new Jasper
Jasper Rugged COM Express Type 6 Carrier Board and SBC with Rich I/O and Expansion Jasper is a COM Express carrier board and SBC for Type 6 Basic (125×95mm) and Compact (95×95mm) modules. It is designed for applications that require ruggedness, a high level of I/O, or extended product lifetime. Notable features of Jasper include: Rugged mechanical design with thicker PCB and latching connectors Wide temperature operation — up to −40 to +85C (depending on the installed COM) Built-in 16-bit data acquisition circuit with autocalibration Dual minicard sockets with PCIe and USB interfaces Dual M.2 sockets for flash memory and network connectivity PCIe/104 expansion socket supporting x16 and x1 links Jasper is available as a carrier board alone, for user integration with a COM of your choice, or as a ready to run «single-board computer» with an 11th generation Intel Xeon processor COM installed. Both Windows and Linux OS support are standard, while other OS support is available upon request. Flexible Design to Fit Any Application The most popular I/O on Jasper is provided on a single row of connectors along the front edge of the PCB. This arrangement supports dual connection modes. First Jasper can be used with traditional cables, with each cable providing a positive locking feature for increased shock and vibration resistance. Secondly the single row of connectors makes it easy to design and build I/O connector boards that match the end application’s exact requirements. For example a connector board with commercial connectors (RJ-45, USB type A, etc.) or MIL-DTL-38999 rugged circuit connectors can be plugged directly into the Jasper I/O connectors to create a «cable-free» solution. Such a connector board can dramatically reduce assembly time and cost for the end system. Rugged design Jasper was designed from the ground up with a comprehensive set of features to meet the challenges of rugged environments and applications: The 50% thicker PCB increases rigidity and improves reliability of fine pitch and high-ball-count BGA solder joints Almost all I/O connectors are positive latching (not friction lock) for increased ruggedness A bottom-side heat spreader provides more efficient cooling than a traditional heat sink All components are rated and/or tested to ensure reliable −40 to +85 o C operation Thermal Dissipation Jasper supports installation of the COM and its heat spreader on the bottom side of the carrier. This enables more efficient mounting and heat dissipation, since the COM’s heat is directly coupled to the enclosure body instead of relying on a top-side heat sink to dissipate heat into the air inside. Jasper’s mounting plate surrounds the COM heat spreader to provide mounting stability for the entire board assembly. I/O Expansion Jasper includes dual PCIe minicard sockets with both PCIe and USB interfaces, supporting a wide range of I/O and communications/networking modules from Diamond as well as third party vendors. It includes an M.2 E key socket for installation of wifi and other networking modules. The PCIe/104 socket enables use with PCIe/104 Type 1 I/O modules using x1, x4, x8, and x16 PCIe links (depending on the capability of the installed COM) as well as PCIe/104 OneBank modules using the x1 lanes on the first connector bank. Cable Kit The Jasper cable kit includes cables for all I/O and features on the board. All cables except for SATA have positive latching feature for resistance to shock and vibration.
new Osbourne
Osbourne Carrier and Dev Kit for NVIDIA Jetson AGX Orin Osbourne is a versatile carrier board for the NVIDIA Jetson AGX Orin high-performance GPU module. It provides access to all I/O features of the Orin module and includes numerous sockets for I/O expansion. Osbourne has been designed to be used in almost any application ranging from commercial to industrial to airborne to rugged military use. Key highlights of Osbourne include: Industry-standard camera adapter socket for use with a wide range of CSI, GMSL, and other cameras 10Gb Ethernet + 1GB Ethernet ports Wide temperature operation — matching the range of the Orin module Dual minicard sockets with PCIe and USB interfaces Dual M.2 sockets for flash memory (M key 2242/2280) and network connectivity (E key 2230) I/O concentrator connector enables use with standard and custom I/O breakout boards Osbourne is available as a carrier board alone or with an Orin module and fan sink installed and ready for use. A Linux OS based on Nvidia L4T and customized to support all I/O on Osbourne is available for free download. Flexible I/O Connector Design All I/O on Osbourne is accessed through a single high-speed, high-density connector along the board edge. This decouples the board design from any specific I/O connector arrangement and frees you to select whatever I/O connector scheme you want. Standard connector boards are available for typical use cases, including a panel-mount connector board for installation in an enclosure and a breakout board for use with cables. Panel I/O Board The Panel I/O board provides the ability to install Osbourne directly into an enclosure without the use of cables. All I/O is provided on a series of commercial-style connectors designed to be mounted in an enclosure front panel. Panel I/O boards can also be designed with right-angle orientation. I/O Expansion Osbourne includes dual PCIe minicard sockets with both PCIe and USB interfaces, supporting a wide range of I/O and communications/networking modules from Diamond as well as third party vendors. It includes an M.2 E key socket for installation of WiFi and other networking modules. Mass storage is provided with an M.2 2242/2280 NVME socket and a Micro-SD card socket.
