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COM Express Basic Size Type 6 Module
  • Details
  • Specification
  • Order information
  • 5th Gen Intel Core and Xeon Processors (codename: Broadwell)
  • Up to 32GB dual channel DDR3L at 1600 MHz
  • Seven PCIe x1 and one PCIe x16
  • Extreme Rugged operating temperature:-40°C to +85°C (opt.)

The Express-BL is a COM Express® COM.0 R2.1 Basic Size Type 6 module supporting the 64-bit 5th Generation Intel® Core™ i7 and Xeon® E3-1200L v4 processors (codename "Broadwell") with Intel® QM87 Chipset. The Express-BL is specifically designed for customers who need excellent graphics performance and high-level processing performance in a long product life solution.

The Express-BL features Intel® Hyper-Threading Technology (up to 4 cores, 8 threads) and DDR3L non-ECC dual-channel memory at 1333/1600 MHz to provide excellent overall performance. Intel® Flexible Display Interface and Direct Media Interface provide high speed connectivity from the CPU to the Intel® QM87 Chipset.

Integrated Intel® Generation 8 Graphics includes features such as OpenGL 4.0, DirectX 11, Intel® Clear Video HD Technology, Advanced Scheduler 2.0, 1.0, XPDM support, and DirectX Video Acceleration (DXVA) support for full AVC/VC1/MPEG2 hardware decode. Graphics outputs include VGA, LVDS and three DDI ports supporting HDMI/DVI/DisplayPort and eDP as a build option. The Express-BL is specifically designed for customers with high-performance processing graphics requirements who want to outsource the custom core logic of their systems for reduced development time.

The Express-BL has dual stacked SODIMM sockets for up to 16 GB non-ECC type DDR3L memory. In addition to the onboard integrated graphics, a multiplexed PCIe x16 graphics bus is available for discrete graphics expansion. Input/output features include a single onboard Gigabit Ethernet port, USB 3.0 ports and USB 2.0 ports, and SATA 6 Gb/s ports. Support is provided for SMBus and I2C. The module is equipped with SPI AMI EFI BIOS with CMOS backup, supporting embedded features such as remote console, hardware monitor, and watchdog timer.

The ADLINK Express-BL computer-on-module with built-in SEMA Cloud functionality is ready-made for Internet of Things (IoT) applications. The Express-BL is able to connect legacy industrial devices and other IoT systems to the cloud, extract raw data from these devices, determine which data to save locally and which to send to the cloud for further analysis. The results these analyses can provide valuable information for policy decision making and generate innovative business opportunities.

Technical specifications

Core System

CPU 5th Generation Intel® Core™ and Xeon® Processors (Mobile) - 14nm (formerly”Broadwell-H”)
Xeon® E3-1278L v4 2.0/3.3GHz (Turbo), 0.8/1.0GHz (Turbo), 47W (4C/GT3e)
Xeon® E3-1258L v4 1.8/3.2GHz (Turbo), 0.7/1.0GHz (Turbo), 47W (4C/GT2)
Core™ i7-5850EQ 2.7/3.4GHz (Turbo), 0.3/1.0GHz (Turbo), 47W (4C/GT3e)
Core™ i7-5700EQ 2.6/3.4GHz (Turbo), 0.3/1.0GHz (Turbo), 47W (4C/GT2)

Supports: Intel® VT, Intel® TXT, Intel® SSE4.2, Intel® HT Technology, Intel® 64 Architecture, Execute Disable Bit, Intel® Turbo Boost Technology 2.0, Intel® AVX2, Intel® AES-NI, PCLMULQDQ Instruction, Intel® Secure Key and Intel® TSX.

Note: Availability of features may vary between processor SKUs.
Memory Dual channel non-ECC 1600/1333 MHz DDR3L memory up to 32GB in dual SODIMM socket
Embedded BIOS AMI EFI with CMOS backup in 8MB SPI BIOS with Intel® AMT 10 support
Cache 6MB for Xeon E3-1278L v4, E3-1258L v4 and Core™ i7-5850EQ, i7-5700EQ
Expansion Busses 1 PCIe x16 (Gen3), or 2 PCIe x8, or 1 PCIe x8 and 2 PCIe x4
6 PCIe x1 (AB): Lanes 0/1/2/3/4/5
1 PCIe x1 (CD): Lane 6
LPC bus, SMBus (system) , I2C (user)
SEMA Board Controller Supports: Voltage/Current monitoring, Power Sequence debug support, AT/ATX mode control, Logistics and Forensic information, Flat Panel Control, General Purpose I2C, Failsafe BIOS (dual BIOS), Watchdog Timer and Fan Control
Debug Headers 40-pin multipurpose flat cable connector for use in combination with DB-40 debug module providing BIOS POST code LED, BMC access, SPI BIOS flashing, power testpoints, debug LEDs
60-pin XDP header for ICE debug of CPU/chipset


