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MicroMax Unveils Patent-pending Technology to Extract Excessive Heat from Electronic Components Working at High Vibration Levels

June 1, 2011

MicroMax, developer and manufacturer of the M-MAX line of high performance rugged computers, announces its Patent-Pending technology to to dissipate excessive heat from computer boards and other electronic devices working at high vibration. The invention enables removal of heat from electronic components located on a circuit board vibroinsulated from an enclosure.

This solution can be used for embedded systems when high performance, passive cooling as well as small dimension are a must.  
This technology has allowed MicroMax to create the unsurpassed M-Max 800 PR, a fully sealed 2.26Ghz Intel Core 2 Duo CPU system which operates at ambient temperatures from -40 to +60 °C, being  highly vibration and shock resistant.
MicroMax specializes in the development of computer technologies for rugged applications which requires performance at extreme temperature ranges, high vibration, high humidity and high concentration of dust. We offer a line of M-Max’s off-the-shelf systems as well as highly customized systems which could be tailored to very sophisticated customer requirements.

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