new Floyd SC
Floyd SC Compact Expandable Carrier Board for Nvidia Jetson Nano / NX / TX2 NX GPU Modules The Floyd SC compact carrier board converts the Nvidia Jetson Nano / TX2 NX / Xavier NX modules into complete embedded systems by providing interface circuitry, I/O connectors for all module features, camera interfaces, power supply, and additional I/O in a solution measuring only 4.3×3.3" / 110×85mm. A novel expansion I/O connector enables connection of standard and custom daughterboards with additional I/O functionality to simplify the development of customized Jetson solutions. Floyd SC features up to 3 CSI camera inputs, 2 Gigabit Ethernet ports, 2 USB 2.0 ports, 1 USB 3.0 port, 1 RS-232 and 1 RS-232/485 serial port, 16 GPIO, and HDMI + DP display support. With the NX module installed a second Ethernet port and a CAN port are available. An M.2 M-Key NVME socket supports both 2242 and 2280 size I/O and flash storage modules. Wide voltage input 7-24V provides adaptability to a range of power supplies. Floyd SC is available in two configurations: a low-cost model with reduced features for Nano and a full-featured model with complete features supporting NX and TX2 NX. Floyd SC is supported by a full Linux BSP based on NvidiaNvidia’s Jetpack. This software is available as a free download from our support area. Floyd SC is available as both a carrier board component and as an assembled subsystem including the selected Jetson module with Linux OS installed. Both heat sink and fan sink cooling options are available. Product Configurations Floyd SC is available in a cost-optimized configuration for the Nano module and a full-featured configuration for the TX2-NX and NX modules. The full-featured model can also work with the Nano, however some features are unavailable due to not being present on the module. I/O Expansion Connector A flex cable connector on model BB02 enables additional I/O expansion with off the shelf or custom-developed daughterboards. The connector offers USB 3.0 and PCIe connectivity to the Jetson module, as well as power. Because an I/O daughterboard is much quicker and easier to design than a full-custom carrier board, Floyd SC makes it easy to design customized Jetson solutions with additional I/O. For example, additional USB 3.0 ports, additional Ethernet ports, an Ethernet switch, or even a PoE PD circuit can all easily be implemented on a daughterboard and directly connected to the Jetson module using a native high-speed I/O interface. Daughterboards typically are the same size as the main board and mount directly underneath the main board for convenient packaging. Subassembly Options Floyd SC is available as a complete computing board-level subsystem with Jetson module, heat sink, and Linux OS installed. These subsystems save time by eliminating the assembly, programming, and testing effort. Complete Systems Floyd SC is available as a JetBox system with Jetson module and Linux OS installed, ready to load your application and deploy. All main board I/O, including the I/O on the pin headers, is brought out to the front panel using familiar commercial connectors. Cables Most Floyd I/O other than the camera inputs is available using commercial connectors located along the front edge of the board. This arrangement simplifies the design of enclosures. The second serial port, GPIO signals, and CAN port (available with NX module only) do require cables. All front-facing I/O cables for Floyd SC are industry standard, including Ethernet, HDMI, DisplayPort, and USB. Camera interface cables are generally included with the camera. Other I/O connections require custom cables. A cable kit is available with these custom cables: CK-FLDSC-01 includes the following cables: 6980524 External battery cable, discrete wires 6981075 Dual serial port DB9M 6981164 Cable, IDC20F to IDC20F, 2mm pitch, 12″ length 6981182 CANbus 2.0 cable, JST 1×4 to DB9M