Express-KL/KLE

COM Express Basic Size Type 6 Module with 7th Gen Intel® Core™ 7000 series and Intel® Xeon® Processors (formerly codename: Kaby Lake)
  • Details
  • Specification
  • Order information
  • 7th Gen Intel® Core™ 7000 series and Intel® Xeon® Processors
  • Up to 32 GB Dual Channel DDR4 at 1867/2133 MHz supports both ECC and non-ECC memory)
  • 3x DDI channels, 1x LVDS (or 4 lanes eDP), supports up to 3 independent displays
  • Extreme Rugged operating temperature: -40°C to +85°C (build option for selected SKUs)

The Express-KL/KLE is a COM Express COM.0 R2.1 Basic Size Type 6 module supporting the 64-bit 7th Generation Intel Core and Xeon processor E3 (codename «Kaby Lake-H») with Mobile Intel QM175, HM175, CM238 Chipset. The Express-KL/KLE is specifically designed for customers who need excellent graphics performance and high-level processing performance in a long product life solution.

The Express-KL/KLE features Intel Hyper-Threading Technology (up to 4 cores, 8 threads) and DDR4 dual channel memory at 2133/2400 MHz with ECC/non-ECC support determined by CPU/chipset combination to provide excellent overall performance. Intel Flexible Display Interface and Direct Media Interface provide high speed connectivity from the CPU to the Intel QM175, HM175, CM238 Chipset.

Integrated Intel Generation 9 Graphics includes features such as OpenGL 4.4/4.3/4.2, DirectX 11, Intel Clear Video HD Technology, Advanced Scheduler 2.0, 1.0, XPDM support, and DirectX Video Acceleration (DXVA) support for full H.265/HEVC 10-bit, MPEG2 hardware codec. In addition, High Dynamic Range is supported for enhanced picture color and quality and digital content protection has been upgraded to HDCP 2.2. Graphics outputs include LVDS and three DDI ports supporting HDMI/DVI/DisplayPort and eDP as a build option. The Express-KL/KLE is specifically designed for customers with high-performance processing graphics requirements who want to outsource the custom core logic of their systems for reduced development time.

The Express-KL/KLE has dual stacked SODIMM sockets supporting up to 32 GB of DDR4 ECC/non-ECC memory. In addition to the onboard integrated graphics, a multiplexed PCIe x16 graphics bus is available for discrete graphics expansion. Input/output features include a single onboard Gigabit Ethernet port, eight PCIe x1 Gen3 lanes, USB 3.0 ports and USB 2.0 ports, and SATA 6 Gb/s ports. Support is provided for SMBus and I2C. The module is equipped with SPI AMI EFI BIOS with CMOS backup, supporting embedded features such as remote console, hardware monitor, and watchdog timer.

Technical specifications

Core System

CPU Mobile Intel® Xeon®, Core™ Processors - 14nm
Xeon® E3-1505M v6 3.0/4.0GHz (Turbo), 45W (4C/GT2)
Xeon® E3-1505L v6 2.2/3.0GHz (Turbo), 25W (4C/GT2)
Core™ i7-7820EQ 3.0/3.7GHz (Turbo), 45W (4C/GT2)
Core™ i5-7440EQ 2.9/3.6GHz (Turbo), 45W (4C/GT2)
Core™ i5-7442EQ 2.1/2.9GHz (Turbo), 25W (4C/GT2)
Core™ i3-7100E 2.9GHz (no Turbo), 35W (2C/GT2)
Core™i3-7102E 2.1GHz (no Turbo), 25W (2C/GT2)

Supports: Intel® VT, Intel® TXT, Intel® SSE4.2, Intel® HT Technology, Intel® 64 Architecture, Execute Disable Bit, Intel® Turbo Boost Technology 2.0, Intel® AVX2, Intel® AES-NI, PCLMULQDQ Instruction, Intel® Secure Key and Intel® TSX.
Note: Availability of the features may vary between processor SKUs.
Memory Dual channel 2133/2400 MHz DDR4 memory up to 32GB in dual SODIMM sockets (ECC/non-ECC support dependent on selected CPU/PCH)
Embedded BIOS AMI EFI with CMOS backup in 16MB SPI BIOS with Intel® AMT 11.6 support
Cache 8MB for Xeon® and Core™ i7, 6MB for Core™ i5, 3MB for Core™ i3
PCH CM238 (supports ECC memory, Intel AMT)
QM175 (supports non-ECC, Intel AMT)
HM175 (supports non-ECC, no Intel AMT support)
Expansion Busses PCIe x16 or 2 PCIe x8 or 1 PCIe x8 with 2 PCIe x4 (Gen3)
6 PCI Express x1 (Gen3); AB connector, Lanes 0/1/2/3/4/5
2 PCI Express x2 (Gen3): CD connector, Lanes 6/7
LPC bus, SMBus (system), I2C (user)
Debug Headers 40-pin flat cable connector for use with DB-40 debug module providing BIOS POST code LED, BMC access, SPI BIOS flashing, power testpoints, debug LEDs 60-pin XDP header for ICE debug of CPU/chipset

