MVP-5000
Value Family 6th Generation Intel Core i7/i5/i3 Processor-Based Fanless Embedded Computer
Vendor:ADLINK Technology Inc.
- Details
- Specification
- Order information
- 6th Gen Intel Core i7/i5/i3 processors and H110 chipset
- Dual-channel DDR4 SO-DIMM sockets support up to 32 GB memory
- Rich I/O and storage
- Operating temperature: 0°C to 50°C
The MVP-5000 Series provides an optimal balance of price and performance in a compact construction. Incorporating 6th Generation Intel Core processors, the MVP-5000 features computing performance boosted by up to 30% over previous generation-processors.
Integrating the front-mounted industrial I/O and fanless construction featured in ADLINK’s proven Matrix line, and rich LGA 1151 socket type CPU selection, the MVP-5000 Series is ideally suited to a wide variety of machine, factory, logistic automation, and general embedded applications.
| Technical specifications | |
|
System |
|
|---|---|
| Processor |
Intel Core i7-6700TE (MVP-5001) Intel Core i5-6500TE (MVP-5002) Intel Core i3-6100TE (MVP-5003) |
| Chipset | H110 |
| Video | 1 VGA + 2 DisplayPort + 1 DVI-D |
| Memory | 4 GB DDR4 2133 MHz ( up to 32 GB) |
|
I/O Interface |
|
| Ethernet |
3 Intel GbE ports 3 Intel I211AT WOL function on each port Teaming |
| Serial Ports |
4 COM by DB9 connector 2 software-programmable RS-232/422/485 (COM1 & 2) [ BIOS select ] 2x RS-232 (COM3 & 4) The RS-485 support auto-flow control 2 kV surge protection on RS-422/485 |
| USB |
6 external USB ports (4 USB 3.0 +2 USB 2.0) Each of the 6 external USB ports supports 1.6A. To ensure 40 mil/A trace design and 5V ± 5% voltage stability 1 internal USB 2.0 port |
| DIO | 8-CH DI and 8-CH DO |
| Mini PCIe | 1 internal mini PCIe socket |
| USIM | 1 USIM socket |
| Audio | Line-out, Mic-in |
|
Storage Device |
|
| SATA HDD | 1 SATA port for 2.5" HDD/SSD installation(up to 6 Gb/s) |
| CompactFlash Socket | 1 Type II CFast |
|
Mechanical |
|
| Dimension | 220 (W )X 210(D) X 121(H) mm (8.67” x 8.27” x 4.76") |
| Weight | 3.6 kg (7.9 lb) |
| Mounting | Wall mount kit |
|
Power Supply |
|
| DC Input |
Built-in 12-24 V wide-range DC input 3P pluggable connector with latch (GND, V-, V+) |
| AC Input | Optional 160 W external AC-DC adapter for AC input |
|
Environmental and physical specifications |
|
| Operating Temperature | 0°C to +50°C |
| Storage Temperature | -40°C to 85°C (-40°F to 185°F) (excl. storage) |
| Humidity | ~95% @ 40°C (non-condensing) |
| Vibration |
Operating: 5 Grms, random, 5-500 Hz, 3 axes (w/2.5" SSD/CFast, 3 Grms w/ fan) Operating: 0.4 Grms, random, 5-500 Hz, 3 axes (w/ HDD) |
| Shock | Operating: 100 G, half sine 11ms duration (w/ 2.5" SSD/CFast) |
| ESD | Contact +/-4KV, Air +/-8KV |
| EMC | CE & FCC Class A |
| Safety | UL/cUL, CB |
| Model | Description |
| MVP‑5001 | Intel Skylake-S i7-6700TE + H110, 4GB DDR4 SODIMM, VGA + DVI-D, 2x DP, 3x Gbe, 4x USB3.0, 2x USB2.0, 1x SATA, 1x CFAST, 1x mPCIe, 1x USIM, 4x COM, 8DI+8DO, Line-Out + MIC-IN, 12~24V DC-IN |
| MVP-5001/M8G | Intel Skylake-S i7-6700TE + H110, 8GB DDR4 SODIMM, VGA + DVI-D, 2x DP, 3x Gbe, 4x USB3.0, 2x USB2.0, 1x SATA, 1x CFAST, 1x mPCIe, 1x USIM, 4x COM, 8DI+8DO, Line-Out + MIC-IN, 12~24V DC-IN |
| MVP‑5001/M16G | Intel Skylake-S i7-6700TE + H110, 16GB DDR4 SODIMM, VGA + DVI-D, 2x DP, 3x Gbe, 4x USB3.0, 2x USB2.0, 1x SATA, 1x CFAST, 1x mPCIe, 1x USIM, 4x COM, 8DI+8DO, Line-Out + MIC-IN, 12~24V DC-IN |
| MVP-5002 | Intel Skylake-S i5-6500TE + H110, 4GB DDR4 SODIMM, VGA + DVI-D, 2x DP, 3x Gbe, 4x USB3.0, 2x USB2.0, 1x SATA, 1x CFAST, 1x mPCIe, 1x USIM, 4x COM, 8DI+8DO, Line-Out + MIC-IN, 12~24V DC-IN |
| MVP-5002/M8G | Intel Skylake-S i5-6500TE + H110, 8GB DDR4 SODIMM, VGA + DVI-D, 2x DP, 3x Gbe, 4x USB3.0, 2x USB2.0, 1x SATA, 1x CFAST, 1x mPCIe, 1x USIM, 4x COM, 8DI+8DO, Line-Out + MIC-IN, 12~24V DC-IN |
| MVP‑5002/M16G | Intel Skylake-S i5-6500TE + H110, 16GB DDR4 SODIMM, VGA + DVI-D, 2x DP, 3x Gbe, 4x USB3.0, 2x USB2.0, 1x SATA, 1x CFAST, 1x mPCIe, 1x USIM, 4x COM, 8DI+8DO, Line-Out + MIC-IN, 12~24V DC-IN |
| MVP-5003 | Intel Skylake-S i3-6100TE + H110, 4GB DDR4 SODIMM, VGA + DVI-D, 2x DP, 3x Gbe, 4x USB3.0, 2x USB2.0, 1x SATA, 1x CFAST, 1x mPCIe, 1x USIM, 4x COM, 8DI+8DO, Line-Out + MIC-IN, 12~24V DC-IN |
| MVP-5003/M8G | Intel Skylake-S i3-6100TE + H110, 8GB DDR4 SODIMM, VGA + DVI-D, 2x DP, 3x Gbe, 4x USB3.0, 2x USB2.0, 1x SATA, 1x CFAST, 1x mPCIe, 1x USIM, 4x COM, 8DI+8DO, Line-Out + MIC-IN, 12~24V DC-IN |
| MVP‑5003/M16G | Intel Skylake-S i3-6100TE + H110, 16GB DDR4 SODIMM, VGA + DVI-D, 2x DP, 3x Gbe, 4x USB3.0, 2x USB2.0, 1x SATA, 1x CFAST, 1x mPCIe, 1x USIM, 4x COM, 8DI+8DO, Line-Out + MIC-IN, 12~24V DC-IN |