C-20-18 20-conductor ribbon cable, 2×10 .1″ IDC sockets For convenient access to the GPIO and utility signals during development, a screw terminal board is available from third party suppliers. Heat Sink The Jetson modules can consume significant power under heavy load and require cooling. Diamond Systems offers a passive heat sink and active fan sink specifically designed for use on Floyd SC. The fan on the fan sink is controlled automatically by the Linux OS and also by a DSC-supplied utility program. Power Input Power is provided via a barrel jack with 5.5mm OD / 2.5mm ID dimensions. The input voltage range is 10.8-25.2VDC (supports 7V +/-5% and 24V +/-5% input voltages). A minimum 30W power supply is recommended to support peak power of the carrier, Jetson module, and attached I/O devices and provide a suitable safety margin. Diamond AC adapter PS-12V-03 provides 12V / 5A DC power with the required mating plug and an IEC 3 prong input power plug. A US AC power cord is included.
new Epsilon-8130
Epsilon-8130 Managed 8-Port Gigabit Ethernet Switch with embedded layer 2 software Epsilon-8130 is a managed Layer 2+ Ethernet switch module offering eight 10/100/1000Mbps copper twisted pair ports in the compact PC/104 form factor. It is designed for rugged applications including industrial and on‑vehicle. EPS-8130 is a direct replacement for the previous EPS-8100 and is fully backwards compatible with the previous product in all key respects. Epsilon-8130 is a standalone switch that does not require any host computer interface. All switch functions are managed by a 416MHz MIPS processor embedded directly into the switch. The processor is accessed via an in-band web interface over one of the Ethernet ports or via an out-of-band command-line interface over an RS-232 serial port. The integrated web interface provides an intuitive GUI for use in configuring and managing all switch functionality. On-board memory holds dual application images, boot code, MAC addresses, and other parameters, and can also be used for program execution. Epsilon-8130’s advanced Ethernet switch chip includes two innovative features that enable automatic power savings. The switch can detect unused Ethernet ports on network devices and power them down or place them in stand-by mode. Additionally, the switch actively adjusts the power level needed based on cable length, saving energy on links shorter than the 100m maximum specified length. Epsilon-8130 was designed for use in vehicle and harsh environment applications. All I/O connectors are latching, providing enhanced reliability over the RJ-45 connectors used in commercial Ethernet switches. The wide range 5-36V input power supply is compatible with all common vehicle and industrial power sources. The −40°C to +85°C operating range makes Epsilon-8130 suitable for use in outdoor and vehicle applications. Epsilon-8130 comes loaded with all required firmware, enabling its immediate operation without any development effort. The included web interface provides an intuitive GUI for use in configuring and managing switch functionality. EPS-8130 is available with a heat sink, a heat spreader, or no cooling solution. Both heat sink and heat spreader support the full −40 to +85C industrial temperature range. Model EPS-8130 uses a low profile heat sink that fits within the PC/104 11.2mm height limit above the PCB. It is positively fixed in place with two screws. Model EPS-8130-XT has a heat spreader that is the same size as the PCB. It has two mounting hole patterns to support both SAE (#6-32) and Metric (M3) fasteners. Model 9113190 is the board assembly without any cooling solution for convenience of customers who have designed their own cooling solution into their system enclosure. This model will operate safely at up to near room temperature, however suitable cooling is needed to achieve reliable operation at elevated temperatures.
