Express-RLP
COM Express Rev. 3.1 Basic Size Type 6 Module with 13th Gen Intel Core Mobile Processor
Vendor:ADLINK Technology Inc.
- Details
- Specification
- Order information
- 13th Gen Intel Core mobile processors
- Up to 64GB DDR5 SO-DIMM at 4800 MT/s, IBECC
- AI inferencing (AVX-512 VNNI, Intel Iris Xe)
- Operating temperature: -40°C to 85°C (optional)
ADLINK’s Express-RLP COM Express Type 6 Basic size module is based on 13th Gen Intel Core mobile processor (formerly codenamed Raptor Lake-P) and is the first COM Express utilizing Intel’s advanced hybrid architecture (with up to 6 Performance-cores and 8 Efficient-cores) offered with industrial-grade/real-time option to provide superior performance for edge IoT innovations across varied power ranges — at 15W/28W/45W TDP.
The module provides support for PCIe 4.0 and DDR5 memory with up to 4800 MT/s, 4 display or USB4/TBT4, and features integrated Intel Iris Xe graphics with up to 96EUs, allowing for instantaneous on-device AI performance.
Equipped with Intel TCC (Time-Coordinated Computing) and TSN (Time Sensitive Networking) support, the Express-RLP ensures timely execution of deterministic, hard real-time workloads with ultra-low latency, making it well suited for mission-critical AIoT use cases, including industrial automation, AMR (Autonomous Mobile Robot), autonomous driving, medical imaging, video broadcasting, and more.
| Technical specifications | |
| CPU |
13th Gen Intel Core mobile processors (formerly Raptor Lake-P) Core i7-13800HE 6P+8E/20T, 24MB Cache, 45W TDP (35W cTDP), Iris Xe GPU Core i5-13600HE 4P+8E/16T, 18MB Cache, 45W TDP (35W cTDP), Iris Xe GPU Core i3-13300HE 4P+4E/12T, 12MB Cache, 45W TDP (35W cTDP), UHD GPU Core i7-13800HRE 6P+8E/20T, 24MB Cache, 45W TDP (35W cTDP), Iris Xe GPU Core i5-13600HRE 4P+8E/16T, 18MB Cache, 45W TDP (35W cTDP), Iris Xe GPU Core i3-13300HRE 4P+4E/12T, 12MB Cache, 45W TDP (35W cTDP), UHD GPU Note: Raptor Lake-P supports Embedded and Industrial SKUs Some processor SKUs are supported by project basis only. Please see the user's manual for details. Supports: Intel VT (including VT-x, VT-d, VT-x with Extended Page Tables), Intel HT Technology, Intel SSE4.2, Intel 64 Architecture, Intel Turbo Boost Technology 2.0, Intel AVX512-VNNI, Intel TXT, Execute Disable Bit, Intel Data Protection Technology with Intel Secure Key, Intel AES-NI. Note: Availability of features may vary between processor SKUs |
| Memory |
Up to 64GB (2x 32GB) DDR5, IBECC (selected SKUs), SO-DIMM memory, max. 4800MT/s 2 memory channels with 1DPC design |
| Embedded BIOS | AMI UEFI with CMOS backup in 32MB SPI BIOS (dual BIOS by build option) |
| Cache |
Core i7-13800H(R)E / i7-1370P(R)E: 24MB Core i5-13600H(R)E / i5-1250PRE: 18MB Core i7-1365PE / i7-1365URE / i5-1350PE / i5-1340PE / i5-1345U(R)E / i5-1335UE /i3-13300H(R)E / i3-1320P(R)E: 12MB Core i3-1315URE: 10MB |
| Expansion Busses |
PCIe x8 Gen4, lanes 16-23, available for 45W (35W cTDP SKUs) PCIe x4 Gen4, lanes 24-27 PCIe x4 Gen4, lanes 28-31 8 PCIe x1 Gen3: Lanes 0/1/2/3 (configurable to x1, x2, x4) and 4 PCIe x1 Gen3: Lanes 4/5/6/7 LPC bus (via ESPI-to-LPC bridge IC), SMBus (system), I2C (user), GP_SPI(TBC) |
| SEMA Board Controller | Supports : Voltage/current monitoring, power sequence debug support, AT/ATX mode control, logistics and forensic information, flat panel control, general purpose I2C, watchdog timer, fan control and failsafe BIOS (dual BIOS by build option) |
| Debug Headers | 30-pin multipurpose flat cable connector for use with DB-30 x86 debug module providing BIOS POST code LED, EC access, SPI BIOS flashing, power testpoints, debug LEDs |
| Video |
GPU Feature Support Intel Iris Xe or UHD Graphics Core Architecture, max. 96EUs, supporting 4 concurrent display combinations of DisplayPort/HDMI/LVDS/eDP/VGA and Display alternative mode through USB4/Thunderbolt4 outputs 1x 8K30 or 4x 4K60 Hardware video encode/decode, up to 8K60 HEVC DirectX 12, OpenGL 4.6, Vulkan 1.2, Mesa 3D support OneVPL HDCP 2.3 Graphics Hardware Virtualization (SRIOV) Digital Display Interface DDI 1/2/3 supporting DP 1.4a, HDMI 2.1, DVI VGA Supported by build option via DP-to-VGA IC (in place of DDI 3), max. resolution 1920x1200@60Hz LVDS Single/dual channel 18/24-bit LVDS from eDP-to-LVDS IC, max. resolution 1920x1200@60Hz in dual mode eDP Build option in place of LVDS, 4 lanes, eDP 1.4b USB4 Max. 2x USB4 in place of DDI 1/2, supports DP 1.4a by DP alternative mode, Thunderbolt 4 capable (TBC) Requires BIOS code modification by project basis, re-timer with PD on carrier |
