DLAP-411-Orin Supreme
Vendor:ADLINK Technology Inc.
- Details
- Specification
- Order information
- Phison’s aiDAPTIV+ AI technology to bypass edge memory up to 320GB
- Elevated AI power
- Compact fanless system 175 x 145 x 85 mm
- Operating temperature: -20°C to +60°C (max.)
ADLNK DLAP-411-Orin Supreme series, the Edge GenAI Platform, powered by NVIDIA Jetson AGX Orin and integrated with Phison’s innovative aiDAPTIV+ AI solution, is a high-performance platform designed for deployment of AI-powered systems at the edge, providing the computing power needed for demanding AI applications.
DLAP-411-Orin Supreme series overcomes memory limitations in edge generative AI applications, significantly enhancing AI computing capabilities on edge devices.
Without increasing high hardware costs, the DLAP Supreme series achieves notable AI performance improvements, helping enterprises reduce the cost barriers of AI deployment and accelerating the adoption of generative AI across various industries, especially in edge computing.
| Technical specifications | |
|
System |
|
|---|---|
| AI Performance |
200 TOPS 275 TOPS |
| GPU |
NVIDIA Ampere architecture with 1792 NVIDIA CUDA cores and 56 Tensor Cores NVIDIA Ampere architecture with 2048 NVIDIA CUDA cores and 64 Tensor Cores |
| CPU |
8-core Arm Cortex-A78AE v8.2 64-bit CPU, 2MB L2 + 4MB L3 12-core Arm Cortex-A78AE v8.2 64-bit CPU, 3MB L2 + 6MB L3 |
| aiDAPTIV+ | Phison AI100E M.2 SSD |
| RAM |
32GB 256-bit LPDDR5 64GB 256-bit LPDDR5 |
| Storage | 64GB eMMC 5.1 |
| Thermal sensor | 1x Thermal sensor |
| WDT | WDT supported |
| OS | Linux Ubuntu |
|
Front I/O Interfaces |
|
| Button | 1x power, 1x reset, 1x recovery |
| HDMI | 1x HDMI (Max. resolution 3840x2160 @ 60Hz) |
| USB | 4x USB 3.2 Gen2 Type-A |
| Ethernet | 4x 10/100/1000Mbps Ethernets (Optional PoE support, IEEE 802.3af/at) |
| Audio | Mic-in (Mono), Line-out (Stereo) |
| I/O Connector | 2x D-sub 26-pin connector (GPIO, I2C, SPI) provide cable for expansion |
| LED indicator | 6x user defined LEDs |
|
Back I/O Interfaces |
|
| USB | 1x USB 3.2 Gen2 Type-C (OTG) |
| Serial Port | 1x COM RS-232/RS-422/RS-485 (DB9) |
| CAN Bus | 1x 2.0b, isolated (DB9) |
|
Extension Slots |
|
| M.2 | M.2 for SSD |
| SD Card | 1x MicroSD Slot |
| Out-Of-Band (OOB) | Support Ethernet and Wifi, monitoring and managing at remote locations (thermal sensor, remote power on/off, restart, monitor debug port detection device status.) |
|
Power Supply |
|
| DC Input | 24V |
| AC Input | 160 up to 220W power adapter |
| Power switch | 1x Power ON/OFF Button (AT/ATX, Default: AT) |
|
Mechanical |
|
| SMA Antenna Connector | 6 |
| Dimensions | 175 x 145 x 85 mm |
| Weight | 2.2 kg |
| Mounting | VESA, DIN rail (optional) |
|
Environmental and physical specifications |
|
| Operating Temperature |
For 32GB: -20°C to 60°C with 0.6m/s airflow, at 40W (without wifi module, M.2 SSD) -20°C to 55°C with 0.6m/s airflow, at MAXN (without wifi module, M.2 SSD) For 64GB: -20°C to 55°C with 0.6m/s airflow, at 50W (without wifi module, M.2 SSD) -20°C to 40°C with 0.6m/s airflow, at MAXN (without wifi module, M.2 SSD) |
| Storage Temperature | -40°C to +85°C (-40˚F to 185˚F) |
| Operating Humidity | ~95% @40°C (non-condensing, optional with fanless solution) |
| Vibration | Operating 5Grms, 5-500Hz, 3 axes w/M.2 SSD |
| Shock | Operating 100G, half sine 11ms duration w/ SD, M.2 SSD |
| ESD | Contact ± 4kV, Air ± 8kV |
| Regulation | CE & FCC class B, (EN61000-6-4/-6-2), CE-LVD & UL by CB, FCCID |
| Model | Description |
| 93‑45108‑1110 | DLAP-411-Orin 32GB Supreme |
| 93‑45108‑3110 | DLAP-411-Orin 64GB Supreme |
