The nanoX-AL is a COM Express® COM.0 R3.0 Type 10 module supporting Intel® Atom™ processor E3900 series system-on-chip (SoC). The nanoX-AL is specifically designed for customers who need optmized processing and graphics performance with low power consumption in a long product life solution.
The nanoX-AL features the dual/quad core Intel® Atom™ processor E3900 series supporting non-ECC type DDR3L single-channel or dualchannel memory at 1600/1867 MHz to provide excellent overall performance. Integrated Intel® Gen9 LP Graphics includes features such as OpenGL 4.3, DirectX 12, OpenCL 2.0 and support for H.265/HEVC, H.264, MPEG2, VC1, VP9, MVC, JPEG/MJPEG hardware decode.
Graphics outputs include DDI ports supporting HDMI/DVI/DisplayPort and single-channel 18/24-bit LVDS (eDP by build option). The nanoX-AL is specifically designed for customers with balanced performance and power consumption requirements who want to outsource the custom core logic of their systems for reduced development time.
The nanoX-AL has soldered type non-ECC DDR3L memory up to 8GB. In addition, onboard eMMC memory (8GB/16GB/32GB) and SD signals are available as build options. The nanoX-AL features a single onboard Gigabit Ethernet port, USB 3.0 ports and USB 2.0 ports, and SATA 6 Gb/s ports. Support is provided for SMBus and I2C. The module is equipped with SPI AMI EFI BIOS, supporting embedded features such as remote console, CMOS backup, hardware monitor, and watchdog timer.
Technical specifications | |
Core System |
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CPU |
Intel® Atom™ E3900 series SoC - 14nm process Atom™ E3950 1.6/2.0GHz (Turbo), 12W (4C/1866) Atom™ E3940 1.6/1.8GHz (Turbo), 9W (4C/1866) Atom™ E3930 1.3/1.8GHz (Turbo), 6W (2C/1866) Supports: Intel® TXT, Intel® SSE4.2, Intel® 64 Architecture, IA 32-bit, Intel® AES-NI, dual or quad Out-of-Order Execution (OOE) processor cores, PCLMULQDQ Instruction DRNG Note: Availability of features may vary between processor SKUs. |
Memory | Up to 8 GB Dual channel DDR3L at 1867/1600 MHz non-ECC |
Embedded BIOS | AMI EFI with CMOS backup in 16MB SPI BIOS |
Cache | 2MB for all SKUs |
Expansion Busses |
4 PCI Express x1 Gen2: Lanes 0/1/2/3 (configurable to x2, x4) LPC bus, SMBus (system) , I2C (user) |
SEMA Board Controller | Supports : Voltage/current monitoring, power sequence debug support, AT/ATX mode control, logistics and forensic information, flat panel control, general purpose I2C, failsafe BIOS (dual BIOS), watchdog timer and fan control |
Debug Headers |
40-pin multipurpose flat cable connector for use with DB-40 debug module providing BIOS POST code LED, BMC access, SPI BIOS flashing, power testpoints, debug LEDs 60-pin XDP header for ICE debug of CPU/chipset on break out board |
GPU Feature Support |
Intel® Generation 9 LP Graphics Core Architecture, supporting 2 independent and simultaneous display combinations of DisplayPort, HDMI, LVDS or eDP outputs Hardware encode/transcode (including HEVC) DirectX 12, DirectX 11.3, DirectX 10, DirectX 9.3 support OpenGL 4.3 and ES 3.0 support OpenCL 2.0 support |
Digital Display Interface | DDI0 supportts DisplayPort/HDMI/DVI |
LVDS | Single channel 18/24-bit LVDS from eDP-to-LVDS IC |
eDP | 4 lane support (build option, in place of LVDS) |
Audio |
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Chipset | Intel® HD Audio integrated in SoC |
Audio Codec | On carrier miniBASE-10R |
Ethernet |
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Ethernet |
Intel® MAC/PHY: Intel® Ethernet i210 Interface: 10/100/1000 GbE connection Note: Intel® Ethernet i211 is supported by project basis |
I/O Interfaces |
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USB | 2x USB 1.1/2.0/3.0 (USB 0,1) and 6x USB 1.1/2.0 (USB 2,3,4,5,6,7) |
SATA | Two ports SATA 6Gb/s (SATA0,1) |
Serial | 2 UART ports (console redirection is TBD) |
eMMC | eMMC 5.0 (8/16/32GB, build option) |
SD | SD signal is a build option supported by project basis |
GPIO | 4 GPO and 4 GPI |
Super I/O | Supported on carrier if needed (standard support for W83627DHG-P) |
TPM (build option) |
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Chipset | Infineon |
Type | TPM 2.0 |
Power |
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Standard Input | ATX: 12V±5%, 5Vsb ±5%; AT: 12V±5% |
Wide Input |
ATX: 4.75-20 V, 5Vsb ±5% AT: 4.75-20V (Standard Temp. only) |
Management | ACPI 5.0 compliant, Smart Battery support |
Power States: | C1-C6, S0, S3, S4, S5 and S5 ECO mode (Wake on USB S3/S4, WOL S3/S4/S5) |
