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Qseven Module with 4th Generation Intel Atom Processor E3800 Series SoC
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  • Specification
  • Order information
  • Single, dual or quad core 4th Generation Intel Atom Processor E3800 Series System-on-Chip
  • Up to 4 GB DDR3L at 1066/1333 MHz
  • HDMI 1.4b and dual channel LVDS
  • Extreme Rugged operating temperature: -40°C to +85°C

The Q7-BT Computer-On-Module (COM) combines the Qseven 2.0 standard with the Intel Atom E3800 series System-on-Chip (SoC), providing an ideal solution for mid-range power and high, pin/area density requirements. The module provides the high integration, high performance, low power, and ruggedness favored by Internet-of-Things (IoT) applications such as retail transactional clients, digital signage, and in-vehicle infotainment systems.

The Qseven form factor affords a more compact profile and footprint than the other COM platforms.

With mechanical dimensions as small as 70mm width, 70mm length, and 2.3mm of overall height, Qseven ranks as the smallest COM standard currently available.

The Q7-BT module utilizes the E3800 SoC for contemporary, high-bandwidth interfaces such as PCI Express, USB, Gigabit Ethernet, SATA, and HD Audio. The module generates its own LVDS, TMDS, and DisplayPort video signals using DDI output from the SoC. A series of optional eMMC devices offers up to 64GB of on-board NAND Flash storage with an MMC interface, and an optional SATA, Solid State Drive (SSD) provides up to 64GB of on-board NAND Flash storage. Two SPI Flash chips implement a fail-safe BIOS, allowing the user to boot the module even if current BIOS settings have corrupted the system.

Under the management of the BMC chip (Board Management Controller), the SEMA utility (Smart Embedded Management Agent) provides system control, security, and failure protection—counting, monitoring, and measuring hardware and software events, and using the SMBus to send corrective commands to the SoC. The optional SEMA Cloud utility not only controls local events on the module but system client events on the IoT.

Technical specifications
CPU Intel Atom Processor E3800 Series, single, dual or quad-core SoC with integrated graphics
Atom E3845 (4C/1333), 1.91 GHz, Gfx 542/792 MHz (Turbo), 10 W TDP
Atom E3826 (2C/1066), 1.46 GHz, Gfx 533/667 MHz (Turbo), 7 W TDP
Atom E3815 (1C/1066), 1.46 GHz, Gfx 400 MHz (no Turbo), 5 W TDP
Memory Up to 8 GB DDR3L at 1066/1333 MHz, memory down
Embedded BIOS AMI UEFI with CMOS backup in 8 MB SPI BIOS, Fast Boot support
Cache 512 kB to 2 MB L2 cache
SEMA Board Controller Supports: Voltage/Current monitoring, Logistics and Forensic information, Flat Panel Control, I2C Bus Control, User Flash, Failsafe BIOS (dual BIOS), Watchdog Timer and Fan Control
Video 7th generation Intel graphics core architecture with four execution units supporting two independent displays 2D and 3D graphics hardware acceleration
Support for DirectX 11.1, OGLES 2.0, OGL 3.2
Video decode HW acceleration for H.264, MPEG2, VC1, VP8 formats
Video encode HW acceleration for H.264, MPEG2 formats
Displayport DP/TMDS from DDI1 (up to 2,560 x 1,600 pixels)
LVDS Dual channel 24-bit LVDS from DDI0
Audio Intel HD Audio integrated in SOC
Ports I2S and HDA for audio codec on carrier
Ethernet 1x Intel i210IT Ethernet controller
Interface 10/100/1000 GbE
I/O Interfaces PCIe: 3x PCIe x1 Gen2
USB: 1x USB 3.0 + 6x USB 2.0
SATA: 2x SATA 3 Gb/s
eMMC: Soldered, bootable eMMC flash storage from 4 GB to 64 GB (optional)
SDIO: 1x SDIO (4-bit)
Camera: CSI 4L/1L on separate connector
Serial: 2x SPI, 3x I2C, 1x I2S, Power Management, 1x UART
Power Standard Input: 3.0 V ~ 5.25 V DC ±5%
Power States: Supports C0-C6, S0, S3, S4, S5
Form Factor Qseven Specification v2.0
Dimension Standard size, 70 mm x 70 mm
Operating Systems Standard Support: Linux, VxWorks, Windows 7/8, Windows Embedded Compact 7
Extended Support (BSP): QNX, Android

Environmental and physical specifications

Operating Temperature Standard: 0°C to +60°C
Extreme Rugged: -40°C to +85°C
Humidity 5-90% RH operating, non-condensing
5-95% RH storage (and operating with conformal coating)
Shock and Vibration IEC 60068-2-64 and IEC-60068-2-27
MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D
HALT Thermal Stress, Vibration Stress, Thermal Shock and Combined Test
Model Description
Q7-BT1-2G-8G-ER Qseven module with Intel Atom E3815, single core, 2 GB DDR3L, 8GB eMMC, -40°C to +85°C
Q7‑BT4‑4G‑8GS‑ER Qseven module with Intel Atom E3845, quad core, 4 GB DDR3L, 8GB SATA SSD, -40°C to +85°C
Q7-BT2-4G-8G-ER Qseven module with Intel Atom E3826, dual core, 4 GB DDR3L, 8GB eMMC, -40°C to +85°C
Q7-BT4-4G-8G-ER Qseven module with Intel Atom E3845, quad core, 4 GB DDR3L, 8GB eMMC, -40°C to +85°C
Q7-BT-HS Heatspreader for Q7-BT
Q7-BT-HS2 Passive heatsink for Q7-BT, dual core, 0°C to 70°C
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