| Audio |
Chipset Integrated on SoC Codec On carrier Express-BASE6 R3.1 (ALC888 standard support) |
| Ethernet |
Intel MAC/PHY Intel Ethernet Connection I226 series (I226-IT supports TSN by build option) Interface 2.5GbE and 1000/100/10 Mbit/s Ethernet connection GbE0_SDP if TSN support enabled (TBC) |
| Multi I/O and Storage |
4x USB 3.2/2.0/1.1 (USB 0,1,2,3) 4x USB 2.0/1.1 (USB 4,5,6,7) Max. two USB4 (in place of DDI 1/2) by project basis, Thunderbolt 4 capable (TBC) 2x SATA 6Gb/s (SATA 0,1) 2x UART ports with console redirection 8x GPIO (GPI with interrupt) |
| Super I/O | Supported on carrier if needed (standard support for W83627DHG-P, other Super I/O supported by project basis) |
| TPM |
Chipset Infineon SPI based |
| Power |
Standard Input ATX: 12V±5% / 5Vsb ±5%; or AT: 12V±5% Wide Input ATX: 8.5-20V / 5Vsb ±5%; or AT: 8.5-20V Management ACPI 5.0 compliant, Smart Battery support (TBC) Power States C1-C6, S0, S5 , S5 ECO mode (Wake on USB S3/S4, WOL S3/S4/S5) (TBC) ECO mode support deep S5 mode for power saving |
| Form Factor | PICMG COM.0: Rev 3.1 Type 6 |
| Dimension | Basic size: 125 mm x 95 mm |
| Operating Systems |
Standard Support Windows 10 IoT Enterprise LTSC, Ubuntu 64-bit, Yocto project-based Linux 64-bit (TBC), VxWorks (TBC) |
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Environmental and physical specifications |
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|---|---|
| Operating temperature |
Standard: 0°C to 60°C Extreme Rugged: -45°C to 85°C (TBC, build option, selected SKUs) |
| Storage temperature |
Standard: -20°C to 80°C Extreme Rugged: -40°C to 85°C (TBC, build option, selected SKUs) |
| Humidity |
5-90% RH operating, non-condensing 5-95% RH storage (and operating with conformal coating) |
| Shock and Vibration |
IEC 60068-2-64 and IEC-60068-2-27 MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D |
| HALT | Thermal Stress, Vibration Stress, Thermal Shock and Combined Test |
| Model | Description |
| Express‑RLP‑i7‑13800HE | Basic size COM Express Type 6 module based on Intel Raptor Lake-P i7-13800HE 2.5GHz/14C 45W |
| Express-RLP-i5-13600HE | Basic size COM Express Type 6 module based on Intel Raptor Lake-P i5-13600HE 2.7GHz/12C 45W |
| Express-RLP-i3-13300HE | Basic size COM Express Type 6 module based on Intel Raptor Lake-P i3-13300HE 2.1GHz/8C 45W |
| Express‑RLP‑i7‑13800HRE | Basic size COM Express Type 6 module based on Intel Raptor Lake-P i7-13800HRE 2.5GHz/14C 45W, -40 to 85°C |
| Express‑RLP‑i5‑13600HRE | Basic size COM Express Type 6 module based on Intel Raptor Lake-P i5-13600HRE 2.7GHz/12C 45W, -40 to 85°C |
| Express‑RLP‑i3‑13300HRE | Basic size COM Express Type 6 module based on Intel Raptor Lake-P i3-13300HRE 2.1GHz/8C 45W, -40 to 85°C |
| Express-RLP-i7-1370PE | Basic size COM Express Type 6 module based on Intel Raptor Lake-P i7-1370PE 1.9GHz/14C 28W |
| Express-RLP-i3-1315UE | Basic size COM Express Type 6 module based on Intel Raptor Lake-P i3-1315UE 1.2GHz/6C 15W |
| Express-RLP-U300E | Basic size COM Express Type 6 module based on Intel Raptor Lake-P processor 1.1GHz/5C 15W |
| Accessory | |
| HTS‑ADP‑B | Heatspreader for Express-ADP/RLP with threaded standoffs for bottom mounting |
| HTS‑ADP‑BT | Heatspreader for Express-ADP/RLP with through hole standoffs for top mounting |
| THS‑ADP‑B | Low profile heatsink for Express-ADP/RLP with threaded standoffs for bottom mounting |
| THS‑ADP‑BT | Low profile heatsink for Express-ADP/RLP with through hole standoffs for top mounting |
| THSH‑ADP‑B | High profile heatsink for Express-ADP/RLP with threaded standoffs for bottom mounting |
| THSF‑ADP‑B | High profile heatsink with Fan for Express-ADP/RLP with threaded standoffs for bottom mounting |
| Starter Kit | |
| Starter Kit | COM Express Type 6 Starter Kit Plus Starter kit for COM Express Type 6 |