new Saturn
Saturn Rugged Apollo Lake x7-E3950 SBC with Data Acquisition and PCIe/104 Expansion Saturn combines a feature-rich Atom‑class processor‑based SBC with a professional-quality industrial analog and digital data acquisition subsystem and flexible I/O expansion in a single board designed for rugged applications. Intel "Apollo Lake" x7-E3950 1.6GHz (burstable 2.0GHz) quad-core processor with 15-year lifecycle 4GB non-ECC or 8GB ECC RAM soldered down Integrated professional-quality analog and digital data acquisition subsystem with software support Bottom side heat spreader with integrated thermal pad provides efficient cooling and convenient mounting Full −40 to +85ºC industrial operating temperature range Thicker PCB and latching connectors increase resistance to shock and vibration PCIe/104 OneBank expansion socket for industry-standard rugged I/O expansion Minicard expansion socket for versatile low-cost I/O Saturn was designed from the ground up with a comprehensive set of features to meet the challenges of rugged environments and applications: Memory is soldered down to avoid problems that can occur with commercial style SODIMM type memory modules The 50% thicker PCB increases rigidity and improves reliability of fine pitch and high-ball-count BGA solder joints All I/O connectors are latching for increased ruggedness A bottom-side heat spreader provides more efficient cooling than a traditional heat sink. Processor and memory chips are both thermally connected to the heat spreader. In addition the exterior surface features recessed thermal pads for improved thermal connectivity to the system enclosure. All components are rated and/or tested to ensure reliable −40 to +85ºC operation Integrated Data Acquisition Saturn is a member of Diamond’s 2-in-1 series of SBCs with integrated data acquisition. For applications requiring precision analog I/O, a 2-in-1 SBC is an ideal choice because it reduces the number of boards in the system, resulting in a system that is smaller, lighter, lower cost, and easier to assemble and maintain. The features of the Saturn DAQ circuit surpass those found on most other embedded SBCs in both variety and quality, providing a comprehensive, professional quality subsystem backed with top of the line software support. «A» models include the full DAQ circuit with both analog and digital I/O features, while «D» models include only the digital I/O features. Saturn’s data acquisition circuit features autocalibration, which maintains best accuracy of the A/D and D/A circuits regardless of time and temperature swings. Using the supplied Universal Driver software library, the circuit can be quickly calibrated to within +/-2LSB accuracy at any time, relative to the on-board precision reference voltage circuit. The A/D circuit includes 16 single-ended / 8 differential analog input channels with programmable input ranges and a maximum aggregate sampling rate of 250KHz. A built-in programmable counter/timer supports accurate high-speed sampling with precise timing. The 2048-sample FIFO with programmable threshold ensures error-free sampling and enables you to tune the performance of the circuit to minimize interrupt processing overhead. The D/A circuit consists of 4 16-bit D/A voltage outputs with independently programmable output ranges including 0-10V, +/-10V, 0-5V, and +/-5V. A 2048-sample waveform buffer is included to support arbitrary waveform generator functions on up to 4 channels simultaneously. The digital I/O circuit consists of GPIO, counter/timers, and pulse-width modulators. The GPIO circuit provides 22 buffered digital I/O lines, consisting of one 8-bit port and 14 1-bit ports. Each port is individually programmable for input or output. The 1-bit direction controllable ports provide better matching of input and output quantities to each application. Jumper configuration enables selection of 5V/3.3V logic levels and pull-up or pull-down resistors on the digital I/O lines. The 8 32-bit programmable counter/timers feature both up and down counting with clocking selectable from an external digital signal or the on-board 50MHz clock. Counters can be used for generating programmable output frequencies with programmable output pulse widths, counting external events, generating interrupts to the host processor at a programmable rate, and driving A/D sampling at precise frequencies with perfect timing between samples. The circuit further includes 4 24-bit programmable pulse width modulators also driven by the on-board 50MHz clock. These feature programmable rate, duty cycle, and polarity, with real-time rate and duty cycle update capability. Software Support Diamond Systems’ Universal Driver software provides unmatched power and flexibility for embedded data acquisition programming with PC/104 and small form factor I/O boards. It provides flexible C-language programming support for Windows and Linux to control all data