The LEC-AL Computer-On-Module (COM) combines the SMARC 2.0 standard with the latest Intel Atom E-Series and Pentium and Celeron N-series System-on-Chips (SoCs), providing ideal solutions for low power consumption and high performance requirements. The module provides the high integration, high performance, low power, and ruggedness favored by Internet- of-Things (IoT) applications such as retail transactional clients, digital signage, and in-vehicle infotainment systems. The LEC-AL module utilizes the latest Intel E-series and N-series SoCs, which are based on the Intel 64 Architecture, the new HD Graphics 500/505 engine, and a faster, 4-vector image processing unit. The SoCs are manufactured on Intel’s industry-leading, tri-gate 14nm process, improving system performance by supporting more than 4 GB of both virtual and physical memory.
The module primarily targets embedded intelligent systems used in several vertical market segments such as healthcare, industrial controllers and real-time systems, retail systems, edge IOT gateways, in-vehicle infotainment systems, printers, thin clients, industrial and ruggedized tablets, and many others. The LEC-AL supports contemporary, high-bandwidth interfaces such as Ultra HD HDMI, dual-channel LVDS, PCI Express Gen2, Gigabit Ethernet, USB 2.0/3.0, SATA Gen3, enhanced MIPI CSI camera, and a state-of-the-art HD Audio interface.
The module generates its own LVDS (18/24bit), TMDS, and Display Port ++ video signals using eDP and DDI output from the SoC. Two SPI Flash chips implement a fail-safe BIOS, allowing the user to boot the module even if current BIOS settings have corrupted the system. Under the management of the BMC chip (Board Management Controller), the SEMA utility (Smart Embedded Management Agent) provides system control, security, and failure protection— counting, monitoring, and measuring hardware and software events, and using the SMBus to send corrective commands to the SoC.
Technical specifications | |
CPU |
Intel Atom E3950, 4 cores, 2.0 GHz, 12 W TDP Intel Atom E3940, 4 cores, 1.8 GHz, 9.5 W TDP Intel Atom E3930, 2 cores, 1.8 GHz, 6.5 W TDP Intel Pentium N4200, 4 cores, 2.5 GHz, 6W TDP Intel Celeron N3350, 2 cores, 2.4 GHz, 6W TDP |
Memory |
Up to 8 GB DDR3L at 1867 MT/s Single/dual channel memory 1-2 64bit, non-ECC |
Embedded BIOS | AMI UEFI with CMOS backup in 8 MB SPI BIOS, Fast Boot support |
Cache | 2 MB L2 cache |
SEMA Board Controller | Supports: Voltage/Current monitoring, Power Sequencing, Logistics and Forensic Information, Flat Panel Control, I²C Bus Control, GPIO Control, User Flash, Failsafe BIOS (dual BIOS), Watchdog Timer and Fan Control |
Video |
9th generation Intel graphics core architecture with up to 18 execution units Supports three independent displays 2D and 3D graphics hardware acceleration Support for DirectX 12, OpenGL 4.2, OpenCL 1.2 Video decode HW acceleration for H.265/HEVC, H.264, MPEG2, MVC, VC-1, WMV9, JPEG/MJPEG, VP8, VP9 Video encode HW acceleration for H.265/HEVC, H.264, MPEG2, MVC, JPEG/MJPEG, VP8, VP9 (resolution depends on operating system) |
