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DLAP-8100 Series

AI IPC with 15th/14th/13th/12th Intel Core Processor
  • Details
  • Specification
  • Order information
  • Intel 15th/14th/13th/12th-Gen Core 35W/65W LGA1700 CPU
  • Up to 192GB DDR5 4800MHz (4x SODIMM slots)
  • Supports NVIDIA RTX A6000E 350W GPU with full speed Gen4 x16 signal
  • Operating temperature: -20°C to +60°C

ADLINK’s DLAP series provides robust, compact, industrial-grade fanless platforms, purpose-built for AI-based applications in challenging environments. These systems are equipped with powerful Intel processors and provide advanced AI capabilities, making them suitable for a wide range of applications in retail, parking, agriculture, and manufacturing. With an emphasis on SWaP (Size, Weight, and Power) optimization, these platforms are designed to excel in industrial and embedded settings, ensuring exceptional durability under extreme temperatures, shocks, and humidity.

The DLAP-8100 is a high-performance Edge AI platform, featuring 15th/14th/13th/12th Gen Intel Core 35W/65W LGA1700 CPUs and supporting up to 192GB DDR5 4800MHz memory via four SODIMM slots. Designed for compute-intensive AI workloads, the system accommodates a full-speed NVIDIA RTX A6000E 350W GPU with a PCIe Gen4×16 interface, enabling unparalleled AI inference and training capabilities at the edge.

For rich I/O, the DLAP-8100 includes 2x DP++, 2x HDMI, 3×2.5GbE, 4x COM ports, 8DI, 8DO, 4x USB 3.2, and 2x USB 3.1. It also supports up to four hot-swappable 2.5″ SATA 6 Gb/s drives with RAID 0/1/5/10 configurations, ensuring reliable and flexible data management for high-throughput applications.

Expansion is further enhanced with 1x M.2 2230 Key E (PCIe Gen3×1) for wireless modules or additional edge connectivity. The DLAP-8100 is the ideal platform for demanding edge AI scenarios such as industrial automation, video analytics, and smart manufacturing, delivering robust compute power and rich connectivity in a compact, industrial-grade form factor.

Technical specifications

System

CPU Intel 15/14/13/12th-Gen Core 35W/ 65W LGA1700 CPU
Chipset R680E
RAM Up to 192GB DDR5 4800MHz (4x SODIMM slots)
Storage 2.5" SATA, 4x external swappable trays (3x SATA III and 1x USB-to-SATA)

I/O Interfaces

Display 2x DP++ and 2x HDMI
Ethernet 3x 2.5GBE with TSN supported (i225)
1x vPro supported
Serial Ports COM1/2: RS-232/422/485, COM3/4: RS-232
USB 4x USB 3.2 Gen2 (Type A)
2x USB 3.2 Gen1 (Type A)
Audio Line-out, Mic-IN
M.2 1x M.2 2230 Key E (PCIe Gen3 x1)
1x M.2 3042/3052 Key B (PCIe Gen3 x1 / USB3)
1x M.2 2280 Key M, NVMe/SATA (PCIe Gen3 x4 / SATA )
Digital IO 8-ch DI and 8-ch DO
TPM 2.0 Yes
Expansion slots 1x PCIe Gen4 x16 (2-slots)
1x PCIe3.0 x1
2x PCIe3.0 x8 (Signal x4)

Power

AC Input 100-240 VAC

Mechanical

Dimensions 210 (W) x 210 (D) x 350 (H) mm (8.27" x 8.27” x 13.8”)
Weight 10 kg
Mounting Wall mount

Environmental and physical specifications

Operating Temperature -20°C to 60°C (without PEG card)
Storage Temperature -40°C to 85°C (-40°F to 185°F) (excluding storage)
Humidity ~95% @ 40°C (104°F) (non-condensing)
Operating Vibration 2 Grms, 5-500 Hz, 3 axes (w/ SSD/CFast)
Operating shock 20G, half sine 11ms duration (w/ SSD/CFast)
ESD Contact ±4KV, Air ±8KV
EMC EN61000-6-4/-2, CE & FCC Class B
Safety UL/cUL, CB
Model Description
DLAP‑8109R/M32G i9-13900E, 32GB, 2x DP, 2x HDMI, 3x LAN, 4x COM, 6x USB3.0
DLAP‑8107R/M32G i7-13700E, 32GB, 2x DP, 2x HDMI, 3x LAN, 4x COM, 6x USB3.0
DLAP‑8105R/M32G i5-13500E, 32GB, 2x DP, 2x HDMI, 3x LAN, 4x COM, 6x USB3.0
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