acquisition features on Saturn, as well as Diamond’s MiniCard data acquisition modules that can be used with Saturn. A powerful and convenient graphical control panel provides instant, easy access to all data acquisition features on the board. It can be used for proof of concept, testing, and even system debugging. I/O expansion Saturn provides two sockets for the installation of I/O expansion modules: A PCIe/104 OneBank I/O expansion socket provides 4 PCIe x1 lanes and 2 USB 2.0 ports to interface with hundreds of PCIe/104 I/O modules from vendors around the world. Only top side expansion is supported, since the bottom side of Saturn is covered by the heat spreader. A full-size PCIe MiniCard socket supports both PCIe and USB minicards. Saturn supports Diamond’s complete line of PCIe MiniCards. What is PCIe/104 OneBank™? OneBank™ is the name given to the PCIe/104 standard that utilizes a more compact, cost effective connector to support rugged, high-speed I/O expansion. The original PCIe/104 connector features 3 «banks» of contacts. The 2nd and 3rd banks contain PCIe x8 / x16 signals that are not supported on Atom processors nor used by most I/O expansion modules. By eliminating these signals, a smaller and more cost effective connector can be used to provide compatibility with any PCIe/104 I/O module that uses a PCIe x1 or USB host connection, while freeing up precious PCB space for additional I/O or connectors. OneBank is an official expansion connector supported by the PC/104 Consortium (of which Diamond Systems was a founding member). Mass storage Saturn offers two options for mass storage: An M.2 2242 size SATA socket is provided for onboard mass storage. Modules up to 1TB are available. This is the most common choice. A standard 7-pin SATA connector is available for connecting a standard 2.5″ or other form factor hard drive. This connector can be used when higher capacity storage is needed. Diamond offers accessory board ACC-HDDMOUNT which allows a 2.5″ drive to be mounted on the PC/104 holes on Saturn. Cable Kit The Saturn cable kit includes all I/O cables needed for all I/O connectors on Saturn except the LCD data and backlight cables, which are customized for each individual application. Cables are normally sold as complete kits. Individual cables may be available in some cases or may be ordered with minimum order quantities; contact us for availability. Detailed drawings listing all components are provided to enable customers to build their own cables. Development kits Development kits are available to support quick project startup. Each kit includes the Saturn SBC, a cable kit, and a programmed 64GB flashdisk with a read-to-run installation of Windows 10 or Linux operating system, plus a backup USB memory device. Simply install the flashdisk, attach the cables, add your keyboard, mouse, and display, and connect power, and the board will boot into a fully functional OS. Configuration files and instructions are provided to rebuild the OS with your application. The Linux kit includes all the tools needed to rebuild the OS. The Windows 10 kit includes a runtime license. A software-only kit is available that consists of just the programmed flashdisk and backup USB memory device. This software kit is intended for customers who already have one or more Saturn SBCs. One software kit can be used on any number of Saturn boards. (Windows licensing requirements still apply.)
new cExpress-TL
cExpress-TL COM Express Compact Size Type 6 Module with 11th Gen Intel Core and Celeron Processors (formerly codename: Tiger Lake-UP3) ADLINK cExpress-TL, based on the 11th Gen Intel Core i7/i5/i3 and Celeron processor, is the first COM Express module to support PCI Express Gen 4 at 16 GT/s, effectively doubling the bandwidth of previous generations. Additionally if features support for 2.5GbE Ethernet, leveraging existing Cat5e cable infrastructure being used for 1GbE Ethernet, it supports four USB 3.2 ports with transfer rates up to 10Gb/s. The modules have a configurable power range of 15 to 28 watts, which suits them for fanless space-constrained embedded applications. Typical industries in need of such high-performance/low-power characteristics are transport, medical, industrial automation and control, edge controllers, robotics and multi-camera-based AI. cExpress-TL features the Intel Iris Xe, a new graphics core, and supporting AVX-512 Vector Neural Net Instructions (VNNI) can significantly improve the number of elements processed per cycle, providing AI inferencing performance that is up to 3x that of previously available from non-VNNI platforms. Intel Iris Xe provides 96 execution units and is able to be configured to support two 8K independent displays or four 4K independent display (HDMI/DP/eDP). Additional support includes In-Band ECC (IBECC), providing ECC level error correction on DDR4 SODIMM memories for mission critical or rugged applications.
