cExpress-BL
Compact COM Express Type 6 Module
Vendor:ADLINK Technology Inc.
- Details
- Specification
- Order information
- 5th Generation Low Power Intel® Core™ i7/i5/i3 and Celeron® System-on-Chip
- Up to 16 GB DDR3L at 1600MHz
- Two DDI channels, one LVDS supporting 3 independent displays Dual channel 18/24-bit LVDS (or optional eDP)
- Extreme Rugged™ operating temperature: -40°C to +85°C (optional)
The cExpress-BL is a COM Express COM.0 R2.1 Type 6 Compact size module supporting the 64-bit 5th Generation Intel Core i7/i5/i3 and ULT Processors and Intel Celeron Processors with CPU, memory controller, graphics processor and I/O hub on the same chip. Leveraging the benefits provided by the Intel Core i7/i5/3 ULT and Intel Celeron System-on-Chip, the cExpress-BL is specifically designed for customers who need optimum processing and graphics performance with low power consumption in a long product life solution.
The cExpress-BL features the Intel Core i7/i5/i3 processor and Intel Celeron processor supporting Intel Hyper-Threading Technology (up to 2 cores, 4 threads) and up to 16 GB of non-ECC DDR3L dual-channel memory at 1333/1600 MHz in dual stacked SODIMM sockets to provide excellent overall performance.
Integrated Intel Generation 8 Graphics includes features such as OpenGL 4.2, DirectX 11.1, Intel Clear Video HD Technology, Advanced Scheduler 2.0, 1.0, XPDM support, and DirectX Video Acceleration (DXVA) support for full AVC/VC1/MPEG2 hardware decode. Graphics outputs include dual-channel 18/24-bit LVDS (4lane eDP as option) and two DDI ports supporting HDMI / DVI / DisplayPort.
The cExpress-BL is specifically designed for customers with high-performance processing graphics requirements who want to outsource the custom core logic of their systems for reduced development time. The cExpress-BL features a single onboard Gigabit Ethernet port, two USB 3.0 ports and six USB 2.0 ports, and 4 SATA 6 Gb/s ports. Support is provided for SMBus and I2C. The module is equipped with SPI AMI EFI BIOS with CMOS backup, supporting embedded features such as remote console, CMOS backup, hardware monitor, and watchdog timer.
The ADLINK cExpress-BL computer-on-module with built-in SEMA Cloud functionality is ready-made for Internet of Things (IoT) applications. The cExpress-BL is able to connect legacy industrial devices and other IoT systems to the cloud, extract raw data from these devices, determine which data to save locally and which to send to the cloud for further analysis. The results these analyses can provide valuable information for policy decision making and generate innovative business opportunities.
The cExpress-BL features the Intel Core i7/i5/i3 processor and Intel Celeron processor supporting Intel Hyper-Threading Technology (up to 2 cores, 4 threads) and up to 16 GB of non-ECC DDR3L dual-channel memory at 1333/1600 MHz in dual stacked SODIMM sockets to provide excellent overall performance.
Integrated Intel Generation 8 Graphics includes features such as OpenGL 4.2, DirectX 11.1, Intel Clear Video HD Technology, Advanced Scheduler 2.0, 1.0, XPDM support, and DirectX Video Acceleration (DXVA) support for full AVC/VC1/MPEG2 hardware decode. Graphics outputs include dual-channel 18/24-bit LVDS (4lane eDP as option) and two DDI ports supporting HDMI / DVI / DisplayPort.
The cExpress-BL is specifically designed for customers with high-performance processing graphics requirements who want to outsource the custom core logic of their systems for reduced development time. The cExpress-BL features a single onboard Gigabit Ethernet port, two USB 3.0 ports and six USB 2.0 ports, and 4 SATA 6 Gb/s ports. Support is provided for SMBus and I2C. The module is equipped with SPI AMI EFI BIOS with CMOS backup, supporting embedded features such as remote console, CMOS backup, hardware monitor, and watchdog timer.
The ADLINK cExpress-BL computer-on-module with built-in SEMA Cloud functionality is ready-made for Internet of Things (IoT) applications. The cExpress-BL is able to connect legacy industrial devices and other IoT systems to the cloud, extract raw data from these devices, determine which data to save locally and which to send to the cloud for further analysis. The results these analyses can provide valuable information for policy decision making and generate innovative business opportunities.
