The Express-BL is a COM Express® COM.0 R2.1 Basic Size Type 6 module supporting the 64-bit 5th Generation Intel® Core™ i7 and Xeon® E3-1200L v4 processors (codename "Broadwell") with Intel® QM87 Chipset. The Express-BL is specifically designed for customers who need excellent graphics performance and high-level processing performance in a long product life solution.
The Express-BL features Intel® Hyper-Threading Technology (up to 4 cores, 8 threads) and DDR3L non-ECC dual-channel memory at 1333/1600 MHz to provide excellent overall performance. Intel® Flexible Display Interface and Direct Media Interface provide high speed connectivity from the CPU to the Intel® QM87 Chipset.
Integrated Intel® Generation 8 Graphics includes features such as OpenGL 4.0, DirectX 11, Intel® Clear Video HD Technology, Advanced Scheduler 2.0, 1.0, XPDM support, and DirectX Video Acceleration (DXVA) support for full AVC/VC1/MPEG2 hardware decode. Graphics outputs include VGA, LVDS and three DDI ports supporting HDMI/DVI/DisplayPort and eDP as a build option. The Express-BL is specifically designed for customers with high-performance processing graphics requirements who want to outsource the custom core logic of their systems for reduced development time.
The Express-BL has dual stacked SODIMM sockets for up to 16 GB non-ECC type DDR3L memory. In addition to the onboard integrated graphics, a multiplexed PCIe x16 graphics bus is available for discrete graphics expansion. Input/output features include a single onboard Gigabit Ethernet port, USB 3.0 ports and USB 2.0 ports, and SATA 6 Gb/s ports. Support is provided for SMBus and I2C. The module is equipped with SPI AMI EFI BIOS with CMOS backup, supporting embedded features such as remote console, hardware monitor, and watchdog timer.
The ADLINK Express-BL computer-on-module with built-in SEMA Cloud functionality is ready-made for Internet of Things (IoT) applications. The Express-BL is able to connect legacy industrial devices and other IoT systems to the cloud, extract raw data from these devices, determine which data to save locally and which to send to the cloud for further analysis. The results these analyses can provide valuable information for policy decision making and generate innovative business opportunities.
Technical specifications | |
Core System |
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CPU |
5th Generation Intel® Core™ and Xeon® Processors (Mobile) - 14nm (formerly”Broadwell-H”) Xeon® E3-1278L v4 2.0/3.3GHz (Turbo), 0.8/1.0GHz (Turbo), 47W (4C/GT3e) Xeon® E3-1258L v4 1.8/3.2GHz (Turbo), 0.7/1.0GHz (Turbo), 47W (4C/GT2) Core™ i7-5850EQ 2.7/3.4GHz (Turbo), 0.3/1.0GHz (Turbo), 47W (4C/GT3e) Core™ i7-5700EQ 2.6/3.4GHz (Turbo), 0.3/1.0GHz (Turbo), 47W (4C/GT2) Supports: Intel® VT, Intel® TXT, Intel® SSE4.2, Intel® HT Technology, Intel® 64 Architecture, Execute Disable Bit, Intel® Turbo Boost Technology 2.0, Intel® AVX2, Intel® AES-NI, PCLMULQDQ Instruction, Intel® Secure Key and Intel® TSX. Note: Availability of features may vary between processor SKUs. |
Memory | Dual channel non-ECC 1600/1333 MHz DDR3L memory up to 32GB in dual SODIMM socket |
Embedded BIOS | AMI EFI with CMOS backup in 8MB SPI BIOS with Intel® AMT 10 support |
Cache | 6MB for Xeon E3-1278L v4, E3-1258L v4 and Core™ i7-5850EQ, i7-5700EQ |
Expansion Busses |
1 PCIe x16 (Gen3), or 2 PCIe x8, or 1 PCIe x8 and 2 PCIe x4 6 PCIe x1 (AB): Lanes 0/1/2/3/4/5 1 PCIe x1 (CD): Lane 6 LPC bus, SMBus (system) , I2C (user) |
SEMA Board Controller | Supports: Voltage/Current monitoring, Power Sequence debug support, AT/ATX mode control, Logistics and Forensic information, Flat Panel Control, General Purpose I2C, Failsafe BIOS (dual BIOS), Watchdog Timer and Fan Control |
Debug Headers |
40-pin multipurpose flat cable connector for use in combination with DB-40 debug module providing BIOS POST code LED, BMC access, SPI BIOS flashing, power testpoints, debug LEDs 60-pin XDP header for ICE debug of CPU/chipset |
Video |
