EHL9A2
COM Express Mini module
Vendor:DFI
- Details
- Specification
- Order information
- Intel Atom processor Elkhart Lake series
- Dual channel LPDDR4X 3200MHz/4267MHz up to 16GB
- Multiple expansions, rich I/O
- Operating temperature: -40°C to +85°C (max.)
COM Express Mini module delivers high performance on a small footprint, which features a 55×84 mm size. It is ideal for space-limited, power-saving, and mobile applications. DFI’s ultra-small modules are available with COM Express pin-out Type 10.
| Technical specifications | |
|
System |
|
|---|---|
| Processor | Intel Atom x6000 series and Intel Celeron and Pentium N & J series processors |
| Memory |
LPDDR4X up to 16GB Dual Channel LPDDR4X 3733MHz/4267MHz which depends on processor *Note1: 8GB/16GB supported by project basis. *Note2: In-band ECC (IBECC) with normal memory chip support on selected ATOM x6000 series SKUs. IBECC can set enabled or disabled in BIOS setup menu. |
| BIOS | AMI SPI 256Mbit |
|
Graphics |
|
| Controller | Intel HD Graphics |
| Feature |
OpenGL 5.0, DirectX 12, OpenCL 2.1 HW Decode: AVC/H.264, MPEG2, VC1, WMV9, JPEG/MJPEG, HEVC/H.265, VP8, VP9, MVC HW Encode: AVC/H.264, JPEG/MJPEG, HEVC/H.265, VP9, MVC |
| Display |
1x DDI 1x LVDS/eDP LVDS: single channel 24-bit, resolution up to 1920x1200 @ 60Hz eDP: resolution up to 4096x2160 @ 60Hz HDMI: resolution up to 4096x2160 @ 30Hz DP++: resolution up to 4096x2160 @ 60Hz, 3840x2160 @60Hz |
| Dual Displays | DDI + LVDS/eDP |
|
Expansion |
|
| Interface |
4x PCIe x1 (Gen 3) 1x SD/SDIO (available upon request) 1x I2C 1x SMBus 1x LPC 1x Speaker 1x SD 3.0 1x SPI 2x UART (TX/RX) |
|
Audio |
|
| Interface | HD Audio |
|
Ethernet |
|
| Controller | 1x Intel I225-IT / I225-LM (10/100/1000Mbps/2.5Gbps) |
|
I/O |
|
| USB |
2x USB 3.1 8x USB 2.0 |
| SATA | 2x SATA 3.0 (up to 6Gb/s) |
| eMMC | 1x 8GB/16GB/32GB/64GB/128GB eMMC 5.1 (available upon request) |
| DIO | 1x 8-bit DIO |
|
Watchdog Timer |
|
| Output & Interval | System Reset, programmable via software from 1 to 255 seconds |
|
Security |
|
| TPM | dTPM or fTPM (Optional) |
|
Power |
|
| Type |
4.75V~20V, 5VSB, VCC_RTC (ATX mode) 4.75V~20V, VCC_RTC (AT mode) |
|
OS Support |
|
| OS Support | Windows 10 IoT Enterprise 64-bit, Linux |
|
Mechanical |
|
| Dimensions | COM Express Mini 84mm (3.3") x 55mm (2.16") |
| Compliance | PICMG COM Express® R3.0, Type 10 |
|
Environmental and physical specifications |
|
| Temperature |
Operating: -5 to 65°C, -40 to 85°C Storage: -40 to 85°C |
| Humidity |
Operating: 5 to 90% RH Storage: 5 to 90% RH |
| Certifications | CE, FCC |
| Model | Description |
| 770‑EHL9A21‑000G | Intel Atom x6425RE, LPDDR4 16GB on board, eMMC 64GB, LVDS, DIO, TPM 2.0, -40 to 85°C |
| 770‑EHL9A21‑100G | Intel Atom x6414RE, LPDDR4 16GB on board, eMMC 64GB, LVDS, DIO, -40 to 85°C |
| 770‑EHL9A21‑200G | Intel Atom x6212RE, LPDDR4 8GB on board, eMMC 64GB, LVDS, DIO, -40 to 85°C |
| 770‑EHL9A21‑300G | Intel Atom J6426, LPDDR4 8GB on board, eMMC 64GB, LVDS, DIO, -5 to 65°C |
| 770‑EHL9A21‑400G | Intel Atom N6211, LPDDR4 8GB on board, eMMC 64GB, eDP, SDIO, -5 to 65°C |
| 770‑EHL9A21‑500G | Intel Atom x6425RE, LPDDR4 8GB on board, eMMC 64GB, LVDS, DIO, TPM 2.0, -40 to 85°C |
| A71-808341-010G | Heat spreader for IHS |
| A71-808341-020G | Heat spreader for BARE-DIE CPU |
| 770-COM104-000G | COM100-B carrier board kit |
| 770-CM3351-000G | COM335 carrier board kit |
