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Qseven Standard Size Module with Intel Atom E3900, Pentium N4200 and Celeron N3350 Processor
  • Details
  • Specification
  • Order information
  • Dual or quad-core Intel Atom E3900, Pentium N4200 or Celeron N3350 Processor
  • Up to 8GB Fast LPDDR4 at 2400 MHz
  • Qseven 2.1 compliant
  • Extreme Rugged operating temperature: -40°C to +85°C

The Q7-AL Computer-On-Module (COM) combines the QSeven 2.1 standard with the Intel («Apollo Lake») Atom E-series and Pentium and Celeron N-series System-on-Chips (SoCs), providing ideal solutions for low power consumption and high pin/area density requirements. The module provides the high integration, high performance, low power, and ruggedness favored by Internet-of-Things (IoT) applications such as retail transactional clients, digital signage, and in-vehicle infotainment systems.

The QSeven form factor affords a more compact profile and footprint than the other COM platforms. With mechanical dimensions of 70mm width, 70mm length, and 2.3mm of overall height, Qseven ranks as one of the smallest COM standards currently available.

The Q7-AL utilizes the upgrades in Intel’s latest («Apollo Lake») N-series and E-series SoCs such as the Intel 64 Architecture («Goldmont»), the new HD graphics 500/505 engine (Gen-9), and a faster, 4-vector image processing unit. The SoCs are manufactured on Intel’s industry-leading, tri-gate 14nm process, improving system performance by supporting up to 8GB of system memory.

Compared to the previous generation («Braswell»), the Apollo Lake SoC comes with a larger package size (24×31mm2) and pin count (1296 pins) and has updated the OS support by adding Windows 10 IOT and removing support for Windows7/8.1 and WEC7/2013. Because Apollo Lake has more I/O interfaces than Braswell, no pin compatibility exists between these two generations of SoCs.

Technical specifications
CPU Intel Atom E3950, 4 cores, 2.0 GHz, 12 W TDP
Intel Atom E3940, 4 cores, 1.8 GHz, 9.5 W TDP
Intel Atom E3930, 2 cores, 1.8 GHz, 6.5 W TDP
Intel Pentium N4200, 4 cores, 2.5 GHz, 6W TDP
Intel Celeron N3350, 2 cores, 2.4 GHz, 6W TDP
Memory Up to 8 GB LPDDR4 at 2400 MT/s
Single/dual memory channel, 1-2 64bit, non-EC
Embedded BIOS AMI UEFI with CMOS backup in 8 MB SPI BIOS, Fast Boot support
Cache 2 MB L2 cache
SEMA Board Controller Supports: Voltage/Current monitoring, Logistics and Forensic information, Flat Panel Control, I2C Bus Control, User Flash, Failsafe BIOS (dual BIOS), Watchdog Timer and Fan Control
Video 9th generation Intel graphics core architecture with up to 18 execution units, 2D and 3D graphics hardware acceleration
Support for DirectX 12, OpenGL 4.2, OpenCL 1.2
Video decode HW acceleration for H.265/HEVC, H.264, MPEG2, MVC, VC-1, WMV9, JPEG/MJPEG, VP8, VP9
Video encode HW acceleration for H.265/HEVC, H.264, MPEG2, MVC, JPEG/MJPEG, VP8, VP9 (resolution depends on operating system)
HDMI/DP++ HDMI up to 3840 x 2160 @ 30Hz / DP 4096 x 2160 @ 60 Hz
LVDS Dual channel LVDS (18/24-bit) or 1x eDP and 1x DP (BOM option)
Audio Intel HD Audio integrated in SOC
1x HDA/I2S for audio codec on carrier
Ethernet 1x Intel i210IT/i211 Ethernet controller
Interface 1x GbE, IEEE 1588 trigger signals
I/O Interfaces PCIe: 4x PCIe x1 Gen2
USB 2.0: 1x USB 2.0 client, 5x USB 2.0 host
USB 3.0: 2x USB 3.0 host
SATA: 2x SATA 3.0 (6 Gbit/s) to carrier or 1x SATA 3.0 to carrier and 1x onboard SATA-SSD
eMMC: Onboard eMMC 5.0 (4-64 GByte)
SDIO: 1x SDIO 3.0 (4bit) to MXM2
Camera: 2x MIPI CSI camera (2L/4L)
Serial: 1x SPI for dual BIOS flash, 1x SPI to MXM2, 1x I²C, 1x UART, 1x SMBus, 1x LPC, 1x DB40
GPIO: 8x GPIO (interrupt capable) (shared pins with LPC, BOM option)
Power Standard Input: 5.0 V DC ±5%
Power States: Supports C0-C6, S0, S3, S4, S5
Form Factor Qseven Specifications v2.1
Dimension Qseven, standard module size, 70 mm x 70 mm
Operating Systems Standard Support: Windows 10 IOT Enterprise, Windows 10 IOT Core, Yocto Linux
On Request: VxWorks, Android

Environmental and physical specifications

Operating Temperature Standard: 0°C to +60°C
Extreme Rugged: -40°C to +85°C
Humidity 5-90% RH operating, non-condensing
5-95% RH storage (and operating with conformal coating)
Shock and Vibration IEC 60068-2-64 and IEC-60068-2-27
MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D
HALT Thermal Stress, Vibration Stress, Thermal Shock and Combined Test
Model Description
Q7‑AL‑E3930‑2G‑8G‑ER Qseven Module with Intel Atom E3930, dual core, 2 GB LPDDR4, 8GB eMMC, -40°C to 85°C
Q7‑AL‑E3940‑2G‑16G‑ER Qseven Module with Intel Atom E3940, quad core, 2 GB LPDDR4, 16 GB eMMC, -40°C to 85°C
Q7‑AL‑E3950‑8G‑32G‑ER Qseven Module with Intel Atom E3950, quad core, 8 GB LPDDR4, 32 GB eMMC, -40°C to 85°C
Q7‑AL‑N3350‑4G‑8G‑CT Qseven Module with Intel Celeron N3350, dual core, 4 GB LPDDR4, 8 GB eMMC, 0°C to 60°C
Q7‑AL‑N4200‑8G‑32G‑CT Qseven Module with Intel Pentium N4200, quad core, 8 GB LPDDR4, 32 GB eMMC, 0°C to 60°C
Q7‑AL‑E3940‑2G‑8GS‑ER Qseven Module with Intel Atom E3940, quad core, 2 GB LPDDR4, 8GB SATA-SSD, -40°C to 85°C
Q7-AL-HS1 Heat Spreader for Q7-AL-E3930/E3940/E3950
Q7-AL-HS2 Heat Spreader for Q7-AL-N3350/N4200
LEC‑AL/Q7‑AL‑HS3 Active Heat Sink for LEC-AL/Q7-AL
Q7-AL-HS4 Heatsink for Q7-AL-E3930/E3940/E3950 (max 12W SOC)
Q7-AL-HS5 Heatsink for Q7-AL-N3350/N4200 (max 6W SOC)
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