MVP-6010/6020 Series
Value Family 6th Generation Intel Core i7/i5/i3 Processor-Based Expandable Fanless Embedded Computer
Vendor:ADLINK Technology Inc.
- Details
- Specification
- Order information
- 6th Gen Intel Core i7/i5/i3 processors with H110/Q170 chipset
- Dual-channel DDR4 SO-DIMM sockets support up to 32GB memory
- Support for 2 independent displays with 1 VGA, 1 DVI and 2 DisplayPort
- Operating temperature: 0°C to 50°C (max.)
ADLINK’s newly introduced MVP-6010/6020 Series value line of fanless embedded computing platforms, incorporating the 6th Generation Intel Core processor, provides one PCIex16 and three PCI or two PCIe x8 and two PCI expansion slots, 1 mini PCIe slot and single-side access for I/O ports, optimizing easy maintenance in industrial automation environments. The series retains the robust design of all ADLINK MXC/MXE lines, at a new extremely cost effective price point.
The MVP-6010/6020 Series supports dual-channel DDR4 memory for more powerful computing and the Intel HD Graphics 530 speeds graphics performance. Along with a versatile I/O array and flexible expansion capacity, the MVP-6010/6020 Series fully satisfies all the needs of industrial automation with the performance demanded by vision inspection, motion control, and surveillance applications.
Fanless construction not only overcomes contaminant and noise challenges presented by harsh IA environments, the elimination of problematic structural elements that negatively affect MTBF greatly increases life cycle expectations for the platform.
| Technical specifications | |
|
System |
|
|---|---|
| Processor |
Intel Core i7-6700TE/i5-6500TE/i3-6100TE Intel Core i7-6700 (65W) Intel Core i7-6700TE/i5-6500TE/i3-6100TE (MVP-6000/MVP-5000 Series) |
| Chipset |
H110 (MVP-6010/MVP-6000/MVP-5000 Series) Q 170 (MVP-6020 Series) |
| Memory | 4 GB DDR4 2133 MHz (up to 32 GB) |
|
I/O Interface |
|
| Expansion slots |
1 PCIe Gen3 x16 + 3 PCI expansion slots for MVP-6010 Series 2 PCIe Gen3 x8 + 2 PCI expansion slots for MVP-6020 Series 1 PCIe Gen3 x16 + 1 PCI for MVP-6000 Series |
| Ethernet |
3 Intel I211 AT GbE ports WOL and teaming functions are supported |
| Serial Ports |
4 COM by DB9 connector 2 BIOS selectable RS-232/422/485 + 2x RS-232 RS-485 with auto flow control |
| USB |
6 external USB ports (4 USB 3.0 +2 USB 2.0) 1 internal USB 2.0 port |
| DIO | 8-CH DI and 8-CH DO |
| Mini PCIe | 1 internal mini PCIe socket |
| USIM | 1 USIM socket |
| Audio | 1 Mic-in and 1 Line out |
|
Power Supply |
|
| DC Input |
Built-in 12-24 VDC wide-range DC input 3P pluggable connector with latch (V-, GND, V+) |
| AC Input | Optional 160 W external AC-DC adapter for AC input |
|
Storage Device |
|
| SATA HDD | 1 SATA port for 2.5" HDD/SSD installation (up to 6 Gb/s) |
| CompactFlash Socket | 1 Type II CFast |
|
Mechanical |
|
| Dimension |
220 (W) x 210 (D) x 208.7 (H) mm (8.67" x 8.27" x 8.21") |
| Weight |
4.7 kg (10.36 lbs) (MVP-6010/6020 Series) 4.5 kg (9.92 lbs) (MVP-6000 Series) 3.6 kg (7.9 lb) (MVP-5000 Series) |
| Mounting | Wall mount kit |
|
Environmental and physical specifications |
|
| Operating Temperature |
0°C to +50°C 0°C to +40°C (MVP-6010/6020 Series with Intel Core i7-6700) |
| Storage Temperature | -40°C to 85°C (-40°F to 185°F) (excl. storage) |
