SMARC® Short Size Module with Intel® Atom™ Processor E3800 Series System-on-Chip
  • Details
  • Specification
  • Order information
  • Single, dual or quad-core Intel® Atom™ Processor E3800 Series System-on-Chip
  • Up to 4 GB DDR3L at 1066/1333 MHz (non-ECC)
  • 1x SATA 3Gb/s, 1x USB 3.0, 3x USB 2.0, max. 12x GPIO
  • Extreme Rugged™ operating temperature: -40°C to +85°C

The SMARC ("Smart Mobility ARChitecture") is a versatile small form factor computer Module definition targeting applications that require low power, low costs, and high performance. The Modules will typically use ARM SOCs similar or the same as those used in many familiar devices such as tablet computers and smart phones. Alternative low power SOCs and CPUs, such as tablet oriented X86 devices and other RISC CPUs may be used as well. The Module power envelope is typically under 6W.

The Modules are used as building blocks for portable and stationary embedded systems. The core CPU and support circuits, including DRAM, boot flash, power sequencing, CPU power supplies, GBE and a single channel LVDS display transmitter are concentrated on the Module. The Modules are used with application specific Carrier Boards that implement other features such as audio CODECs, touch controllers, wireless devices, etc. The modular approach allows scalability, fast time to market and upgradability while still maintaining low costs, low power and small physical size.

The ADLINK LEC-BTS computer-on-module with built-in SEMA Cloud functionality is ready-made for Internet of Things (IoT) applications. The LEC-BTS is able to connect legacy industrial devices and other IoT systems to the cloud, extract raw data from these devices, determine which data to save locally and which to send to the cloud for further analysis. The results these analyses can provide valuable information for policy decision making and generate innovative business opportunities.

To stress on its low power consumption feature, ADLINK has named SMARC products as LEC (Low Energy Computer on module) series.

Technical specifications

Core System

CPU Intel® Atom™ E3800 Series, single, dual or quad-core SoC with integrated graphics
Atom™ E3845 (4C/1333), 1.91 GHz, Gfx 542/792 MHz (Turbo), 10 W TDP
Atom™ E3826 (2C/1066), 1.46 GHz, Gfx 533/667 MHz (Turbo), 7 W TDP
Atom™ E3815 (1C/1066), 1.46 GHz, Gfx 400/- MHz 5 W TDP
Memory Up to 4 GB DDR3L at 1066/1333 MHz, memory down non-ECC
Embedded BIOS AMI UEFI with CMOS backup in 8 MB SPI BIOS, Fast Boot support
Cache 512 kB to 2 MB L2 cache
SEMA Board Controller Supports: Voltage/Current monitoring, Power Sequence debug support, AT/ATX mode control, Logistics and Forensic information, Flat Panel Control, General Purpose I2C, Failsafe BIOS (dual BIOS), Watchdog Timer and Fan Control


GPU Feature Support 7th generation Intel® graphics core architecture with four execution units, supports two independent displays
2D and 3D graphics hardware acceleration
Support for DirectX 11.1, OGLES 2.0, OGL 3.2
Video decode HW acceleration for H.264, MPEG2, VC1, VP8 formats
Video encode HW acceleration for H.264, MPEG2 formats
LVDS Single channel 24-bit LVDS from DDI0
HDMI HDMI 1.4a from DDI1


Chipset Intel® HD Audio integrated in SoC
Audio Codec I2S and HDA for audio codec on carrier


Intel® MAC/PHY 1x Intel® i210IT Ethernet controller
Interface 10/100/1000 GbE

I/O Interfaces

PCIe 3x PCIe x1 Gen2
USB 1x USB 3.0 + 3x USB 2.0
SATA 1x SATA 3 Gb/s
MMC 1x MMC interface to carrier
SDIO 1x SDIO (4-bit)
GPIO 12x GPIO, 5x used for camera, 7x available
Camera CSI 4L/1L
Serial 2x SPI, 4x I2C, 1x I2S, Power Management, 2x UART


Standard Input 3.0 V ~ 5.25 V DC ±5%
Power States Supports C0-C6, S0, S3, S4, S5


Form Factor SMARC Specification v1.0
Dimension SMARC short size module, 82 mm x 50 mm
Operating Systems Standard Support: Linux, VxWorks, Windows 7/8, Windows Embedded Compact 7
Extended Support (BSP): QNX, Android

Environmental and physical specifications

Operating Temperature Standard: 0°C to +60°C
Extreme Rugged™: -40°C to +85°C
Humidity 5-90% RH operating, non-condensing
5-95% RH storage (and operating with conformal coating)
Shock and Vibration IEC 60068-2-64 and IEC-60068-2-27
MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D
HALT Thermal Stress, Vibration Stress, Thermal Shock and Combined Test
Model Description
LEC-BTS4-2G-ER SMARC Short Size Module with Intel® Atom™ E3845, quad core, 2 GB DDR3L, Extreme Rugged operating temperature: -40°C to +85°C
LEC-BTS2-2G-ER SMARC Short Size Module with Intel® Atom™ E3826, dual core, 2 GB DDR3L, Extreme Rugged operating temperature: -40°C to +85°C
LEC-BTS1-2G-ER SMARC Short Size Module with Intel® Atom™ E3815, single core, 2 GB DDR3L, -40°C to +85°C
LEC-BTS4-4G-ER SMARC Short Size Module with Intel® Atom™ E3845, quad core, 4 GB DDR3L, -40°C to +85°C
LEC-BTS20-2G-ER SMARC Short Size Module with Intel® Atom™ E3805, dual core, headless, 2 GB DDR3L, Extreme Rugged operating temperature: -40°C to +85°C
LEC-BTS21-2G-CT SMARC Short Size Module with Intel® Celeron™ N2807, dual core, 2 GB DDR3L, 0°C to 60°C
LEC-BTS-HS Heatspreader for LEC-BTS

Login / Registration
укажите почту
введите пароль
Forgot password?
By clicking «#SUBMIT_NAME»,
you agree to our Privacy Policy
Loading data...
Subscribe to our newsletter
specify your contacts

By clicking «#SUBMIT_NAME»,
you agree to our Privacy Policy

You have successfully subscribed
Now you can receive newsletters