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GPU Feature Support |
Generation 8 Intel® Graphics architecture, supporting 3 independent and simultaneous display combinations of DisplayPort, HDMI, LVDS, VGA or eDP (optional) Encode/transcode HD content Playback of high definition content including Blu-ray Disc Advanced Scheduler 2.0, 1.0 XPDM support DirectX 11.1, DirectX 11.1+, DirectX 11, DirectX 10.1, DirectX 10, DirectX 9 support OpenGL 4.0, OpenGL 4.2 support Digital Display Interface |
Digital Display Interface | DDI1/2/3 supporting DisplayPort/HDMI/DVI |
VGA |
Analog VGA support with 300 MHz DAC Analog monitor support up to QXGA (2048 x 1536) |
LVDS | Single/dual channel 18/24-bit LVDS from eDP (two lanes) |
eDP | Optional, in place of LVDS and VGA |
Audio |
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Chipset | Intel® HD Audio integrated in chipset |
Audio Codec | Located on carrier Express-BASE6 (ALC886 standard support) |
Ethernet |
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Intel® MAC/PHY | I218LM with Intel® AMT 10.0 support |
Interface | 10/100/1000 GbE connection |
I/O Interfaces |
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USB | 4x USB 1.1/2.0/3.0 (USB 0,1,2,3) and 4x USB 1.1/2.0 (USB 4,5,6,7) |
SATA | Four ports SATA 6Gb/s (SATA0, SATA1, SATA2, SATA3) |
Serial | 2 UART ports COM1/2 with console redirection |
GPIO | 4 GPO and 4 GPI |
Super I/O | Supported on carrier if needed (standard support for W83627DHG-P) |
TPM |
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Chipset | Atmel AT97SC3204 |
Type | TPM 1.2 |
Power |
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Standard Input | ATX = 12V±5% / 5Vsb ±5% or AT = 12V±5% |
Wide Input | ATX = 8.5~20 V / 5Vsb ±5% or AT = 8.5 ~20V |
Management | ACPI 5.0 compliant, Smart Battery support |
Power States | C1-C6, S0, S1, S3, S4, S5 , S5 ECO mode (Wake on USB S3/S4, WOL S3/S4/S5) |
ECO mode | Support deep S5 mode for power saving |
Other |
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Form Factor | PICMG COM.0: Rev 2.1 Type 6 |
Dimension | Basic size: 125 mm x 95 mm |
Operating Systems |
Standard Support: Windows 7 32/64-bit, Windows 8 64-bit, Linux 64-bit Extended Support (BSP): WES7 32/64-bit, Windows Embedded 8.1 Industry 64-bit, Linux 64-bit, VxWorks 64-bit |
Environmental and physical specifications |
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Operating Temperature |
Standard: 0°C to 60°C Extreme Rugged™: -40°C to +85°C (optional) |
Humidity |
5-90% RH operating, non-condensing 5-95% RH storage (and operating with conformal coating) |
Shock and Vibration |
IEC 60068-2-64 and IEC-60068-2-27 MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D |
HALT | Thermal Stress, Vibration Stress, Thermal Shock and Combined Test |
Model | Description |
Express-BL-i7-5850EQ | Basic COM Express® Type 6 module with Intel i7-5850EQ at 2.7/3.2GHz with GT3 level graphics with eDRAM |
Express-BL-i7-5700EQ | Basic COM Express® Type 6 module with Intel i7-5700EQ at 2.6/3.2GHz with GT2 level graphics |
Express-BL-E3-1278 | Basic COM Express Type6 module with Intel Xeon E3-1278Lv4 at 2.0/3.3GHz with GT3 level graphics with eDRAM |
Express-BL-E3-1258 | Basic COM Express Type6 module with Intel Xeon E3-1258L v4 at 1.8/3.2GHz with GT2 level graphics |
Accessory | |
HTS-HL-B | Heatspreader for Express-BL with threaded standoffs for bottom mounting |
HTS-HL-BT | Heatspreader for Express-BL with through hole standoffs for top mounting |
THS-HL-BL | Low profile heatsink for Express-BL with threaded standoffs for bottom mounting |
THS-HL-BT | Low profile heatsink for Express-BL with through hole standoffs for top mounting |
THSH-HL-BL | High profile heatsink for Express-BL with threaded standoffs for top mounting |
THSF-HL-BL | High profile heatsink with Fan for Express-BL with threaded standoffs for bottom mounting |
Starter Kit Plus | COM Express Type 6 Starter Kit Plus |
NOTE Express-BL and Express-HL share the same thermal solution designs |