new cExpress-AR
cExpress-AR COM Express Compact Size Type 6 Module with AMD Ryzen Embedded V2000 CPU (Zen 2 architecture) The cExpress-AR, featuring the new AMD Ryzen V2000 CPU with its high performance integrated Radeon graphics, is the first Type 6 module on the market to support an octa-core (8-core) embedded SoC, with up to 16 threads and an impressive turbo boost up to 4.2 GHz. Compared to earlier embedded quad-core V1000 processors, the additional cores combined with AMD’s Zen 2 architecture result in a more than two-fold performance increase and double the performance-per-watt efficiency. ADLINK’s cExpress-AR provides standard support for up to 64GB DDR4 in two SO-DIMMs. ECC error correction based on selected SKUs and configurable TDP (down to 10W), while still offering 6 to 8 cores and passive cooling, make it well suited for mission critical application in harsh environments. With integrated new generation AMD Radeon Vega graphics, the cExpress-AR supports up to four independent 4K displays via DisplayPort, HDMI, DVI and LVDS. The cExpress-AR, offers a range of high speed interfaces, including 2.5GbE Ethernet, 6 PCIe x1 Gen3 and 1 PCIe x8 Gen2 (configurable), and 4x USB 3.2 ports. These features are fully compatible with the COM Express Rev. 3 specification, allowing for existing systems to upgrade and gain in performance without changing the carrier design.
new cExpress-EL
cExpress-EL COM Express Compact Size Type 6 Module with Next Generation Intel Atom Processor SoC ADLINK cExpress-EL supports next generation Intel Atom x6000 processors (Elkhart Lake) combined with Intel UHD graphics at low power envelope and high speed interfaces. cExpress-EL modules support In-Band ECC dual channel DDR4 memory up to 32GB, and are also available in rugged operating temperature range and low power envelope, making them a perfect match for mission critical fanless edge computing applications that require safety and reliability at all times.
EPS-12002L
EPS-12002L Compact 12+2 Port Managed Ethernet Switch Main features: Rugged Ethernet switch for vehicle and other harsh environment applications 12 gigabit Ethernet ports for twisted pair connections 2 1/2.5/5/10G SFP+ sockets for fiber or copper transceivers All ports feature non-blocking wire-speed performance Layer 2+ switching and Layer 3 routing software available IEEE 1588 PTP support available Software customization and branding available Rugged design with latching connectors -40 to +85°C operating temperature 5.3×2.2″ / 136×55mm Heat sink and heat spreader thermal options The EPS-12002L is a compact managed rugged Ethernet switch based on Diamond’s EPSM-10GX Ethernet switch module. The switch consists of the EPSM-10GX module mounted on a carrier board that provides power, magnetics, and connectors, along with a heat sink or heat spreader. EPS-12002L provides 12x 10/100/1000Mbps copper ports and 2x 1/2.5/5/10Gbps SFP+ sockets for fiber or copper transceivers. EPS-12002L is ideal for vehicle and industrial applications requiring a small form factor with gigabit Ethernet switching and fiber connectivity support. Two software packages are available, Layer 2+ switching and Layer 3 routing/switching. All software features are manageable via a GUI web interface accessible over any port, as well as with a command language accessed via a built-in RS-232 port. EPS-12002L is designed specifically to meet the challenges of vehicle and other rugged environments, with its −40/+85°C operating temperature range, latching I/O connectors, and MIL-STD-202G shock/vibration resistance. A 5-36V input power supply provides compatibility with a range of industrial and vehicle power supplies. Embedded Software Two software packages are available: Layer 2+ switching and Layer 3 routing/switching. In addition, IEEE-1588 precision time protocol support is available with a minor modification to install a precision clock circuit on the board. All software features are manageable via a GUI web interface accessible over any port, as well as with a command language accessed via a built-in RS-232 port. Customer branding is available to put your logo / color scheme / part numbers on the GUI and serial interface. The table below shows some of the more popular features available. Layer 2+ software highlights include the following: 8K MAC addresses and 4K VLANs (IEEE 802.1Q) 8K IPv4 and IPv6 multicast group support Jumbo frame support at all speeds Flexible link aggregation support based on Layer-2 through Layer-4 information (IEEE 802.3ad) Multicast and broadcast storm control, as well as flooding control Rapid Spanning Tree protocol (RSTP) and MSTP Multiple protocol support: IEEE 802.1d, IEEE 802.1w, IEEE 802.1s, and IEEE 802.1X 8 priorities and 8 QoS queues per port with scheduling Layer3 software additional highlights: Hardware- and software-based IPv6 L3 static routing RFC 2328 OSPFv2 dynamic routing IEEE 1588 precision time protocol (PTP) RADIUS accounting Port and Queue policers Cable Kit Cable Kit for EPS-12000-CM: 3x Quad Gigabit Ethernet cables, Power cable, Serial cable.
