ADLINK MVP-5100 Series of fanless embedded computing platforms, incorporating the 9th Generation Intel Core processor, is optimized for edge computing applications.
The MVP-5100 Series consolidates high performance computing, scalable function and I/O enhancements, and industrial-grade reliability onto a compact fanless platform, providing reliable long-time operation for performance-critical applications in industrial automation, logistics, transportation, and smart city segments.
Technical specifications | |
System |
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Processor | Intel Core i7-9700E, 2.6 GHz/4.4 GHz, 8 cores, 65W TDP (MVP-510A) Intel Core i7-9700TE, 1.8 GHz/3.8 GHz, 8 cores, 35W TDP (MVP-5101) Intel Core i5-9500TE, 2.2 GHz/3.6 GHz, 6 cores, 35W TDP (MVP-5102) Intel Core i3-9100TE, 2.2 GHz/3.2 GHz, 4 cores, 35W TDP (MVP-5103) Intel Celeron G4900T, 2.9 GHz, 2 cores, 35W TDP (MVP-5104) |
Chipset | H310 (optional C246) |
Memory |
4GB DDR4 non-ECC 2400 MHz, dual SODIMMs, up to 32GB (Optional: 4/8/16/32GB ECC, only for Intel Core i3/Celeron w/ C246) |
I/O Interface |
|
Display | 2x DP++ 1.2, DVI-D, VGA (dual independent displays w/ H310, 3 independent displays w/ C246) |
Ethernet |
3x Intel GbE: 2x i211AT + i219 (Support Intel AMT/vPro w/ C246) |
Serial Ports |
COM1/2: RS-232/422/485, COM3/4: RS-232 (Optional COM5/6: RS-232, shared w/ DI/O) |
USB | 3x USB 3.1 Gen 1 + 3x USB 2.0, 1x internal USB 2.0 dongle (2x USB 3.1 up to Gen 2 w/ C246) |
Audio | Line-out, Mic-in (Optional: speaker-out) |
Mini PCIe | 1x Full size (USB 2.0 + PCIe) |
M.2 | 1x socket 2, key B+M or B, 2280/3042 (USB3.1 + SATA III + PCIe x1. Up to PCIe x2 w/ C246) |
USIM | 2 |
DI/O | 8-CH DI and 8-CH DO |
I2C | 2 (3.3V/5V) |
TPM | TPM2.0 |
Storage Device |
|
2.5" SATA | 2x internal (RAID 0/1 support w/ C246) |
CFast | 1 Type II |
Mechanical |
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Dimension | 210 (W) x 240 (D) x 86 (H) mm (8.27" x 9.45" x 3.39") |
Weight | 4.1 kg (9 lbs) |
Mounting | Wall mount |
Power Supply |
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DC Input | 12-24V (± 10% tolerance) |
AC Input | Optional: 160W AC/DC adapter |
Environmental and physical specifications |
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Operating Temperature |
Standard: (w/ air flow 0.6 m/s) 0°C to +50°C Extended: (w/ air flow 0.6 m/s & ind. storage) -20°C to +60°C -20°C to +50°C for MVP-510A |
Storage Temperature | -40°C to 85°C (-40°F to 185°F) (excl. storage) |
Humidity | ~95% @ 40°C (non-condensing) |
Vibration |
Operating: 5 Grms, random, 5-500 Hz, 3 axes (w/2.5" SSD/CFast, 3 Grms w/ fan) Operating: 0.5 Grms, random, 5-500 Hz, 3 axes (w/ HDD) |
Shock | Operating: 100 G, half sine 11ms duration (w/ 2.5" SSD/CFast) |
ESD | Contact +/-4KV, Air +/-8KV |
EMC | EN61000-6-4/-2, CE & FCC Class A |
Safety | UL/cUL, CB, CCC |
Model | Description |
MVP‑510A/M8G | Core i7-9700E, H310, 2x DP, DVI, VGA, 3x GbE, 4x COM, 3x USB 2.0, 3x USB 3.0, USB 2.0 dongle, 8DI/8DO, line-out/mic-in, mPCIe, 2x USIM, TPM2.0, M.2, CFast, 2x 2.5" SATA, 1pcs DDR4 8GB |
MVP‑5101/M8G | Core i7-9700TE, H310, 2x DP, DVI, VGA, 3x GbE, 4x COM, 3x USB 2.0, 3x USB 3.0, USB 2.0 dongle, 8DI/8DO, line-out/mic-in, mPCIe, 2x USIM, TPM2.0, M.2, CFast, 2x 2.5" SATA, 1pcs DDR4 8GB |
MVP‑5102/M8G | Core i5-9500TE, H310, 2x DP, DVI, VGA, 3x GbE, 4x COM, 3x USB 2.0, 3x USB 3.0, USB 2.0 dongle, 8DI/8DO, line-out/mic-in, mPCIe, 2x USIM, TPM2.0, M.2, CFast, 2x 2.5" SATA, 1pcs DDR4 8GB |
MVP‑5103/M8G | Core i3-9100TE, H310, 2x DP, DVI, VGA, 3x GbE, 4x COM, 3x USB 2.0, 3x USB 3.0, USB 2.0 dongle, 8DI/8DO, line-out/mic-in, mPCIe, 2x USIM, TPM2.0, M.2, CFast, 2x 2.5" SATA, 1pcs DDR4 8GB |
MVP‑5104/M8G | Celeron G4900T, H310, 2x DP, DVI, VGA, 3x GbE, 4x COM, 3x USB 2.0, 3x USB 3.0, USB 2.0 dongle, 8DI/8DO, line-out/mic-in, mPCIe, 2x USIM, TPM2.0, M.2, CFast, 2x 2.5" SATA, 1pcs DDR4 8GB |