Vendor:
The OSM-MTK510 is an OSM R1.1 Size-L module featuring the advanced MediaTek Genio 510 series processor. Equipped with a dual-core Arm Cortex-A78 and a quad-core Cortex-A55, it boasts an impressive MediaTek DLA+VPU AI engine capable of up to 3.2 TOPS, making it ideal for edge AI applications. This module excels in providing edge AI processing at ultra-low power consumption.
Supporting a variety of graphic outputs including HDMI/DP, eDP, and DSI, and comprehensive connectivity options such as 1x GbE, I2S audio codec interface, 1x USB 3.0, and 2x USB 2.0 interfaces, the OSM-MTK510 is versatile and robust. It also includes 17x GPIO and ensures long-term availability with a 10-year product lifecycle.
Designed to meet the highest safety standards with an integrated security island, the OSM-MTK510 is available in rugged operating temperature options ranging from −40°C to 85°C. This makes it the perfect solution for demanding edge AI applications, where reliability and performance are paramount.
| Technical specifications | |
|
System |
|
|---|---|
| SoC |
Genio 510 with dual-core Cortex-A78 and quad-core Cortex-A55 Ethos U-VP6 AI processing unit |
| Memory | 2/4/8 GB LPDDR4L |
| L2 Cache | 512 KB system L2 cache (ECC) |
| Security |
Resource Domain Controller (RDC) supports 4 domains and up to 8 regions of DDR Arm TrustZone (TZ) architecture: Cortex-A53 MPCore TrustZone support On-chip RAM (OCRAM) secure region protection using OCRAM controller High Assurance Boot (HAB) Cryptographic Acceleration and Assurance Module (CAAM) Capable to support Widevine and PlayReady content protection Public Key Cryptography (PKHA) with RSA and Elliptic Curve (ECC) algorithms Real-time Integrity Checker (RTIC) DRM support for RSA, AES, 3DES, DES Side-channel attack resistance True random number generation (RNG) Manufacturing protection support / Secure Non-Volatile Storage (SNVS) |
| Audio Codec | I2S audio codec located on carrier |
|
Video |
|
| GPU Core | Arm Mali-G57 MC2 GPU |
| HDMI | HDMI 2.0a |
| MIPI DSI | 1x MIPI DSI 4 lanes |
| eDP | Dual-channel LVDS port, 18/24-bit |
| Camera |
MIPI CSI RX Interface: Compatible with the MIPI Alliance Interface Specification v1.0 Up to 4 data lanes, with a maximum data rate of 1.0 Gbps per lane Supports MIPI-HS, MIPI-LP modes |
|
System Storage |
|
| SDIO | 2x SDIO (4-bit), compatible with SD/SDIO standard, up to version 3.0 |
| eMMC |
32, 64, or 128 GB (build option) Compatible with eMMC specifications 4.41, 4.51, 5.0, and 5.1 |
| Flash | SPI NOR flash (build option) |
|
Ethernet |
|
| Primary LAN | MAC 10/100/1000 RGMii interface |
|
Extension Buses |
|
| USB | 1x USB 3.0, 2x USB 2.0 |
| UART | 4x UART interfaces (UART A has TX/RX/CTS/RTS) |
| SPI | 3x SPI interfaces |
| I2S | 2x I2S interfaces with audio resolution from 16-bits to 32-bits and sample rate up to 192kHz (see Audio Codec support) |
| I2C | 3x I2C interfaces |
| GPIO | 17x GPIOs with interrupts |
|
Power |
|
| Input | 5Vdc +/-5% |
|
Operating Systems |
|
| Standard Support | Yocto Linux BSP, Android (by project) |
| Extended Support (BSP) | Foundries.IO Linux microPlatform (LMP) |
|
Mechanical |
|
| Form Factor | SGeT OSM revision 1.1 |
| Dimensions | OSM Size-L (Large) module 45 mm x 45 mm |
|
Environmental and physical specifications |
|
| Operating Temperature |
Standard: 0°C to 60°C -40°C to 85°C (optional) |
| Humidity |
5-90% RH operating, non-condensing 5-95% RH storage (and operating with conformal coating) |
| Shock and Vibration | IEC 60068-2-64 and IEC-60068-2-27, MIL-STD-202 F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D |
| HALT | Thermal Stress, Vibration Stress, Thermal Shock and Combined Test |
| Model | Description |
| OSM‑MTK510‑2G‑32G‑CT | OSM Size-L module with Genio 510 SOC, NPU, 2 GB LPDDR4, 32 GB eMMC, 0°C to 60°C |
| OSM‑MTK510‑4G‑32G‑ER | OSM Size-L module with Genio 510 SOC, NPU, 4 GB LPDDR4, 32 GB eMMC, -40°C to 85°C |
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