DLAP-4100 Series
Vendor:ADLINK Technology Inc.
- Details
- Specification
- Order information
- 15/14/13/12th Gen Intel Core i9/i7/i5/i3 processors and Q670 chipset, up to 65W
- Dual-channel DDR5 4800 MHz memory up to 64 GB
- Three independent display: HDMI 2.0b, HDMI 1.4b, DP 1.4a
- Operating temperature: -20°C to +50°C
ADLINK’s DLAP series provides robust, compact, industrial-grade fanless platforms, purpose-built for AI-based applications in challenging environments. These systems are equipped with powerful Intel processors and provide advanced AI capabilities, making them suitable for a wide range of applications in retail, parking, agriculture, and manufacturing. With an emphasis on SWaP (Size, Weight, and Power) optimization, these platforms are designed to excel in industrial and embedded settings, ensuring exceptional durability under extreme temperatures, shocks, and humidity.
The DLAP-4100, featuring 15th/14th/13th/12th Gen Intel Core i9/i7/i5/i3 processors and Q670 chipset with up to 65W TDP, delivers exceptional performance for compute-intensive Edge AI workloads. It supports dual-channel DDR5 4800 MHz memory up to 64GB and provides flexible connectivity with three independent display outputs (HDMI 2.0b, HDMI 1.4b, DP 1.4a) and dual GbE ports (1×1GbE, 1×2.5GbE).
For AI acceleration, the DLAP-4100 supports GPU cards such as NVIDIA RTX series or Intel ARC graphics via its PCIe GEN5×16 slot, enabling advanced AI computing power for real-time inference, machine vision, and video analytics applications. Additionally, the DLAP-4100 is compatible with Hailo-8 M.2 AI acceleration modules, delivering up to 26 TOPS of performance with exceptional power efficiency. These modules support standard AI frameworks like TensorFlow, ONNX, PyTorch, and Keras, and are ideal for low-latency, multi-stream inference at the edge.
The platform’s expandability includes 4x USB 3.2 Gen2, 2x USB 2.0, 1x M.2 B-key, 1x M.2 E-key, and 2x M.2 M-key slots, ensuring seamless integration of AI accelerators, wireless modules, and storage devices. This flexibility makes the DLAP-4100 a versatile solution for diverse AI edge deployments.
| Technical specifications | |
|
System |
|
|---|---|
| GPU | Support NVIDIA RTX 6000 ADA, RTX 4000 ADA, Intel ARC B580 |
| CPU | 15/14/13/12th Gen Intel Core i9/i7/i5/i3 Processor, 35W/65W Processor |
| Chipset | Intel Q670 Chipset |
| RAM | DDR5 4800MHz (up to 64GB), 2x SODIMM |
| Storage | 2x 2.5" SATA 6Gb/s drive bays |
| OS | Windows 10/11 IoT LTSC, Ubuntu 22.04 |
|
I/O Interfaces |
|
| Display |
1x DP 1.4a, DP++ 1x HDMI 2.0b 1x HDMI 1.4b |
| Ethernet |
1x 2.5GbE Intel i226-V 1x GbE Intel i219-LM |
| Serial Ports | 2x RS-232/422/485 (DB9 connector) |
| USB |
4x USB3.2 Gen2 2x USB 2.0 |
| M.2 |
1x M.2 2230 E-key (PCIe Gen3 x1) 1x M.2 3042/3052 B-key (PCIe Gen3 x1 / USB3) 1x M.2 2242 M-key, NVMe/SATA (PCIe Gen3 x4 / SATA ) 1x M.2 2242/2280 M-Key, NVMe (PCIe Gen3 x4) |
| Digital IO | 8-bit GPIO |
| Audio | Line-out, MIC-IN |
| TPM 2.0 | Yes |
| Expansion slot | 1x PCIe Gen5 x16 |
|
Power |
|
| AC Input | 100-240 AC input (500W) |
|
Mechanical |
|
| Dimensions | 230 (W) x 300 (D) x 150 (H) mm |
| Weight | 7 kg |
| Mounting | Wall mount |
|
Environmental and physical specifications |
|
| Operating Temperature | -20°C to 50°C |
| Storage Temperature | -40°C to 85°C (-40°F to 185°F) (excl. storage) |
| Humidity | ~95% @ 40°C (non-condensing) |
| Operating Vibration | 1 Grms, random, 5-500 Hz, 3 axes (w/ SSD) |
| Operating and Package (NON-OP) shock | 20G, half sine 11ms duration (w/SSD) |
| EMC | EN61000-6-4/-2, CE & FCC Class B |
| Safety | UL/cUL, CB |
| Model | Description |
| 93‑45202‑00 | DLAP-4107R/M16G, i7-13700E, 16GB |
| 93‑45202‑10 | DLAP-4105R/M16G/S128GB, i5-13500E, 16GB, 128GB SSD |
| 93‑45202‑20 | DLAP-4105RF/M16G, i5-14500, 16G |