EPSM-12G2F
EPSM-12G2F 26-Port Miniature Rugged Managed Ethernet Switch Module EPSM-12G2F is a managed Ethernet switch module in an ultra-compact 2.2″ x 3.3″ (55×84mm) size offering 24x 10/100/1000Mbps copper ports and 2x 1-2.5Gbps SFP ports. It supports an embedded software package offering a full suite of Layer 2 managed Ethernet switching capabilities. The module is intended to be used on a carrier board to implement a complete Ethernet switching solution. The core Ethernet switching technology is almost fully encapsulated on the module; for many applications, only the «last inch» of magnetics and I/O connectors is required to complete the circuit, enabling easy development of custom form factor compact, rugged Ethernet switch solutions. EPSM-12G2F offers compelling advantages over in-house designed Ethernet switches requiring mid-range software features: Small size fits into robots, drones, and other applications where size and weight are critical Rugged design and wide temperature capability are ideal for vehicle applications where high levels of shock and vibration are present Off the shelf solution significantly reduces development time and risk Built-in embedded software provides the most popular managed switch features, all configurable via web or serial port interfaces, eliminating the need for any software development Embedded Software EPSM-12G2F includes the feature-rich WebStaX Layer 2 managed Ethernet switch software. The table below shows some of the more popular features included: 8K MAC addresses and 4K VLANs (IEEE 802.1Q) 8K IPv4 and IPv6 multicast group support Jumbo frame support at all speeds Flexible link aggregation support based on Layer-2 through Layer-4 information (IEEE 802.3ad) Multicast and broadcast storm control, as well as flooding control Rapid Spanning Tree protocol (RSTP) and MSTP Multiple protocol support: IEEE 802.1d, IEEE 802.1w, IEEE 802.1s, and IEEE 802.1X 8 priorities and 8 QoS queues per port with scheduling Cooling Options Two cooling accessory options are available: A heat sink provides convection cooling in a low profile, while a heat spreader provides improved conduction cooling for superior high temperature performance in applications where physical contact with the system enclosure is available. Development Support A design guide is available with circuit details and other technical information necessary to design a carrier board around the EPSM-12G2F. A development kit is also available including: A technical design package (schematics, PCB layout, and Bill of Materials) of the EPS-24G4X carrier board, featuring support for 12 1G ports from the module, PHY for 12 additional 1G ports, dual SFP sockets, LED control logic, and power supply circuit CPLD code for status LED control logic A complete EPS-24G4X switch with the EPSM-12G2F module installed A cable kit Free custom branding of the embedded software (logo / color / title only; custom configurations are extra charge)
Show:
Login / Registration
укажите почту
введите пароль
Forgot password?
By clicking «#SUBMIT_NAME»,
you agree to our Privacy Policy
Loading data...
Subscribe to our newsletter
specify your contacts

By clicking «#SUBMIT_NAME»,
you agree to our Privacy Policy

You have successfully subscribed
Now you can receive newsletters