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COM Express Compact Size Type 6 Module with Mobile 7th Gen Intel Core and Celeron Processors (formerly codename: Kaby Lake)
  • Details
  • Specification
  • Order information
  • 7th Generation Intel Core and Celeron Processors
  • Up to 32GB Dual Channel DDR4 at 1867/2133MHz
  • Up to 3 independent displays in combinations of DDI, LVDS, VGA, eDP
  • Extreme Rugged operating temperature: -45°C to +85°C

The cExpress-KL is a COM Express COM.0 R2.1 Type 6 Compact size module featuring the 64-bit 7th Generation Intel Core i7/i5/i3 and Intel Celeron Ultra-Low TDP processors (formerly «Kaby Lake U») with CPU, memory controller, graphics processor and I/O hub on a single chip.

Leveraging the benefits provided by the 7th generation Intel Core and Celeron System-on-Chip, the cExpress-KL is specifically designed for customers who need optimum processing and graphics performance with suitable power consumption using Intel’s Configurable TDP in a long product life solution.

The cExpress-KL’s Intel processors support Intel Hyper- Threading Technology (up to 2 cores, 4 threads) and up to 32 GB of non-ECC DDR4 dual-channel memory at 1866/2133 MHz in dual stacked SODIMM sockets to provide excellent overall performance. Integrated Intel Generation 9 Low Power Graphics includes features such as OpenGL 4.4/4.3, DirectX 11.3/11, Intel Clear Video HD Technology, Advanced Scheduler 2.0, 1.0, XPDM support, and DirectX Video Acceleration (DXVA2) support for AVC/VC1/MPEG2/HEVC/VP8/JPEG hardware decode and AVC/MPEG2/HEVC/VP8/JPEG hardware encode.

Graphics outputs include dual-channel 18/24-bit LVDS (eDP by build option), two DDI ports supporting HDMI/DVI/DisplayPort and VGA (by build option). The cExpress-KL is specifically designed for customers with high-performance processing graphics requirements who want to outsource the custom core logic of their systems for reduced development time.

The cExpress-KL features a single onboard Gigabit Ethernet port, up to six PCIe Gen3 ports (build option), four USB 3.0 ports, four USB 2.0 ports, and three SATA 6Gb/s ports. Support is provided for SMBus and I2C. The module is equipped with SPI AMI EFI BIOS with CMOS backup, supporting embedded features such as remote console, CMOS backup, hardware monitor, and watchdog timer.

Technical specifications

Core System

CPU Mobile 7th Generation Intel Core and Celeron® Processors - 14nm (code name “Kaby Lake-U”)

Core™ i7-7600U 2.8/3.9GHz (Turbo), 4M, 15W (cTDP) (2C/GT2)
Core™ i5-7300U 2.6/3.5GHz (Turbo), 3M, 15W (cTDP) (2C/GT2)
Core™ i3-7100U 2.4GHz, 3M, 15W (2C/GT2)
Celeron® 3965U 2.2GHz, 2M, 15W (2C/GT1)

Supports: Intel VT, Intel TXT, Intel SSE4.2, Intel HT Technology, Intel 64 Architecture, Execute Disable Bit, Intel Turbo Boost Technology 2.0, Intel AVX2, Intel AES-NI, PCLMULQDQ Instruction, Intel Secure Key and Intel TSX

Notes: Availability of features may vary between processor SKUs.
Memory Dual channel 1867/2133 MHz DDR4 memory up to 32GB in dual SODIMM sockets
Embedded BIOS AMI EFI with CMOS backup in 8MB SPI BIOS with Intel AMT 11.0 support
Cache 4MB for Core i7, 3MB for Core i5 and i3, 2M for Celeron
Expansion Busses Up to 6 PCI Express x1 (AB): Lanes 0-5 (configurable to x2, x4, Lane 5 by build option)

Note: Gen3 for Core i7/i5/i3.