LVDS | Dual channel LVDS (18/24-bit) |
HDMI/DP++ | HDMI up to 3840 x 2160 @ 30Hz |
DP++ | DP++ up to 4096 x 2160 @ 60Hz |
Audio |
Intel HD Audio integrated in SoC 1x I²S and 1x HDA for audio codec on carrier |
Ethernet |
Intel MAC/PHY: 1x Intel i210-IT or i210-AT Ethernet controller Interface: 1x 10/100/1000 GbE, IEEE 1588 trigger signals |
I/O Interfaces |
4x PCIe x1 Gen2 1x USB 2.0 OTG, 5x USB 2.0 host, 2x USB 3.0 host 1x SATA 3.0 (6 Gbit/s) 1x SDIO 3.0 (4bit) 2x MIPI CSI camera (2L/4L) 1x SPI, 1x eSPI, 4x I²C, 4x UART, 1x SMBus, 1x LPC, 1x DB40 Onboard eMMC 5.0 (4-64 GByte) 12x GPIO (interrupt capable) |
Power |
Standard Input: 3.0 V~5.25 V DC ±5% Power States: C0-C6, S0, S3, S4, S5 |
Form Factor | SMARC Specifications v2.0 |
Dimension | SMARC short size module, 82mm x 50mm |
Operating Systems |
Standard support: Windows 10 IOT Enterprise, Windows 10 IOT Core, Yocto Linux Extended support: VxWorks, Android |
Environmental and physical specifications |
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Operating Temperature |
Standard: 0°C to +60°C Extreme Rugged: -40°C to +85°C |
Humidity |
5-90% RH operating, non-condensing 5-95% RH storage (and operating with conformal coating) |
Shock and Vibration |
IEC 60068-2-64 and IEC-60068-2-27 MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D |
HALT | Thermal Stress, Vibration Stress, Thermal Shock and Combined Test |
Model | Description |
LEC‑AL-E3930-2G-8G-ER | SMARC Short Size Module with Intel Atom E3930, dual core, 2 GB DDR3L, 8GB eMMC, -40°C to 85°C |
LEC-AL-E3940-4G-ER | SMARC Short Size Module with Intel Atom E3940, quad core, 4 GB DDR3L |
LEC-AL-E3940-4G-32G-ER | SMARC Short Size Module with Intel Atom E3940, quad core, 4GB DDR3L, 32GB eMMC, -40°C to 85°C |
LEC-AL-E3940-8G-32G-ER | SMARC Short Size Module with Intel Atom E3940, quad core, 8 GB DDR3L, 32GB eMMC, -40°C to 85°C |
LEC‑AL‑N3350‑4G‑64G‑CT | SMARC Short Size Module with Intel Celeron N3350, dual core, 4 GB DDR3L, 64GB eMMC, 0°C to 60°C |
LEC-AL-E3950-8G-32G-ER | SMARC Short Size Module with Intel Atom E3950, quad core, 8 GB DDR3L, 32 GB eMMC, -40°C to 85°C |
LEC-AL-N3350-4G-8G-CT | SMARC Short Size Module with Intel Celeron N3350, dual core, 4 GB DDR3L, 8GB eMMC, 0°C to 60°C |
LEC‑AL‑N3350‑4G‑16G‑CT | SMARC Short Size Module with Intel Celeron N3350, dual core, 4GB DDR3L, 16GB eMMC, 0°C to 60°C |
LEC‑AL‑N4200‑8G‑32G‑CT | SMARC Short Size Module with Intel Pentium N4200, quad core, 8 GB DDR3L, 32GB eMMC, 0°C to 60°C |
LEC‑AL‑N4200‑8G‑64G‑CT | SMARC Short Size Module with Intel Pentium N4200, quad core, 8 GB DDR3L, 64GB eMMC, 0°C to 60°C |
LEC-AL-HS1 | Heat spreader for LEC-AL-E3930/E3940/E3950 |
LEC-AL-HS2 | Heat spreader for LEC-AL-N3350/N4200 |
LEC-AL-HS3 | Active heatsink for LEC-AL |
LEC-AL-HS4 | Integral passive heatsink for LEC-AL-E3930/E3940/E3950 |
LEC-AL-HS5 | Integral passive heatsink for LEC-AL-N3350/N4200 |
LEC-Starterkit 2.0 | LEC-Starterkit with LEC-BASE 2.0 carrier, LVDS display, SD card and ATX power supply (without LEC module and cooling solution) |