Express-TL
COM Express Basic Size Type 6 Module with Intel Core/Xeon/Celeron Processors
Vendor:ADLINK Technology Inc.
- Details
- Specification
- Order information
- Intel Core/Xeon/Celeron Processors
- Up to 128GB DDR4 SO-DIMM, non-ECC, ECC
- Intel Gen 12 Graphics Core Architecture
- Operating Temperature: -40°C to 85°C (Extreme Rugged)
ADLINK’s Express-TL COM Express Type 6 Basic size module is based on the 11th Gen Intel Core, Xeon W and Celeron 6000 processor, and is the first COM Express module to support PCI Express x16 Gen4, effectively doubling the bandwidth of previous generation COM Express modules. With a combined 8 cores, 16 threads, and up to 128GB memory, the Express-TL brings uncompromised system performance and responsiveness to your solution.
Featuring brand new Gen 12 Intel UHD Graphics and Intel AVX-512 Vector Neural Network Instructions (VNNI), the Express-TL provides AI inferencing performance as much as 3X higher compared to previous generation non-VNNI platforms. The integrated Gen 12 Intel UHD Graphics core can be configured to support one 8K independent display or four 4K independent displays (HDMI/DP/eDP). In addition, legacy display interfaces such as LVDS and analog VGA are still supported as build options.
Key features for today’s applications are support for 2.5 GbE and USB 3.2 with transfer rates of up to 10Gb/s that can transfer image data from cameras faster than previous generation products. Combined with 8 processor cores at 25W TDP, Intel AVX-512 VNNI, Intel OpenVINO toolkit and Intel UHD Graphics, the Express-TL is well suited for AI at the edge applications (AIoT/IoT).
| Technical specifications | |
|
Core System |
|
|---|---|
| CPU |
Intel Xeon, 11th Gen Intel Core, Intel Celeron Processors (Tiger Lake-H) Intel Xeon W-11865MRE, 2.6(4.7) GHz, 24MB, 45W(35W cTDP), 8C/16T Intel Xeon W-11865MLE, 1.5(4.5) GHz, 24MB, 25W, 8C/16T Intel Core i7-11850HE, 2.6(4.7) GHz, 24MB, 45W(35W cTDP), 8C/16T Intel Xeon W-11555MRE, 2.6(4.5) GHz, 12MB, 45W(35W cTDP), 6C/12T Intel Xeon W-11555MLE, 1.9(4.4) GHz, 12MB, 25W, 6C/12T Intel Core i5-11500HE, 2.6(4.5) GHz, 12MB, 45W(35W cTDP), 6C/12T Intel Xeon W-11155MRE, 2.4(4.4) GHz, 8MB, 45W(35W cTDP), 4C/8T Intel Xeon W-11155MLE, 1.8(3.1) GHz, 8MB, 25W, 4C/8T Intel Core i3-11100HE, 2.4(4.4) GHz, 8MB, 45W(35W cTDP), 4C/8T Intel Celeron 6600HE, 2.6GHz, 8MB, 35W, 2C/2T Supports: Intel VT, Intel VT-d, Intel TXT, Intel SSE4.2, Intel HT Technology, Intel 64 Architecture, Execute Disable Bit, Intel Turbo Boost Technology 2.0, Intel AVX-512, Intel AVX2, Intel AES-NI, PCLMULQDQ Instruction, Intel Secure Key and Intel TSX-NI. Notes: Availability of features may vary between processor SKUs. Some SKUs listed above are supported by project basis only. Please contact your ADLINK representative for availability. |
| Memory |
Dual channel up to 3200 MT/s DDR4 memory up to 128GB in four SODIMM sockets Two SO-DIMM on top side, two SO-DIMM on bottom side (3 or 4 socket build option dependent on carrier design) ECC support by Xeon CPU paired with RM590E PCH |
| Embedded BIOS | AMI UEFI with CMOS backup in 32MB SPI BIOS (dual BIOS by build option) |
| Cache | Xeon W-11865MRE / Core i7-11850HE: 24MB Xeon W-11555MRE / Core i5-11500HE: 12MB Xeon W-11155MRE / Core i3-11100HE / Celeron 6600HE: 8MB |
| Chipset |
Intel RM590E (support ECC, with Xeon CPU) Intel QM580E Intel HM570E |
| Expansion Busses |
PCIe x16 Gen4: Lanes 15-31 (configurable to one x16, two x8, one x8 + two x4) 6 PCIe x1 Gen3: Lanes 0/1/2/3 (configurable to x1, x2, x4) and Lanes 4/5 (x2, x1) 2 PCIe x1 Gen3: Lanes 6/7 (configurable to x2, x1) LPC bus (through an ESPI to LPC bridge IC), SMBus (system) , I2C (user) |
| SEMA Board Controller | Supports: Voltage/current monitoring, power sequence debug support, AT/ATX mode control, logistics and forensic information, flat panel control, general purpose I2C, watchdog timer, fan control and failsafe BIOS (dual BIOS by build option) |
| Debug Headers | 30-pin multipurpose flat cable connector for use with DB30-x86 debug module providing BIOS POST code LED, SEMA Board Controller access, SPI BIOS flashing, power testpoints, debug LEDs |
|
Video |
|
| GPU Feature Support |
