ETX-BT
ETX Module
Vendor:ADLINK Technology Inc.
- Details
- Specification
- Order information
- Single, dual or quad-core Intel® Atom™ SOC or Celeron® Processor
- Single SODIMM for up to 4GB DDR3L
- Dimension 114 mm x 95 mm
- Extreme Rugged operating temperature: -40°C to +85°C (optional)
The ETX computer-on-module specification includes the standard functions required for almost any application, such as graphics, Ethernet, audio, IDE, floppy, keyboard/mouse, parallel, serial and USB ports, and PCI and ISA system busses.
A custom designed carrier board complements the ETX core module with additional functionality that is required for a specific application. The carrier board provides the interface to connect the module to peripherals such as hard disk, mouse, and display. Connectors on the carrier board can be placed exactly where needed to optimize the final package and minimize cabling. This results in a more reliable product and simplifies system integration. A single carrier board can be used with different ETX modules when the same functionality is required at different performance levels, allowing great ease in end product diversification.
The ADLINK ETX-BT computer-on-module with built-in SEMA Cloud functionality is ready-made for Internet of Things (IoT) applications. The ETX-BT is able to connect legacy industrial devices and other IoT systems to the cloud, extract raw data from these devices, determine which data to save locally and which to send to the cloud for further analysis. The results these analyses can provide valuable information for policy decision making and generate innovative business opportunities.
A custom designed carrier board complements the ETX core module with additional functionality that is required for a specific application. The carrier board provides the interface to connect the module to peripherals such as hard disk, mouse, and display. Connectors on the carrier board can be placed exactly where needed to optimize the final package and minimize cabling. This results in a more reliable product and simplifies system integration. A single carrier board can be used with different ETX modules when the same functionality is required at different performance levels, allowing great ease in end product diversification.
The ADLINK ETX-BT computer-on-module with built-in SEMA Cloud functionality is ready-made for Internet of Things (IoT) applications. The ETX-BT is able to connect legacy industrial devices and other IoT systems to the cloud, extract raw data from these devices, determine which data to save locally and which to send to the cloud for further analysis. The results these analyses can provide valuable information for policy decision making and generate innovative business opportunities.
| Technical specifications | |
|
Core System | |
|---|---|
| CPU | CPU Single, dual or quad-core Intel® Atom™ or Celeron® Processor
Atom™ E3845 1.91 GHz 542/792 (Turbo) 10W (4C/1333) Atom™ E3827 1.75 GHz 542/792 (Turbo) 8W (2C/1333) Atom™ E3826 1.46 GHz 533/667 (Turbo) 7W (2C/1066) Atom™ E3825 1.33 GHz 533 (No Turbo) 6W (2C/1066) Atom™ E3815 1.46 GHz 400 (No Turbo) 5W (1C/1066) Celeron® N2930 1.83 GHz, 400/756 (Turbo) 7.5W (4C/1066) Celeron® J1900 2.00 GHz, 688/792 (Turbo) 10W (4C/1333) Supports: Single, dual or quad Out-of-Order Execution (OOE) processor cores, Intel® VT-x, Intel® SSE4.1 and SSE4.2, Intel® 64 architecture, IA 32-bit, PCLMULQDQ Instruction DRNG, Intel® Thermal Monitor (TM1 & TM2) Note: Availability of features may vary between processor SKUs. |
| Memory | Single SODIMM socket for up to 4 GB non-ECC 1333/1066 MHz DDR3L memory |
| Embedded BIOS | AMI EFI with CMOS backup in 8MB SPI BIOS |
| Cache | Primary 32 kB, 8-way L1 instruction cache and 24 kB, 6-way L1 write-back data cache |
| Expansion Busses | PCI 32-bit rev 2.3 at 33MHz supporting 4 bus masters