LPC bus, SMBus (system), I2C (user)
SEMA Board Controller Supports: Voltage/current monitoring, power sequence debug support, AT/ATX mode control, logistics and forensic information, flat panel control, general purpose I2C, failsafe BIOS (dual BIOS), watchdog timer and fan control
Debug Headers 40-pin multipurpose flat cable connector for use with DB-40 debug module providing BIOS POST code LED, BMC access, SPI BIOS flashing, power testpoints, debug LEDs
60-pin XDP header for ICE debug of CPU/chipset


GPU Feature Support Intel Generation 9 LP Graphics Core Architecture, supporting 3 independent and simultaneous display combinations of DisplayPort/HDMI/LVDS or VGA/eDP outputs
Hardware encode/transcode HD content (including HEVC)
DirectX 12, DirectX 11.2, DirectX 11.1, DirectX 11, DirectX 10.1, DirectX 10, DirectX 9 support
OpenGL 5.0, 4.4/4.3 and ES 2.0 support
OpenCL 2.1, 2.0/1.2 support
Digital Display Interface DDI1/2 supporting DisplayPort/HDMI/DVI
VGA Build option support through DP-to-VGA IC (in place of DDI2)
LVDS Single/dual channel 18/24-bit LVDS from eDP-to-LVDS IC
eDP 4 lanes support (build option, in place of LVDS)


Chipset Intel HD Audio integrated in SoC
Audio Codec On carrier Express-BASE6 (ALC886 standard support)


Intel MAC/PHY Intel I219LM/V
Interface 10/100/1000 GbE connection

I/O Interfaces and storage

USB 4x USB 1.1/2.0/3.0 (USB 0,1,2,3) and 4x USB 1.1/2.0 (USB 4,5,6,7)
SATA 3x SATA 6 Gb/s
Serial 2 UART ports with console redirection
GPIO/SD 4 GPO and 4 GPI from BMC
Super I/O Supported on carrier if needed (standard support for W83627DHG-P)


Chipset Infineon SLB 9665 XT2.0
Type TPM 2.0


Standard Input ATX = 12V±5% / 5Vsb ±5% or AT = 12V±5%
Wide Input ATX = 5-20 V / 5Vsb ±5% or AT=5-20V
Management ACPI 5.0 compliant, Smart Battery support
Power States C1-C6, S0, S1, S3, S4, S5 , S5 ECO mode (Wake on USB S3/S4, WOL S3/S4/S5)
ECO mode Supports deep S5 mode for power saving


Form Factor PICMG COM.0, Rev 2.1 Type 6
Dimension Compact size: 95 mm x 95 mm
Operating Systems Standard Support: Windows 10 IOT Enterprise 64-bit, Linux 64-bit, VxWorks 7 64-bit (TBD)
Extended Support (BSP): Linux 64-bit, VxWorks 64-bit (TBD)

Environmental and physical specifications

Operating temperature Standard: 0°C to 60°C
Extreme Rugged: -45°C to 85°C (build option)
Humidity 5-90% RH operating, non-condensing
5-95% RH storage (and operating with conformal coating)
Shock and Vibration IEC 60068-2-64 and IEC-60068-2-27
MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D
HALT Thermal Stress, Vibration Stress, Thermal Shock and Combined Test
Model Description
cExpress‑KL‑i7‑7600U Compact COM Express Type 6 module with Intel Core i7-7600U and GT2 graphics
cExpress-KL-i5-7300U Compact COM Express Type 6 module with Intel Core i5-7300U and GT2 graphics
cExpress-KL-i3-7100U Compact COM Express Type 6 module with Intel Core i3-7100U and GT2 graphics
cExpress-KL-3965U Compact COM Express Type 6 module with Intel Celeron 3965U and GT1 graphics
HTS-cKL-B Heatspreader for cExpress-KL with threaded standoffs for bottom mounting
HTS-cKL-BT Heatspreader for cExpress-KL with through hole standoffs for top mounting
THS-cKL-B Low profile heatsink for cExpress-KL with threaded standoffs for bottom mounting
THS-cKL-BT Low profile heatsink for cExpress-kL with through hole standoffs for top mounting
THSH-cKL-B High profile heatsink for cExpress-KL with threaded standoffs for top mounting
THSF-cKL-B High profile heatsink with Fan for cExpress-KL with threaded standoffs for bottom mounting
COM Express Type 6 Starter Kit Plus COM Express form factor starter kit with Express-BASE6 board, power supply, and accessory kit
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