Compact COM Express® Type 6 Module with 5th Gen Intel® Core™ i7/i5/i3 SoC
  • Details
  • Specification
  • Order information
  • 5th Generation Low Power Intel® Core™ i7/i5/i3 and Celeron® System-on-Chip
  • Up to 16 GB DDR3L at 1600MHz
  • Two DDI channels, one LVDS supporting 3 independent displays Dual channel 18/24-bit LVDS (or optional eDP)
  • Extreme Rugged™ operating temperature: -40°C to +85°C (optional)
The cExpress-BL is a COM Express® COM.0 R2.1 Type 6 Compact size module supporting the 64-bit 5th Generation Intel® Core™ i7/i5/i3 and ULT Processors and Intel® Celeron™ Processors with CPU, memory controller, graphics processor and I/O hub on the same chip. Leveraging the benefits provided by the Intel® Core™ i7/i5/3 ULT and Intel® Celeron™ System-on-Chip, the cExpress-BL is specifically designed for customers who need optimum processing and graphics performance with low power consumption in a long product life solution.

The cExpress-BL features the Intel® Core™ i7/i5/i3 processor and Intel® Celeron™ processor supporting Intel® Hyper-Threading Technology (up to 2 cores, 4 threads) and up to 16 GB of non-ECC DDR3L dual-channel memory at 1333/1600 MHz in dual stacked SODIMM sockets to provide excellent overall performance.

Integrated Intel Generation 8 Graphics includes features such as OpenGL 4.2, DirectX 11.1, Intel® Clear Video HD Technology, Advanced Scheduler 2.0, 1.0, XPDM support, and DirectX Video Acceleration (DXVA) support for full AVC/VC1/MPEG2 hardware decode. Graphics outputs include dual-channel 18/24-bit LVDS (4lane eDP as option) and two DDI ports supporting HDMI / DVI / DisplayPort.

The cExpress-BL is specifically designed for customers with high-performance processing graphics requirements who want to outsource the custom core logic of their systems for reduced development time. The cExpress-BL features a single onboard Gigabit Ethernet port, two USB 3.0 ports and six USB 2.0 ports, and 4 SATA 6 Gb/s ports. Support is provided for SMBus and I2C. The module is equipped with SPI AMI EFI BIOS with CMOS backup, supporting embedded features such as remote console, CMOS backup, hardware monitor, and watchdog timer.

The ADLINK cExpress-BL computer-on-module with built-in SEMA Cloud functionality is ready-made for Internet of Things (IoT) applications. The cExpress-BL is able to connect legacy industrial devices and other IoT systems to the cloud, extract raw data from these devices, determine which data to save locally and which to send to the cloud for further analysis. The results these analyses can provide valuable information for policy decision making and generate innovative business opportunities.

Technical specifications

Core System

CPU5th Generation Intel® Core™ and Celeron® Processor (Mobile) - 14nm (formerly "Broadwell U-Series")
Core™ i7-5650U 2.2 GHz (3.2 GHz Turbo), 4MB, 15W (2C/GT3)
Core™ i5-5350U 1.8 GHz (2.9 GHz Turbo), 3MB, 15W (2C/GT3)
Core™ i3-5010U 2.1 GHz (no Turbo), 3MB, 15W (2C/GT2)
Supports: Intel® VT, Intel® TXT, Intel® SSE4.2, Intel® HT Technology, Intel® 64 Architecture, Execute Disable Bit, Intel® Turbo Boost Technology 2.0, Intel® AVX2, Intel® AES-NI, Intel® PCLMULQDQ Instruction, Intel® Device Protection Technology with Intel® Secure Key, Intel® TSX-NI.
Note: Availability of features may vary between processor SKUs.
MemoryDual channel non-ECC 1600/1333 MHz DDR3L memory up to 16 GB in dual SODIMM socket
Embedded BIOSAMI EFI with CMOS backup in 8MB SPI BIOS with Intel AMT 10 support
Expansion Busses4 PCI Express x1: lanes 0/1/2/3
LPC bus, SMBus (system) , I2C (user)
SEMA Board ControllerSupports : Voltage/Current monitoring, Power sequence debug support, AT/ATX mode control, Logistics and Forensic information, Flat Panel Control, General Purpose I2C, Failsafe BIOS (dual BIOS ), Watchdog Timer and Fan Control
Debug Headers40-pin multipurpose flat cable connector for use in combination with DB-40 debug module, providing BIOS POST code LED, BMC access, SPI BIOS flashing, power test points, debug LEDs
60-pin XDP header for ICE debug of CPU/Chipset


