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OSM-MTK510

OSM R1.1 Size-L module based on MediaTek Genio 510 series processor
  • Details
  • Specification
  • Order information
  • Hexa-core MediaTek Genio 510 SoC with 2x Arm Cortex-A78 and 4x Arm Cortex-A55
  • MediaTek DLA+VPU AI engine up to 3.2 TOPS
  • Up to 8 LPDDR4, up to 128GB eMMC
  • Operating temperature: -40°C to +85°C (max.)

The OSM-MTK510 is an OSM R1.1 Size-L module featuring the advanced MediaTek Genio 510 series processor. Equipped with a dual-core Arm Cortex-A78 and a quad-core Cortex-A55, it boasts an impressive MediaTek DLA+VPU AI engine capable of up to 3.2 TOPS, making it ideal for edge AI applications. This module excels in providing edge AI processing at ultra-low power consumption.

Supporting a variety of graphic outputs including HDMI/DP, eDP, and DSI, and comprehensive connectivity options such as 1x GbE, I2S audio codec interface, 1x USB 3.0, and 2x USB 2.0 interfaces, the OSM-MTK510 is versatile and robust. It also includes 17x GPIO and ensures long-term availability with a 10-year product lifecycle.

Designed to meet the highest safety standards with an integrated security island, the OSM-MTK510 is available in rugged operating temperature options ranging from −40°C to 85°C. This makes it the perfect solution for demanding edge AI applications, where reliability and performance are paramount.

Technical specifications

System

SoC Genio 510 with dual-core Cortex-A78 and quad-core Cortex-A55
Ethos U-VP6 AI processing unit
Memory 2/4/8 GB LPDDR4L
L2 Cache 512 KB system L2 cache (ECC)
Security Resource Domain Controller (RDC) supports 4 domains and up to 8 regions of DDR
Arm TrustZone (TZ) architecture: Cortex-A53 MPCore TrustZone support
On-chip RAM (OCRAM) secure region protection using OCRAM controller
High Assurance Boot (HAB)
Cryptographic Acceleration and Assurance Module (CAAM)
Capable to support Widevine and PlayReady content protection
Public Key Cryptography (PKHA) with RSA and Elliptic Curve (ECC) algorithms
Real-time Integrity Checker (RTIC)
DRM support for RSA, AES, 3DES, DES
Side-channel attack resistance
True random number generation (RNG)
Manufacturing protection support / Secure Non-Volatile Storage (SNVS)
Audio Codec I2S audio codec located on carrier

Video

GPU Core Arm Mali-G57 MC2 GPU
HDMI HDMI 2.0a
MIPI DSI 1x MIPI DSI 4 lanes
eDP Dual-channel LVDS port, 18/24-bit
Camera MIPI CSI RX Interface:
Compatible with the MIPI Alliance Interface Specification v1.0
Up to 4 data lanes, with a maximum data rate of 1.0 Gbps per lane
Supports MIPI-HS, MIPI-LP modes

System Storage

SDIO 2x SDIO (4-bit), compatible with SD/SDIO standard, up to version 3.0
eMMC 32, 64, or 128 GB (build option)
Compatible with eMMC specifications 4.41, 4.51, 5.0, and 5.1
Flash SPI NOR flash (build option)

Ethernet

Primary LAN MAC 10/100/1000 RGMii interface

Extension Buses

USB 1x USB 3.0, 2x USB 2.0
UART 4x UART interfaces (UART A has TX/RX/CTS/RTS)
SPI 3x SPI interfaces
I2S 2x I2S interfaces with audio resolution from 16-bits to 32-bits and sample rate up to 192kHz (see Audio Codec support)
I2C 3x I2C interfaces
GPIO 17x GPIOs with interrupts

Power

Input 5Vdc +/-5%

Operating Systems

Standard Support Yocto Linux BSP, Android (by project)
Extended Support (BSP) Foundries.IO Linux microPlatform (LMP)

Mechanical

Form Factor SGeT OSM revision 1.1
Dimensions OSM Size-L (Large) module 45 mm x 45 mm

Environmental and physical specifications

Operating Temperature Standard: 0°C to 60°C
-40°C to 85°C (optional)
Humidity 5-90% RH operating, non-condensing
5-95% RH storage (and operating with conformal coating)
Shock and Vibration IEC 60068-2-64 and IEC-60068-2-27, MIL-STD-202 F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D
HALT Thermal Stress, Vibration Stress, Thermal Shock and Combined Test
Model Description
OSM‑MTK510‑2G‑32G‑CT OSM Size-L module with Genio 510 SOC, NPU, 2 GB LPDDR4, 32 GB eMMC, 0°C to 60°C
OSM‑MTK510‑4G‑32G‑ER OSM Size-L module with Genio 510 SOC, NPU, 4 GB LPDDR4, 32 GB eMMC, -40°C to 85°C
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