Video

GPU Feature Support Intel® Generation 9 LP Graphics Core Architecture, supporting 3 independent and simultaneous display combinations of DisplayPort/HDMI/LVDS or eDP outputs
Hardware encode/transcode HD content (including HEVC) DirectX 12, DirectX 11.2, DirectX 11.1, DirectX 11, DirectX 10.1, DirectX 10, DirectX 9 support OpenGL 4.4/4.3 and ES 2.0 support
OpenCL 2.1, 2.0/1.2 support
Digital Display Interface DDI1/2/3 supporting DisplayPort/HDMI/DVI
LVDS Single/dual channel 18/24-bit LVDS from eDP-to-LVDS IC
eDP 4 lane support optional, in place of LVDS

Audio

Chipset Intel® HD Audio integrated in chipset
Audio Codec located on carrier Express-BASE6 (ALC886 standard supported)

Ethernet

Ethernet Intel® MAC/PHY: i219LM/V (LM with AMT 11.0 support possibility) Interface: 10/100/1000 GbE connection

I/O Interfaces

USB 4x USB v. 3.0 (USB 0,1,2,3) and 4x USB 2.0 (USB 4,5,6,7)
SATA Four ports SATA 6Gb/s (SATA0,1,2,3)
Serial 2 UART ports with console redirection
GPIO 4 GPO and 4 GPI
Super I/O Supported on carrier if needed (standard support for W83627DHG-P)
TPM Chipset: Infineon
Type: TPM 2.0

Power

Standard Input ATX = 12V±5% / 5Vsb ±5% or AT = 12V±5%
Wide Input ATX = 8.5-20 V / 5Vsb ±5% or AT = 8.5 ~20V (Standard temp. only)
Management ACPI 5.0 compliant, Smart Battery support
Power States: C1-C6, S0, S1, S3, S4, S5 , S5 ECO mode (Wake-on-USB S3/S4, WOL S3/S4/S5)
ECO mode Supports deep S5 mode for power saving

Operating Systems

Standard Support Windows 10 64-bit, Windows 10 IOT Enterprise 64-bit, Linux 64-bit, VxWorks
Extended Support (BSP) Linux 64-bit, VxWorks

Mechanical

Form Factor PICMG COM.0, Rev 2.1 Type 6
Dimension Basic size, 125 mm x 95 mm
Intelligent Middleware SEMA® Local management, control of embedded computer systems
Extended EAPI for monitoring, controlling and analytics applications
Multiple OS support and across platforms (x86, ARM)

Environmental and physical specifications

Operating Temperature Standard: 0°C to 60°C
Extreme Ruggeed: -40°C to +85°C (build option)

Note: “build option” indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product.
Be aware that these “build option” part numbers will need to be newly created and this will result in production lead times.
Humidity 5-90% RH operating, non-condensing
5-95% RH storage (and operating with conformal coating)
Shock and Vibration IEC 60068-2-64 and IEC-60068-2-27
MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D
HALT Thermal Stress, Vibration Stress, Thermal Shock and Combined Test
Model Description
Express-KLE-E3-1505M v6 Basic Size COM Express® Type 6 module with Intel® Xeon® E3-1505M v6 and GT2 level graphics, CM238 chipset
Express-KLE-E3-1505L v6 Basic Size COM Express® Type 6 module with Intel® Xeon® E3-1505M v6 and GT2 level graphics, CM238 chipset
Express-KL-i7-7820EQ Basic Size COM Express® Type 6 module with Intel® Core™ i7-7820EQ and GT2 level graphics, QM175 chipset
Express-KL-i5-7440EQ Basic Size COM Express® Type 6 module with Intel® Core™ i5-7440EQ and GT2 level graphics, QM175 chipset
Express-KL-i5-7442E Basic Size COM Express® Type 6 module with Intel® Core™ i5-7442EQ and GT2 level graphics, QM175 chipset
Express-KL-i3-7100E Basic Size COM Express® Type 6 module with Intel® Core™ i3-7100E and GT2 level graphics, HM175 chipset
Express-KL-i3-7102E Basic Size COM Express® Type 6 module with Intel® Core™ i3-7102E and GT2 level graphics, HM175 chipset
Accessories
(Express-KL/KLE share the same accessories with Express-SL/SLE)
HTS-SL-B Heatspreader for Express-SL with threaded standoffs for bottom mounting
HTS-SL-BT Heatspreader for Express-SL with through hole standoffs for top mounting
THS-SL-BL Low profile heatsink for Express-SL with threaded standoffs for bottom mounting
THS-SL-BT Low profile heatsink for Express-SL with through hole standoffs for top mounting
THSH-SL-BL High profile heatsink for Express-SL with threaded standoffs for top mounting
THSF-SL-BL High profile heatsink with Fan for Express-SL with threaded standoffs for bottom mounting
Starter Kit
Starterkit-COM Express 6 PLUS COM Express formfactor starter kit with Express-BASE6 board, power supply, and accessory kit

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