| Technical specifications | |
|
Core System | |
|---|---|
| CPU | 5th Generation Intel® Core™ and Celeron® Processor (Mobile) - 14nm (formerly "Broadwell U-Series")
Core™ i7-5650U 2.2 GHz (3.2 GHz Turbo), 4MB, 15W (2C/GT3) Core™ i5-5350U 1.8 GHz (2.9 GHz Turbo), 3MB, 15W (2C/GT3) Core™ i3-5010U 2.1 GHz (no Turbo), 3MB, 15W (2C/GT2) Supports: Intel® VT, Intel® TXT, Intel® SSE4.2, Intel® HT Technology, Intel® 64 Architecture, Execute Disable Bit, Intel® Turbo Boost Technology 2.0, Intel® AVX2, Intel® AES-NI, Intel® PCLMULQDQ Instruction, Intel® Device Protection Technology with Intel® Secure Key, Intel® TSX-NI. Note: Availability of features may vary between processor SKUs. |
| Memory | Dual channel non-ECC 1600/1333 MHz DDR3L memory up to 16 GB in dual SODIMM socket |
| Embedded BIOS | AMI EFI with CMOS backup in 8MB SPI BIOS with Intel AMT 10 support |
| Expansion Busses | 4 PCI Express x1: lanes 0/1/2/3
LPC bus, SMBus (system) , I2C (user) |
| SEMA Board Controller | Supports : Voltage/Current monitoring, Power sequence debug support, AT/ATX mode control, Logistics and Forensic information, Flat Panel Control, General Purpose I2C, Failsafe BIOS (dual BIOS ), Watchdog Timer and Fan Control |
| Debug Headers | 40-pin multipurpose flat cable connector for use in combination with DB-40 debug module, providing BIOS POST code LED, BMC access, SPI BIOS flashing, power test points, debug LEDs
60-pin XDP header for ICE debug of CPU/Chipset |
|
Video | |
| GPU Feature Support | Generation 8 Intel graphics core architecture, supporting 3 independent and simultaneous displays
Combinations of DisplayPort/HDMI/LVDS or eDP outputs Encode/transcode HD content Playback of high definition content including Blu-ray Disc Superior image quality with sharper, more colorful images Playback of Blu-ray disc S3D content using HDMI (1.4a spec compliant with 3D) DirectX Video Acceleration (DXVA) support for accelerating video processing Full AVC/VC1/MPEG2 HW Decode Advanced Scheduler 2.0, 1.0, XPDM support Windows 8, Windows 7, OSX, Linux OS support DirectX 11.1, DirectX 11.1+, DirectX 10.1, DirectX 10, DirectX 9 support OpenGL 4.2/4.0 support |
| LVDS/eDP | Single/dual channel 18/24-bit LVDS (default)
eDP support (optional) |
| Digital Display Interface | DDI1 supporting DisplayPort / HDMI
DDI2 supporting DisplayPort / HDMI |
|
Audio | |
| Chipset | Intel® HD Audio integrated in U-Series SoC |
| Audio Codec | located on carrier Express-BASE6 (ALC886 standard supported) |
|
Ethernet | |
| Intel® MAC/PHY | i218LM (Enterprise SKU) with AMT 10 support |
| Interface | 10/100/1000 GbE connection |
|
I/O Interfaces | |
| USB | 2x USB 1.1/2.0/3.0 (USB 0,1) and 6x USB 1.1/2.0 (USB 2,3,4,5,6,7) |
| SATA | Four ports SATA 6Gb/s (SATA0, SATA1, SATA2, SATA3) |
| Serial | 2 UART ports COM1/2 with console redirection |
| GPIO | 4 GPO and 4 GPI |
| Super I/O | Supported on carrier if needed (standard support for W83627DHG-P) |
|
TPM (Optional) | |
| Chipset | Atmel AT97SC3204 |
| Type | TPM 1.2 |
|
Power | |
| Standard Input | ATX = 12V±5% / 5Vsb ±5% or AT = 12V±5% |
| Wide Input | ATX = 5~20 V / 5Vsb ±5% or AT = 5 ~20V |
| Management | ACPI 4.0 compliant, Smart Battery support |
| Power States | C1-C6, S0, S4, S3, S5, S5 ECO mode (Wake on USB S3/S4, WOL S3/S4/S5) |
| ECO mode | Supports deep S5 mode for power saving |
| Dimension | Compact size: 95 mm x 95 mm |
| HALT | Thermal Stress, Vibration Stress, Thermal Shock and Combined Test |
| Operating Systems | Standard Support Windows 7/8.1U 32/64-bit, Linux 32/64-bit
Extended Support (BSP) WES7, WE8S, Linux, VxWorks (all support 32/64-bit) |
|
Environmental and physical specifications | |
| Operating Temperature | Standard: 0°C to 60°C
Extreme Rugged: -40°C + 85°C (optional) |
| Humidity | 5-90% RH operating, non-condensing
5-95% RH storage (operating with conformal coating) |
| Shock and Vibration | IEC 60068-2-64 and IEC-60068-2-27
MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D |
| Model | Description |
| cExpress‑BL‑i7‑5650U | Compact COM Express Type 6 module with Intel Core i7-5650U at 2.2/3.2 GHz with GT3 level graphics |
| cExpress-BL-i5-5350U | Compact COM Express Type 6 module with Intel Core i5-5350U at 1.8/2.9 GHz with GT3 level graphics |
| cExpress‑BL‑i3‑5010U | Compact COM Express Type 6 module with Intel Core i3-5010U at 2.1 GHz with GT2 level graphics |
| cExpress-BL-Celeron | Compact COM Express Type 6 module with Intel Celeron |
| Accessory | |
| HTS-cBL-B | Heatspreader for cExpress-BL with threaded standoffs for bottom mounting |
| HTS-cBL-BT | Heatspreader for cExpress-BL with through hole standoffs for top mounting |
| THS-cBL-B | Low profile heatsink for cExpress-BL with threaded standoffs for bottom mounting |
| THS-cBL-BT | Low profile heatsink for cExpress-BL with through hole standoffs for top mounting |
| THSF-cBL-B | High profile heatsink with Fan for cExpress-BL with threaded standoffs for bottom mounting |
| THSH-cBL-B | High profile heatsink for cExpress-BL with through hole standoffs for bottom mounting |
| Starter Kit | |
| Starter Kit plus | Starter kit for cExpress-BL |