ECO mode | Supports deep S5 mode for power saving |
Operating Systems |
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Standard Support | Windows 10 64-bit, Linux 64-bit, VxWorks 64-bit (TBD) |
Extended Support (BSP) | Linux 64-bit, VxWorks 64-bit (TBD) |
Mechanical |
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Form Factor | PICMG COM.0 Rev 2.1, Type 10 |
Dimension | Compact size: 84 mm x 55 mm |
Environmental and physical specifications |
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Operating Temperature |
Standard: 0°C to +60°C Extreme Rugged: -45°C to +85°C (build option with selected SoC SKUs) |
Humidity |
5-90% RH operating, non-condensing 5-95% RH storage (and operating with conformal coating) |
Shock and Vibration |
IEC 60068-2-64 and IEC-60068-2-27 MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D |
HALT | Thermal Stress, Vibration Stress, Thermal Shock and Combined Test |
Note: “build option” indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product. Be aware that these “build option” part numbers will need to be newly created and this will result in production lead times. |
Model | Description |
nanoX-AL-E3950-8G | Mini COM Express Type10 module with Intel Apollo Lake-I Atom E3950, 8GB DDR3L |
nanoX-AL-E3950-4G | Mini COM Express Type10 module with Intel Apollo Lake-I Atom E3950, 4GB DDR3L |
nanoX-AL-E3950-2G | Mini COM Express Type10 with Intel Apollo Lake-I Atom E3950 (4C), 2G memory |
nanoX-AL-E3940-2G | Mini COM Express Type10 with Intel Apollo Lake-I Atom E3940 (4C), 2G memory |
nanoX-AL-E3930-2G | Mini COM Express Type10 with Intel Apollo Lake-I Atom E3930 (2C), 2G memory |
nanoX‑AL‑E3930‑2G/8GB | Mini COM Express Type10 module with Intel Apollo Lake-I Atom E3930, 2GB DDR3L, 8GB eMMC |
nanoX-AL-N4200-2G | Mini COM Express Type10 with Intel Apollo Lake Pentium N4200 (4C), 2G memory |
nanoX-AL-N3350-2G | Mini COM Express Type10 with Intel Apollo Lake Celeron N3350 (2C), 2G memory |
nanoX-AL-E3950-2G-WT | Mini COM Express Type10 module with Intel Apollo Lake-I Atom E3950, with I-temp 2GB DDR3L for specific demand |
nanoX-AL-E3950-4G-WT | Mini COM Express Type10 module with Intel Apollo Lake-I Atom E3950, with I-temp 4GB DDR3L for specific demand |
nanoX‑AL‑E3950‑4G/TPM2.0‑WT | Mini COM Express Type10 module with Intel Apollo Lake-I Atom E3950, 4GB DDR3L wide temperature range, TPM2.0 support for specific demand |
nanoX-AL-E3950-8G-WT | Mini COM Express Type10 module with Intel Apollo Lake-I Atom E3950, with I-temp 8GB DDR3L for specific demand |
nanoX-AL-E3940-2G-WT | Mini COM Express Type10 module with Intel Apollo Lake-I Atom E3940, with I-temp 2GB DDR3L for specific demand |
nanoX-AL-E3940-4G-WT | Mini COM Express Type10 module with Intel Apollo Lake-I Atom E3940, with I-temp 4GB DDR3L for specific demand |
nanoX-AL-E3940-8G-WT | Mini COM Express Type10 module with Intel Apollo Lake-I Atom E3940, with I-temp 8GB DDR3L for specific demand |
nanoX-AL-E3930-2G-WT | Mini COM Express Type10 module with Intel Apollo Lake-I Atom E3930, with I-temp 2GB DDR3L for specific demand |
nanoX-AL-E3930-4G-WT | Mini COM Express Type10 module with Intel Apollo Lake-I Atom E3930, with I-temp 4GB DDR3L for specific demand |
nanoX-AL-E3930-8G-WT | Mini COM Express Type10 module with Intel Apollo Lake-I Atom E3930, with I-temp 8GB DDR3L for specific demand |
Accessories | |
HTS-nXAL-B-I | Heatspreader for nanoX-AL Atom with threaded standoffs for bottom mounting |
HTS-nXAL-B | Heatspreader for nanoX-AL Pentium/Celeron with threaded standoffs for bottom mounting |
HTS-nXAL-BT | Heatspreader for nanoX-AL Pentium/Celeron with through hole standoffs for top mounting |
THS-nXAL-B-I | Low profile heatsink for nanoX-AL Atom with threaded standoffs for bottom mounting |
THS-nXAL-BT-I | Low profile heatsink for nanoX-AL Atom with through hole standoffs for top mounting |
THS-nXAL-B | Low profile heatsink for nanoX-AL Pentium/Celeron with threaded standoffs for bottom mounting |
THS-nXAL-BT | Low profile heatsink for nanoX-AL Pentium/Celeron with through hole standoffs for top mounting |
THSH-cAL-B-I | High profile heatsink for nanoX-AL Atom with threaded standoffs for bottom mounting |
THSH-cAL-B | High profile heatsink for nanoX-AL Pentium/Celeron with threaded standoffs for bottom mounting |
HTS-nXAL-BT-I | Heatspreader for nanoX-AL Atom with through hole standoffs for top mounting |
Starter Kit | |
COM Express Type 10 Starter Kit Plus | Starter kit for COM Express Type 10 |