Intel Gen 12 Graphics Core Architecture, supporting multiple independent and simultaneous display combinations of DisplayPort/HDMI/LVDS, eDP or VGA outputs (4x 4K60) Hardware encode/transcode of HD content (including HEVC) DirectX 12 support OpenGL 4.5, 4.4/4.3 and ES 2.0 support OpenCL 2.1, 2.0/1.2 support |
| Digital Display Interface |
DDI1/2/3 supporting DisplayPort/HDMI/DVI USB4 Maximum 2x USB4 by using DDI 1 and DDI2 Notes: USB4 is a build option (HW and BIOS) supported by project basis in place of DDI channels. USB4 support also requires re-timer and PD on carrier. |
| VGA | Supported by build option via DP-to-VGA IC (in place of DDI 3), max. resolution 1920x1200@60Hz |
| LVDS | Single/dual channel 18/24-bit LVDS from eDP-to-LVDS IC, max. resolution 1920x1200@60Hz in dual mode |
| eDP | Build option: 4 lane support, in place of LVDS |
|
Audio |
|
| Chipset | Intel HD Audio integrated on CPU |
| Audio Codec | On carrier Express-BASE6 (ALC886 standard support) |
|
Ethernet |
|
| Intel MAC/PHY | LAN controller i225 series (i225-IT feature TSN by build option |
| Interface |
2.5GbE and 1000/100/10 Mbit/s Ethernet connection GbE0_SDP available if TSN support enabled |
|
I/O Interfaces and storage |
|
| USB |
4x USB 3.2/2.0/1.1 (USB 0-3), 4x USB 2.0/1.1 (USB 4-7) Note: USB 3.1 Gen2 support dependent on carrier design |
| SATA | 4x SATA 6Gb/s (SATA 0-3) |
| On-board Storage | Soldered type PCIe based SSD (build option) |
| Serial | 2x UART ports with console redirection |
| GPIO/SD | 4x GPO and 4x GPI from EC (GPI with interrupt) |
| Super I/O | Supported on carrier if needed (standard support W83627DHG-P, other Super I/O supported by project basis) |
|
TPM |
|
| Chipset | Infineon |
| Type | TPM 2.0 (SPI based) |
|
Power |
|
| Standard Input | ATX = 12V ±5% / 5Vsb ±5% or AT = 12V ±5% |
| Wide Input | ATX = 8.5-20 V / 5Vsb ±5% or AT = 8.5-20V |
| Management | ACPI 5.0 compliant, Smart Battery support |
| Power States | C1-C6, S0, S1, S3, S4, S5, S5 ECO mode (Wake on USB S3/S4, WOL S3/S4/S5) |
| ECO mode | Supports deep S5 mode for power saving |
|
Other |
|
| Form Factor | PICMG COM.0: Rev 3.0 Type 6 |
| Dimension | Basic size: 125 mm x 95 mm |
| Operating Systems |
Standard Support: Windows 10 IoT Enterprise 64-bit, Yocto project based Linux 64-bit, VxWorks 64-bit (TBC) Extended Support (BSP): Yocto project based Linux 64-bit |
|
Environmental and physical specifications |
|
| Operating temperature |
Standard: 0°C to 60°C (storage: -20°C to 80°C) Extreme Rugged: -40°C to 85°C (storage: -40°C to 85°C, build option, selected SKUs, TBC) |
| Humidity |
5-90% RH operating, non-condensing 5-95% RH storage (and operating with conformal coating) |
| Shock and Vibration |
IEC 60068-2-64 and IEC-60068-2-27 MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D |
| HALT | Thermal Stress, Vibration Stress, Thermal Shock and Combined Test |
| Model | Description |
| Express‑TL‑i7‑11850HE | Basic size type 6 COM Express module with 11th Gen Intel Core i7-11850HE octa core processor with QM580E chipset, 3 SO-DIMM |
| Express-TL-i5-11500HE | Basic size type 6 COM Express module with 11th Gen Intel Core i5-11500HE hexa core processor with QM580E chipset, 2 SO-DIMM |
| Express-TL-i3-11100HE | Basic size type 6 COM Express module with 11th Gen Intel Core Core i3-11100HE quad core processor with HM570E chipset, 2 SO-DIMM |
| Express‑TL‑W‑11865MRE | Basic size type 6 COM Express module with Intel Xeon W-11865MRE octa core processor with RM590E chipset, 3 SO-DIMM |
| Express-TL-W-11865MLE | Basic size type 6 COM Express module with Intel Xeon W-11865MLE octa core processor with RM590E chipset, 3 SO-DIMM |
| Accessories | |
| HTS-TL-B | Heatspreader for Express-TL with threaded standoffs for bottom mounting |
| HTS-TL-BT | Heatspreader for Express-TL with through hole standoffs for top mounting |
| THS-TL-BL | Low profile heatsink for Express-TL with threaded standoffs for bottom mounting |
| THS-TL-BTL | Low profile heatsink for Express-TL with through hole standoffs for top mounting |
| THSH-TL-BL | High profile heatsink for Express-TL with threaded standoffs for bottom mounting |
| THSF‑TL‑BL | High profile heatsink with Fan for Express-TL with threaded standoffs for bottom mounting |
