.9GHz (Turbo), 25W (4C/GT2) Core™ i3-7100E 2.9GHz (no Turbo), 35W (2C/GT2) Core™i3-7102E 2.1GHz (no Turbo), 25W (2C/GT2) Supports: Intel® VT, Intel® TXT, Intel® SSE4.2, Intel® HT Technology, Intel® 64 Architecture, Execute Disable Bit, Intel® Turbo Boost Technology 2.0, Intel® AVX2, Intel® AES-NI, PCLMULQDQ Instruction, Intel® Secure Key and Intel® TSX. Note: Availability of the features may vary between processor SKUs. |
| Memory | Dual channel 2133/2400 MHz DDR4 memory up to 32GB in dual SODIMM sockets (ECC/non-ECC support dependent on selected CPU/PCH) |
| Embedded BIOS | AMI EFI with CMOS backup in 16MB SPI BIOS with Intel® AMT 11.6 support |
| Cache | 8MB for Xeon® and Core™ i7, 6MB for Core™ i5, 3MB for Core™ i3 |
| PCH |
CM238 (supports ECC memory, Intel AMT) QM175 (supports non-ECC, Intel AMT) HM175 (supports non-ECC, no Intel AMT support) |
| Expansion Busses |
PCIe x16 or 2 PCIe x8 or 1 PCIe x8 with 2 PCIe x4 (Gen3) 6 PCI Express x1 (Gen3); AB connector, Lanes 0/1/2/3/4/5 2 PCI Express x2 (Gen3): CD connector, Lanes 6/7 LPC bus, SMBus (system), I2C (user) |
| Debug Headers | 40-pin flat cable connector for use with DB-40 debug module providing BIOS POST code LED, BMC access, SPI BIOS flashing, power testpoints, debug LEDs 60-pin XDP header for ICE debug of CPU/chipset |
|
Video |
|
| GPU Feature Support | Intel® Generation 9 LP Graphics Core Architecture, supporting 3 independent and simultaneous display combinations of DisplayPort/HDMI/LVDS or eDP outputs |
| Hardware encode/transcode |
HD content (including HEVC) DirectX 12, DirectX 11.2, DirectX 11.1, DirectX 11, DirectX 10.1, DirectX 10, DirectX 9 support OpenGL 4.4/4.3 and ES 2.0 support OpenCL 2.1, 2.0/1.2 support |
| Digital Display Interface | DDI1/2/3 supporting DisplayPort/HDMI/DVI |
| LVDS | Single/dual channel 18/24-bit LVDS from eDP-to-LVDS IC |
| eDP | 4 lane support optional, in place of LVDS |
|
Audio |
|
| Chipset | Intel® HD Audio integrated in chipset |
| Audio Codec | located on carrier Express-BASE6 (ALC886 standard supported) |
|
Ethernet |
|
| Ethernet | Intel® MAC/PHY: i219LM/V (LM with AMT 11.0 support possibility) Interface: 10/100/1000 GbE connection |
|
I/O Interfaces |
|
| USB | 4x USB v. 3.0 (USB 0,1,2,3) and 4x USB 2.0 (USB 4,5,6,7) |
| SATA | Four ports SATA 6Gb/s (SATA0,1,2,3) |
| Serial | 2 UART ports with console redirection |
| GPIO | 4 GPO and 4 GPI |
| Super I/O | Supported on carrier if needed (standard support for W83627DHG-P) |
| TPM |
Chipset: Infineon Type: TPM 2.0 |
|
Power |
|
| Standard Input | ATX = 12V±5% / 5Vsb ±5% or AT = 12V±5% |
| Wide Input | ATX = 8.5-20 V / 5Vsb ±5% or AT = 8.5 ~20V (Standard temp. only) |
| Management | ACPI 5.0 compliant, Smart Battery support |
| Power States: | C1-C6, S0, S1, S3, S4, S5 , S5 ECO mode (Wake-on-USB S3/S4, WOL S3/S4/S5) |
| ECO mode | Supports deep S5 mode for power saving |
|
Operating Systems |
|
| Standard Support | Windows 10 64-bit, Windows 10 IOT Enterprise 64-bit, Linux 64-bit, VxWorks |
| Extended Support (BSP) | Linux 64-bit, VxWorks |
|
Mechanical |
|
| Form Factor | PICMG COM.0, Rev 2.1 Type 6 |
| Dimension | Basic size, 125 mm x 95 mm |
| Intelligent Middleware SEMA® |
Local management, control of embedded computer systems Extended EAPI for monitoring, controlling and analytics applications Multiple OS support and across platforms (x86, ARM) |
|
Environmental and physical specifications |
|
| Operating Temperature |
Standard: 0°C to 60°C Extreme Ruggeed: -40°C to +85°C (build option) Note: “build option” indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product. Be aware that these “build option” part numbers will need to be newly created and this will result in production lead times. |
| Humidity |
5-90% RH operating, non-condensing 5-95% RH storage (and operating with conformal coating) |
| Shock and Vibration |
IEC 60068-2-64 and IEC-60068-2-27 MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D |
| HALT | Thermal Stress, Vibration Stress, Thermal Shock and Combined Test |
| Model | Description |
| Express‑KLE‑E3‑1505M v6 | Basic Size COM Express® Type 6 module with Intel® Xeon® E3-1505M v6 and GT2 level graphics, CM238 chipset |
| Express‑KLE‑E3‑1505L v6 | Basic Size COM Express® Type 6 module with Intel® Xeon® E3-1505M v6 and GT2 level graphics, CM238 chipset |
| Express‑KL‑i7‑7820EQ | Basic Size COM Express® Type 6 module with Intel® Core™ i7-7820EQ and GT2 level graphics, QM175 chipset |
| Express-KL-i5-7440EQ | Basic Size COM Express® Type 6 module with Intel® Core™ i5-7440EQ and GT2 level graphics, QM175 chipset |
| Express-KL-i5-7442E | Basic Size COM Express® Type 6 module with Intel® Core™ i5-7442EQ and GT2 level graphics, QM175 chipset |
| Express-KL-i3-7100E | Basic Size COM Express® Type 6 module with Intel® Core™ i3-7100E and GT2 level graphics, HM175 chipset |
| Express-KL-i3-7102E | Basic Size COM Express® Type 6 module with Intel® Core™ i3-7102E and GT2 level graphics, HM175 chipset |
| Accessories (Express-KL/KLE share the same accessories with Express-SL/SLE) | |
| HTS-SL-B | Heatspreader for Express-SL with threaded standoffs for bottom mounting |
| HTS-SL-BT | Heatspreader for Express-SL with through hole standoffs for top mounting |
| THS-SL-BL | Low profile heatsink for Express-SL with threaded standoffs for bottom mounting |
| THS-SL-BT | Low profile heatsink for Express-SL with through hole standoffs for top mounting |
| THSH-SL-BL | High profile heatsink for Express-SL with threaded standoffs for top mounting |
| THSF-SL-BL | High profile heatsink with Fan for Express-SL with threaded standoffs for bottom mounting |
| THSF-SL-BL-WT | High Performance heatsink with Fan for Express-SL Quad Core with threaded standoffs for bottom mounting |
| Starter Kit | |
| Starterkit-COM Express 6 PLUS | COM Express formfactor starter kit with Express-BASE6 board, power supply, and accessory kit |