GPU Feature SupportGeneration 8 Intel graphics core architecture, supporting 3 independent and simultaneous displays
Combinations of DisplayPort/HDMI/LVDS or eDP outputs
Encode/transcode HD content
Playback of high definition content including Blu-ray Disc
Superior image quality with sharper, more colorful images
Playback of Blu-ray disc S3D content using HDMI (1.4a spec compliant with 3D)
DirectX Video Acceleration (DXVA) support for accelerating video processing
Full AVC/VC1/MPEG2 HW Decode
Advanced Scheduler 2.0, 1.0, XPDM support
Windows 8, Windows 7, OSX, Linux OS support
DirectX 11.1, DirectX 11.1+, DirectX 10.1, DirectX 10, DirectX 9 support
OpenGL 4.2/4.0 support
LVDS/eDPSingle/dual channel 18/24-bit LVDS (default)
eDP support (optional)
Digital Display InterfaceDDI1 supporting DisplayPort / HDMI
DDI2 supporting DisplayPort / HDMI


ChipsetIntel® HD Audio integrated in U-Series SoC
Audio Codeclocated on carrier Express-BASE6 (ALC886 standard supported)


Intel® MAC/PHYi218LM (Enterprise SKU) with AMT 10 support
Interface10/100/1000 GbE connection

I/O Interfaces

USB2x USB 1.1/2.0/3.0 (USB 0,1) and 6x USB 1.1/2.0 (USB 2,3,4,5,6,7)
SATAFour ports SATA 6Gb/s (SATA0, SATA1, SATA2, SATA3)
Serial2 UART ports COM1/2 with console redirection
Super I/OSupported on carrier if needed (standard support for W83627DHG-P)

TPM (Optional)

ChipsetAtmel AT97SC3204
TypeTPM 1.2


Standard InputATX = 12V±5% / 5Vsb ±5% or AT = 12V±5%
Wide InputATX = 5~20 V / 5Vsb ±5% or AT = 5 ~20V
ManagementACPI 4.0 compliant, Smart Battery support
Power StatesC1-C6, S0, S4, S3, S5, S5 ECO mode (Wake on USB S3/S4, WOL S3/S4/S5)
ECO modeSupports deep S5 mode for power saving
DimensionCompact size: 95 mm x 95 mm
HALTThermal Stress, Vibration Stress, Thermal Shock and Combined Test
Operating SystemsStandard Support Windows 7/8.1U 32/64-bit, Linux 32/64-bit
Extended Support (BSP) WES7, WE8S, Linux, VxWorks (all support 32/64-bit)

Environmental and physical specifications

Operating TemperatureStandard: 0°C to 60°C
Extreme Rugged: -40°C + 85°C (optional)
Humidity5-90% RH operating, non-condensing
5-95% RH storage (operating with conformal coating)
Shock and VibrationIEC 60068-2-64 and IEC-60068-2-27
MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D
Model Description
cExpress-BL-i7-5650U Compact COM Express Type 6 module with Intel Core i7-5650U at 2.2/3.2 GHz with GT3 level graphics
cExpress-BL-i5-5350U Compact COM Express Type 6 module with Intel Core i5-5350U at 1.8/2.9 GHz with GT3 level graphics
cExpress-BL-i3-5010U Compact COM Express Type 6 module with Intel Core i3-5010U at 2.1 GHz with GT2 level graphics
cExpress-BL-Celeron Compact COM Express Type 6 module with Intel Celeron
HTS-cBL-B Heatspreader for cExpress-BL with threaded standoffs for bottom mounting
HTS-cBL-BT Heatspreader for cExpress-BL with through hole standoffs for top mounting
THS-cBL-B Low profile heatsink for cExpress-BL with threaded standoffs for bottom mounting
THS-cBL-BT Low profile heatsink for cExpress-BL with through hole standoffs for top mounting
THSF-cBL-B High profile heatsink with Fan for cExpress-BL with threaded standoffs for bottom mounting
THSH-cBL-B High profile heatsink for cExpress-BL with through hole standoffs for bottom mounting
Starter Kit
Starter Kit plus Starter kit for cExpress-BL
Login / Registration
укажите почту
введите пароль
Forgot password?
By clicking «#SUBMIT_NAME»,
you agree to our Privacy Policy
Loading data...
Subscribe to our newsletter
specify your contacts

By clicking «#SUBMIT_NAME»,
you agree to our Privacy Policy

You have successfully subscribed
Now you can receive newsletters