cExpress-KL
Vendor:ADLINK Technology Inc.
- Details
- Specification
- Order information
- 7th Generation Intel Core and Celeron Processors
- Up to 32GB Dual Channel DDR4 at 1867/2133MHz
- Up to 3 independent displays in combinations of DDI, LVDS, VGA, eDP
- Extreme Rugged operating temperature: -45°C to +85°C
The cExpress-KL is a COM Express COM.0 R2.1 Type 6 Compact size module featuring the 64-bit 7th Generation Intel Core i7/i5/i3 and Intel Celeron Ultra-Low TDP processors (formerly «Kaby Lake U») with CPU, memory controller, graphics processor and I/O hub on a single chip.
Leveraging the benefits provided by the 7th generation Intel Core and Celeron System-on-Chip, the cExpress-KL is specifically designed for customers who need optimum processing and graphics performance with suitable power consumption using Intel’s Configurable TDP in a long product life solution.
The cExpress-KL’s Intel processors support Intel Hyper- Threading Technology (up to 2 cores, 4 threads) and up to 32 GB of non-ECC DDR4 dual-channel memory at 1866/2133 MHz in dual stacked SODIMM sockets to provide excellent overall performance. Integrated Intel Generation 9 Low Power Graphics includes features such as OpenGL 4.4/4.3, DirectX 11.3/11, Intel Clear Video HD Technology, Advanced Scheduler 2.0, 1.0, XPDM support, and DirectX Video Acceleration (DXVA2) support for AVC/VC1/MPEG2/HEVC/VP8/JPEG hardware decode and AVC/MPEG2/HEVC/VP8/JPEG hardware encode.
Graphics outputs include dual-channel 18/24-bit LVDS (eDP by build option), two DDI ports supporting HDMI/DVI/DisplayPort and VGA (by build option). The cExpress-KL is specifically designed for customers with high-performance processing graphics requirements who want to outsource the custom core logic of their systems for reduced development time.
The cExpress-KL features a single onboard Gigabit Ethernet port, up to six PCIe Gen3 ports (build option), four USB 3.0 ports, four USB 2.0 ports, and three SATA 6Gb/s ports. Support is provided for SMBus and I2C. The module is equipped with SPI AMI EFI BIOS with CMOS backup, supporting embedded features such as remote console, CMOS backup, hardware monitor, and watchdog timer.
| Technical specifications | |
|
Core System |
|
|---|---|
| CPU |
Mobile 7th Generation Intel Core and Celeron® Processors - 14nm (code name “Kaby Lake-U”) Core™ i7-7600U 2.8/3.9GHz (Turbo), 4M, 15W (cTDP) (2C/GT2) Core™ i5-7300U 2.6/3.5GHz (Turbo), 3M, 15W (cTDP) (2C/GT2) Core™ i3-7100U 2.4GHz, 3M, 15W (2C/GT2) Celeron® 3965U 2.2GHz, 2M, 15W (2C/GT1) Supports: Intel VT, Intel TXT, Intel SSE4.2, Intel HT Technology, Intel 64 Architecture, Execute Disable Bit, Intel Turbo Boost Technology 2.0, Intel AVX2, Intel AES-NI, PCLMULQDQ Instruction, Intel Secure Key and Intel TSX Notes: Availability of features may vary between processor SKUs. |
| Memory | Dual channel 1867/2133 MHz DDR4 memory up to 32GB in dual SODIMM sockets |
| Embedded BIOS | AMI EFI with CMOS backup in 8MB SPI BIOS with Intel AMT 11.0 support |
| Cache | 4MB for Core i7, 3MB for Core i5 and i3, 2M for Celeron |
| Expansion Busses |
Up to 6 PCI Express x1 (AB): Lanes 0-5 (configurable to x2, x4, Lane 5 by build option) Note: Gen3 for Core i7/i5/i3. LPC bus, SMBus (system), I2C (user) |
| SEMA Board Controller | Supports: Voltage/current monitoring, power sequence debug support, AT/ATX mode control, logistics and forensic information, flat panel control, general purpose I2C, failsafe BIOS (dual BIOS), watchdog timer and fan control |
| Debug Headers |