ISA 16-bit (through LPC-ISA bridge), no DMA support SMBus (system) , I2C (user) |
| SEMA Board Controller | Supports: Voltage/Current monitoring, Power sequence debug support, AT/ATX mode control, Logistics and Forensic information, Flat Panel Control, General Purpose I2C, Watchdog Timer |
| Debug Headers | 40-pin multipurpose flat cable connector
Use in combination with DB-40 debug module providing BIOS POST code LEDs, BMC access, SPI BIOS flashing, power testpoints, debug LEDs |
|
Video | |
| GPU Feature Support | 7th generation graphics Intel core architecture with four Execution Units, supporting two independent displays
3D graphics hardware acceleration Support for DirectX 11, OCL 1.1, OGL ES Halt/2.0/1.1, OGL 3.2 Video decode hardware acceleration including support for H.264, MPEG2, MVC, VC-1, WMV9 and VP8 Video encode hardware acceleration including support for H.264, MPEG2 and MVC formats |
| VGA | Analog VGA supporting resolutions of up to 2560 x 1600@60Hz, 24bpp |
| LVDS | Single/dual channel 18/24-bit LVDS from eDP (two lane) |
|
Audio | |
| Chipset | Intel® HD Audio integrated in SOC |
| Audio Codec | TEMPO, 92HD91B2 (optional) |
|
Ethernet | |
| Type | Intel i210, external EEPROM |
| Interface | 10/100 Mbps LAN (GbE via onboard connector) |
|
Power | |
| Standard Input | ATX = 5V±5% / 5Vsb ±5% or AT = 5V±5% |
| Management | ACPI 4.0 compliant, Smart Battery support |
| Power States | C0, C1, C1E, C4, C6; S0, S3, S4, S5 (Wake on USB S3/S4, WOL S3/S4/S5) |
| ECO mode | Supports deep S5 (ECO mode) for power saving |
|
Multi I/O and Storage | |
| USB | 4 ports USB 2.0 |
| PATA | PATA IDE with Master/Slave support |
| SATA | SATA 3Gb/s ports |
| SSD | Optional SATA SSD 2~64 GB (occupies one SATA port) |
|
Super I/O | |
| Chipset | Nuvoton W83627DHG-PT |
| Serial | Two high speed RS-232C ports (COM1/COM2) |
| IrDA | Supports IrDA 1.0 SIR protocol or Sharp ASK-IR protocol |
| Parallel | SPP, ECP and EPP mode support (LPT1) |
| Keyboard/Mouse | PS/2 type keyboard and mouse |
|
Mechanical | |
| Form Factor | ETX Rev 3.02 |
| Dimension | 114 mm x 95 mm |
|
Operating Systems | |
| Standard Support | Windows 7/8 32/64-bit, Linux 32/64-bit |
| Extended Support | (BSP) WES7/8, WEC7/8, Linux, VxWorks |
|
Environmental and physical specifications | |
| Operating Temperature | Standard Operating Temperature: 0°C to +60°C
Screened Extreme Rugged™ Operating Temperature: -40°C to +85°C (optional) |
| Humidity | 5-90% RH operating, non-condensing
5-95% RH storage (operating with conformal coating) |
| Shock and Vibration | IEC 60068-2-64 and IEC-60068-2-27
MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D |
| HALT | Thermal Stress, Vibration Stress, Thermal Shock and Combined Test |
| Model | Description |
| ETX-BT-E3845 | ETX module with Intel Atom E3845 at 1.91 GHz |
| ETX-BT-E3827 | ETX module with Intel Atom E3827 at 1.75 GHz |
| ETX-BT-E3826 | ETX module with Intel Atom E3826 at 1.46 GHz |
| ETX-BT-E3825 | ETX module with Intel Atom E3825 at 1.33 GHz |
| ETX-BT-E3815 | ETX module with Intel Atom E3815 at 1.46 GHz |
| ETX‑BT‑N2930 | ETX module with Intel Celeron N2930 at 1.83 GHz |
| ETX‑BT‑N2807 | ETX Module with Intel Celeron N2807 2.16 GHz, 4.5W (2C) |
| ETX-BT-J1900 | ETX module with Intel Celeron J1900 at 2.00 G |
| ETX-BT-E3805 | ETX Module with Intel Atom E3805 1.33 GHz, 3W |
| Accessories | |
| HTS-eBT-B | Heatspreader for ETX-BT with threaded standoffs for bottom mounting |
| HTS-eBT-BT | Heatspreader for ETX-BT with through-hole standoffs for top mounting |
| THS-eBT-BL | Low profile heatsink for ETX-BT with threaded standoffs for bottom mounting |
| THS-eBT-BTL | Low profile heatsink for ETX-BT with through-hole standoffs for top mounting |
| THSF-eBT-B | High profile heatsink for ETX-BT with threaded standoffs for bottom mounting |
