Back to results...


SMARC Full Size Module with Intel Atom Processor E3800 Series System-on-Chip
  • Details
  • Specification
  • Order information
  • Single, dual or quad-core Intel Atom Processor E3800 Series System-on-Chip
  • Up to 8 GB DDR3L at 1066/1333 MHz (ECC)
  • HDMI and LVDS
  • Extreme Rugged operating temperature: -40°C to 85°C

The SMARC («Smart Mobility ARChitecture») is a versatile small form factor computer Module definition targeting applications that require low power, low costs, and high performance. The Modules will typically use ARM SOCs similar or the same as those used in many familiar devices such as tablet computers and smart phones. Alternative low power SOCs and CPUs, such as tablet oriented X86 devices and other RISC CPUs may be used as well. The Module power envelope is typically under 6W.

The Modules are used as building blocks for portable and stationary embedded systems. The core CPU and support circuits, including DRAM, boot flash, power sequencing, CPU power supplies, GBE and a single channel LVDS display transmitter are concentrated on the Module. The Modules are used with application specific Carrier Boards that implement other features such as audio CODECs, touch controllers, wireless devices, etc. The modular approach allows scalability, fast time to market and upgradability while still maintaining low costs, low power and small physical size.

SMARC form factor module, the LEC-BT, is certified by Intel for Intel Gateway Solutions for the Internet of Things (IoT) using Windriver and McAfee software integration.

To stress on its low power consumption feature, ADLINK has named SMARC products as LEC (Low Energy Computer on module) series.

The ADLINK LEC-BT computer-on-module with built-in SEMA Cloud functionality is ready-made for Internet of Things (IoT) applications. The LEC-BT is able to connect legacy industrial devices and other IoT systems to the cloud, extract raw data from these devices, determine which data to save locally and which to send to the cloud for further analysis. The results these analyses can provide valuable information for policy decision making and generate innovative business opportunities.

Technical specifications
CPU Intel Atom E3800 Series, single, dual or quad-core SoC with integrated graphics
Atom E3845 (4C/1333), 1.91 GHz, Gfx 542/792 MHz (Turbo), 10 W TDP
Atom E3826 (2C/1066), 1.46 GHz, Gfx 533/667 MHz (Turbo), 7 W TDP
Atom E3815 (1C/1066), 1.46 GHz, Gfx 400/-MHz (No Turbo), 5 W TDP
Atom E3805 (2C/1066), 1.33 GHz (No GFX) 3W TDP
Memory Up to 8 GB DDR3L at 1066/1333 MHz, memory down with ECC
Embedded BIOS AMI UEFI with CMOS backup in 8 MB SPI BIOS, Fast Boot support
Cache 512 kB to 2 MB L2 cache
SEMA Board Controller Supports: Voltage/Current monitoring, Power Sequencing, Logistics and Forensic Information, Flat Panel Control, I²C Bus Control, GPIO Control, User Flash, Failsafe BIOS (dual BIOS), Watchdog Timer and Fan Control
Video 7th generation Intel graphics core architecture with four execution units, supports two independent displays 2D and 3D graphics hardware acceleration
Support for DirectX 11.1, OGLES 2.0, OGL 3.2
Video decode HW acceleration for H.264, MPEG2, VC1, VP8 formats
Video encode HW acceleration for H.264, MPEG2 formats
LVDS Single channel 18/24-bit LVDS from DDI0
HDMI/DP++ HDMI 1.4a from DDI1
Audio Intel HD Audio integrated in SoC
1x I²S and 1x HDA for audio codec on carrier
Ethernet 1x Intel i210-IT Ethernet controller, 10/100/1000 GbE
I/O Interfaces PCIe: 3x PCIe x1 Gen2 USB: 1x USB 3.0 + 3x USB 2.0 SATA: 1x SATA 3 Gb/s SDIO: 1x SDIO (4-bit) Camera: CSI 4L/1L Serial: 2x SPI, 2x I2C, 1x I2S, Power Management, 2x UART eMMC: Soldered, bootable eMMC flash storage from 4 to 64 GB (optional) GPIO: 12x GPIO, 5x used for camera, 7x available
Intelligent Middleware SEMA Local management, control of embedded computer systems Extended EAPI for monitoring, controlling and analytics applications Multiple OS support and across platforms (x86, ARM)
Power Standard Input: 3.0 V~5.25 V DC ±5%
Power States: C0-C6, S0, S3, S4, S5
Form Factor SMARC Specifications v1.1
Dimension SMARC full size module, 82 mm x 80 mm
Operation System Standard Support: Linux, VxWorks, Windows 7/8, Windows Embedded, Compact 7
Extended Support (BSP): QNX, Android

Environmental and physical specifications

Operating Temperature Standard: 0°C to +60°C
Extreme Rugged: -40ºC to +85ºC
Humidity 5-90% RH operating, non-condensing
5-95% RH storage (and operating with conformal coating)
HALT Thermal Stress, Vibration Stress, Thermal Shock and Combined Test
Model Description
LEC-BT4-4G-8G-ER SMARC Full Size Module with Intel Atom E3845, quad core, 4 GB DDR3L, 8 GB eMMC, -40°C to 85°C
LEC-BT4-8G-8G-ER SMARC Full Size Module with Intel Atom E3845, quad core, 8 GB DDR3L, 8 GB eMMC, -40°C to +85°C
LEC-BT2-2G-8G-ER SMARC Full Size Module with Intel Atom E3826, dual core, 2 GB DDR3L, 8 GB eMMC, -40°C to 85°C
LEC‑BT20‑2G‑8G‑ER SMARC Full Size Module with Intel Atom E3805, dual core, headless, 2 GB DDR3L, 8 GB eMMC, -40°C to +85°C
LEC-BT1-2G-8G-ER SMARC Full Size Module with Intel Atom E3815, single core, 2 GB DDR3L, 8 GB eMMC, -40°C to 85°C
LEC-BT-HS Heatspreader for LEC-BT
Login / Registration
укажите почту
введите пароль
Forgot password?
By clicking «#SUBMIT_NAME»,
you agree to our Privacy Policy
Loading data...
Subscribe to our newsletter
specify your contacts

By clicking «#SUBMIT_NAME»,
you agree to our Privacy Policy

You have successfully subscribed
Now you can receive newsletters