40-pin multipurpose flat cable connector for use with DB-40 debug module providing BIOS POST code LED, BMC access, SPI BIOS flashing, power testpoints, debug LEDs 60-pin XDP header for ICE debug of CPU/chipset |
|
Video |
|
| GPU Feature Support |
Intel Generation 9 LP Graphics Core Architecture, supporting 3 independent and simultaneous display combinations of DisplayPort/HDMI/LVDS or VGA/eDP outputs Hardware encode/transcode HD content (including HEVC) DirectX 12, DirectX 11.2, DirectX 11.1, DirectX 11, DirectX 10.1, DirectX 10, DirectX 9 support OpenGL 5.0, 4.4/4.3 and ES 2.0 support OpenCL 2.1, 2.0/1.2 support |
| Digital Display Interface | DDI1/2 supporting DisplayPort/HDMI/DVI |
| VGA | Build option support through DP-to-VGA IC (in place of DDI2) |
| LVDS | Single/dual channel 18/24-bit LVDS from eDP-to-LVDS IC |
| eDP | 4 lanes support (build option, in place of LVDS) |
|
Audio |
|
| Chipset | Intel HD Audio integrated in SoC |
| Audio Codec | On carrier Express-BASE6 (ALC886 standard support) |
|
Ethernet |
|
| Intel MAC/PHY | Intel I219LM/V |
| Interface | 10/100/1000 GbE connection |
|
I/O Interfaces and storage |
|
| USB | 4x USB 1.1/2.0/3.0 (USB 0,1,2,3) and 4x USB 1.1/2.0 (USB 4,5,6,7) |
| SATA | 3x SATA 6 Gb/s |
| Serial | 2 UART ports with console redirection |
| GPIO/SD | 4 GPO and 4 GPI from BMC |
| Super I/O | Supported on carrier if needed (standard support for W83627DHG-P) |
|
TPM |
|
| Chipset | Infineon SLB 9665 XT2.0 |
| Type | TPM 2.0 |
|
Power |
|
| Standard Input | ATX = 12V±5% / 5Vsb ±5% or AT = 12V±5% |
| Wide Input | ATX = 5-20 V / 5Vsb ±5% or AT=5-20V |
| Management | ACPI 5.0 compliant, Smart Battery support |
| Power States | C1-C6, S0, S1, S3, S4, S5 , S5 ECO mode (Wake on USB S3/S4, WOL S3/S4/S5) |
| ECO mode | Supports deep S5 mode for power saving |
|
Other |
|
| Form Factor | PICMG COM.0, Rev 2.1 Type 6 |
| Dimension | Compact size: 95 mm x 95 mm |
| Operating Systems |
Standard Support: Windows 10 IOT Enterprise 64-bit, Linux 64-bit, VxWorks 7 64-bit (TBD) Extended Support (BSP): Linux 64-bit, VxWorks 64-bit (TBD) |
|
Environmental and physical specifications |
|
| Operating temperature |
Standard: 0°C to 60°C Extreme Rugged: -45°C to 85°C (build option) |
| Humidity |
5-90% RH operating, non-condensing 5-95% RH storage (and operating with conformal coating) |
| Shock and Vibration |
IEC 60068-2-64 and IEC-60068-2-27 MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D |
| HALT | Thermal Stress, Vibration Stress, Thermal Shock and Combined Test |
| Model | Description |
| cExpress‑KL‑i7‑7600U | Compact COM Express Type 6 module with Intel Core i7-7600U and GT2 graphics |
| cExpress-KL-i5-7300U | Compact COM Express Type 6 module with Intel Core i5-7300U and GT2 graphics |
| cExpress-KL-i3-7100U | Compact COM Express Type 6 module with Intel Core i3-7100U and GT2 graphics |
| cExpress-KL-3965U | Compact COM Express Type 6 module with Intel Celeron 3965U and GT1 graphics |
| Accessories | |
| HTS-cKL-B | Heatspreader for cExpress-KL with threaded standoffs for bottom mounting |
| HTS-cKL-BT | Heatspreader for cExpress-KL with through hole standoffs for top mounting |
| THS-cKL-B | Low profile heatsink for cExpress-KL with threaded standoffs for bottom mounting |
| THS-cKL-BT | Low profile heatsink for cExpress-kL with through hole standoffs for top mounting |
| THSH-cKL-B | High profile heatsink for cExpress-KL with threaded standoffs for top mounting |
| THSF-cKL-B | High profile heatsink with Fan for cExpress-KL with threaded standoffs for bottom mounting |
| COM Express Type 6 Starter Kit Plus | COM Express form factor starter kit with Express-BASE6 board, power supply, and accessory kit |