GPU Feature Support Generation 8 Intel® Graphics architecture, supporting 3 independent and simultaneous display combinations of DisplayPort, HDMI, LVDS, VGA or eDP (optional)
Encode/transcode HD content
Playback of high definition content including Blu-ray Disc
Advanced Scheduler 2.0, 1.0 XPDM support
DirectX 11.1, DirectX 11.1+, DirectX 11, DirectX 10.1, DirectX 10, DirectX 9 support
OpenGL 4.0, OpenGL 4.2 support
Digital Display Interface
Digital Display Interface DDI1/2/3 supporting DisplayPort/HDMI/DVI
VGA Analog VGA support with 300 MHz DAC
Analog monitor support up to QXGA (2048 x 1536)
LVDS Single/dual channel 18/24-bit LVDS from eDP (two lanes)
eDP Optional, in place of LVDS and VGA


Chipset Intel® HD Audio integrated in chipset
Audio Codec Located on carrier Express-BASE6 (ALC886 standard support)


Intel® MAC/PHY I218LM with Intel® AMT 10.0 support
Interface 10/100/1000 GbE connection

I/O Interfaces

USB 4x USB 1.1/2.0/3.0 (USB 0,1,2,3) and 4x USB 1.1/2.0 (USB 4,5,6,7)
SATA Four ports SATA 6Gb/s (SATA0, SATA1, SATA2, SATA3)
Serial 2 UART ports COM1/2 with console redirection
GPIO 4 GPO and 4 GPI
Super I/O Supported on carrier if needed (standard support for W83627DHG-P)


Chipset Atmel AT97SC3204
Type TPM 1.2


Standard Input ATX = 12V±5% / 5Vsb ±5% or AT = 12V±5%
Wide Input ATX = 8.5~20 V / 5Vsb ±5% or AT = 8.5 ~20V
Management ACPI 5.0 compliant, Smart Battery support
Power States C1-C6, S0, S1, S3, S4, S5 , S5 ECO mode (Wake on USB S3/S4, WOL S3/S4/S5)
ECO mode Support deep S5 mode for power saving


Form Factor PICMG COM.0: Rev 2.1 Type 6
Dimension Basic size: 125 mm x 95 mm
Operating Systems Standard Support: Windows 7 32/64-bit, Windows 8 64-bit, Linux 64-bit
Extended Support (BSP): WES7 32/64-bit, Windows Embedded 8.1 Industry 64-bit, Linux 64-bit, VxWorks 64-bit

Environmental and physical specifications

Operating Temperature Standard: 0°C to 60°C
Extreme Rugged™: -40°C to +85°C (optional)
Humidity 5-90% RH operating, non-condensing
5-95% RH storage (and operating with conformal coating)
Shock and Vibration IEC 60068-2-64 and IEC-60068-2-27
MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D
HALT Thermal Stress, Vibration Stress, Thermal Shock and Combined Test
Model Description
Express-BL-i7-5850EQ Basic COM Express® Type 6 module with Intel i7-5850EQ at 2.7/3.2GHz with GT3 level graphics with eDRAM
Express-BL-i7-5700EQ Basic COM Express® Type 6 module with Intel i7-5700EQ at 2.6/3.2GHz with GT2 level graphics
Express-BL-E3-1278 Basic COM Express Type6 module with Intel Xeon E3-1278Lv4 at 2.0/3.3GHz with GT3 level graphics with eDRAM
Express-BL-E3-1258 Basic COM Express Type6 module with Intel Xeon E3-1258L v4 at 1.8/3.2GHz with GT2 level graphics
HTS-HL-B Heatspreader for Express-BL with threaded standoffs for bottom mounting
HTS-HL-BT Heatspreader for Express-BL with through hole standoffs for top mounting
THS-HL-BL Low profile heatsink for Express-BL with threaded standoffs for bottom mounting
THS-HL-BT Low profile heatsink for Express-BL with through hole standoffs for top mounting
THSH-HL-BL High profile heatsink for Express-BL with threaded standoffs for top mounting
THSF-HL-BL High profile heatsink with Fan for Express-BL with threaded standoffs for bottom mounting
Starter Kit Plus COM Express Type 6 Starter Kit Plus
NOTE Express-BL and Express-HL share the same thermal solution designs

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