| Humidity | ~95% @ 40°C (non-condensing) |
| Vibration |
Operating: 5 Grms, random, 5-500 Hz, 3 axes (w/2.5" SSD/CFast, 3 Grms w/ fan) Operating: 0.5 Grms, random, 5-500 Hz, 3 axes (w/ HDD) |
| Shock | Operating: 100 G, half sine 11ms duration (w/ 2.5" SSD/CFast) |
| ESD | Contact +/-4KV, Air +/-8KV |
| EMC | CE & FCC Class A |
| Safety | UL/cUL, CB, CCC |
| Model | Description |
| MVP-6011/M8G | Intel Skylake-S i7-6700TE+H110, 1pcs 8GB DDR4 SODIMM, VGA+DVI-D, 2x DP, 3x GbE, 4x USB3.0, 2x USB2.0, 1x SATA, 1x CFAST, 1x mPCIe, 1x USIM, 4x COM, 8DI+8DO, Line-Out+MIC-IN, 1PCIex16+3PCI slots, 12~24V DC-IN |
| MVP-6012/M4G | Intel Skylake-S i5-6500TE+H110, 1pcs 4GB DDR4 SODIMM, VGA+DVI-D, 2x DP, 3x GbE, 4x USB3.0, 2x USB2.0, 1x SATA, 1x CFAST, 1x mPCIe, 1x USIM, 4x COM, 8DI+8DO, Line-Out+MIC-IN, 1PCIex16+3PCI slots, 12~24V DC-IN |
| MVP-6012/M8G | Intel Skylake-S i5-6500TE+H110, 1pcs 8GB DDR4 SODIMM, VGA+DVI-D, 2x DP, 3x GbE, 4x USB3.0, 2x USB2.0, 1x SATA, 1x CFAST, 1x mPCIe, 1x USIM, 4x COM, 8DI+8DO, Line-Out+MIC-IN, 1PCIex16+3PCI slots, 12~24V DC-IN |
| MVP-6013/M4G | Intel Skylake-S i3-6100TE+H110, 4GB DDR4 SODIMM, VGA+DVI-D, 2x DP, 3x GbE, 4x USB3.0, 2x USB2.0, 1x SATA, 1x CFAST, 1x mPCIe, 1x USIM, 4x COM, 8DI+8DO, Line-Out+MIC-IN, 1PCIex16+3PCI slots, 12~24V DC-IN |
| MVP-6015/M8G | Intel Skylake-S i7-6700+H110, 8GB DDR4 SODIMM, VGA+DVI-D, 2x DP, 3x GbE, 4x USB3.0, 2x USB2.0, 1x SATA, 1x CFAST, 1x mPCIe, 1x USIM, 4x COM, 8DI+8DO, Line-Out+MIC-IN, 1PCIex16+3PCI slots, 12~24V DC-IN |
| MVP-6022/M8G | Intel Skylake-S i5-6500TE+Q170, 8GB DDR4 SODIMM, VGA+DVI-D, 2x DP, 3x GbE, 4x USB3.0, 2x USB2.0, 1x SATA, 1x CFAST, 1x mPCIe, 1x USIM, 4x COM, 8DI+8DO, Line-Out+MIC-IN, 2PCIex16+2PCI slots, 12~24V DC-IN |
| MVP-6022/M16G | Intel Skylake-S i5-6500TE+Q170, 2x8GB DDR4 SODIMM, VGA+DVI-D, 2x DP, 3x GbE, 4x USB3.0, 2x USB2.0, 1x SATA, 1x CFAST, 1x mPCIe, 1x USIM, 4x COM, 8DI+8DO, Line-Out+MIC-IN, 2PCIex16+2PCI slots, 12~24V DC-IN |
| MVP-6023/M8G | Intel Skylake-S i3-6100TE+Q170, 1pcs 8GB DDR4 SODIMM, VGA+DVI-D, 2x DP, 3x GbE, 4x USB3.0, 2x USB2.0, 1x SATA, 1x CFAST, 1x mPCIe, 1x USIM, 4x COM, 8DI+8DO, Line-Out+MIC-IN, 2PCIex8+2PCI slots, 12~24V DC-IN |
| MVP-6025/M8G | Intel Skylake-S i7-6700+Q170, 8GB DDR4 SODIMM, VGA+DVI-D, 2x DP, 3x GbE, 4x USB3.0, 2x USB2.0, 1x SATA, 1x CFAST, 1x mPCIe, 1x USIM, 4x COM, 8DI+8DO, Line-Out+MIC-IN, 2PCIex16+2PCI slots, 12~24V DC-IN |
| MVP-6021/M16G | Intel Skylake-S i7-6700TE+Q170, 2x 8GB DDR4 SODIMM, VGA+DVI-D, 2x DP, 3x GbE, 4x USB3.0, 2x USB2.0, 1x SATA, 1x CFAST, 1x mPCIe, 1x USIM, 4x COM, 8DI+8DO, Line-Out+MIC-IN, 2PCIex16+2PCI slots, 12~24V DC-IN |
| MVP‑6025/M8G/Fan | Intel Skylake-S i7-6700+Q170, 1pcs 8GB DDR4 SODIMM, VGA+DVI-D, 2x DP, 3x GbE, 4x USB3.0, 2x USB2.0, 1x SATA, 1x CFAST, 1x mPCIe, 1x USIM, 4x COM, 8DI+8DO, Line-Out+MIC-IN, 2PCIex8+2PCI slots, 12~24V DC-IN, with Fan |
| MVP-6025/M16G | Intel Skylake-S i7-6700+Q170, 2x 8GB DDR4 SODIMM, VGA+DVI-D, 2x DP, 3x GbE, 4x USB3.0, 2x USB2.0, 1x SATA, 1x CFAST, 1x mPCIe, 1x USIM, 4x COM, 8DI+8DO, Line-Out+MIC-IN, 2PCIex16+2PCI slots, 12~24V DC-IN |
| MVP‑6025/M16G/Fan | Intel Skylake-S i7-6700+Q170, 16GB DDR4 SODIMM, VGA+DVI-D, 2x DP, 3x GbE, 4x USB3.0, 2x USB2.0, 1x SATA, 1x CFAST, 1x mPCIe, 1x USIM, 4x COM, 8DI+8DO, Line-Out+MIC-IN, 2PCIex16+2PCI slots, 12~24V DC-IN, with Fan |
