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ADL120S

Stackable SBC - 6th Gen Intel Core
  • Details
  • Specification
  • Order information
  • 6th Generation Intel Core Processors
  • Up to 32GB DDR4
  • Compact 120mm x 120mm footprint
  • Extended operating temperature: -40°C to +85°C

The ADL120S is the latest in ADL’s line of high-performance, compact 120mm x 120mm SBC based on 6th Generation Intel® Core™ i3 / i7 Skylake processors. Featuring Intel Q170 chipset, it is a full-featured SBC with robust I/O including USB 3.0, LAN, M.2 PCIe/SATA and wide operating temperature range (-40°C to 85°C) and high-resolution DisplayPort outputs. Eight PCIe X1 expansion lanes allow for customization for any application-specific environment.

This makes it ideal for a variety of system-critical industrial applications where these high-performance features are an absolute necessity, but no less critical are less tangible features like high MTBF, long-life availability, hardware and firmware revision control, obsolescence management, technical, engineering and design support.

Applications:

Secure Networking, Secure Routing, Traffic Monitoring and Gateways, Cyber Security Edge Devices for ICS and SCADA threat security, Unmanned and Drone Payload Computing, Industrial IoT Gateways and Controllers, Traffic Engineering, Security and Surveillance USB 3,0 and IP Camera CPU Interface, Transportation, Wind Turbine Datalogging and Collision Avoidance, Oil and Gas IPC, Unmanned Autonomous Systems.

Technical specifications
Processors 6th Generation Intel Core Processors
Dual and Quad Core variants
Socket LGA1151
Chipset Intel Q170
Memory 2x SODIMM260 1.2V DDR4 Max. 32 GB
Graphics Intel HD Graphics Gen 9
Windows API Support Direct3D 12/11.3/11.2/11.1/10/9; /Direct2D; OpenGL 4.4; OpenCL 2.1/2.0/1.2; DirectX 12
Video Codec Gen 9 Hardware Accelerated Decode/Encode
DisplayPort DP 1.2
Resolution = 4096x2304 @ 60Hz
2 Output Ports plus 1x Expansion
BIOS AMI Aptio (UEFI)
128 Mbit SPI-Flash; fTPM 2.0 (firmware TPM)
Power Management APM/ACPI ACPI
BIOS-API Functions: CPU and Board Temperature; Boot History; Watchdog, Board Voltages; GPIO, Fan Speed Monitoring
Requires Linux or Windows drivers. Linux Kernel 3.0+ required.
LAN1 10/100/1000 Intel i219 Phy
WOL and PXE Boot
LAN2-4 10/100/1000 Intel i210
USB 3.0 4x
Backward Compatible to USB 2.0
M.2 (Key B) 2280 2x M.2 (Key B) 2280 PCIe/SATA with USB 3.0
Stackable Expansion Interfaces 8x PCIe Lanes Multiplexed with up to 4x SATA and/or up to 4x USB 3.0; 1x DisplayPort; PSON, PGOOD, PWRBTN; Custom Power
Custom expansion board services available.
Input Power 20-30VDC
Input Protection Galvanically Isolated, Over/Under Voltage Protection; Reverse Voltage Protection
RTC Battery CR2032 Circular Compatible
Dimensions 120mm x 120mm

Environmental and physical specifications

Operating Temperature Standard: -20°C to +70°C
Optional: -40°C to +85°C
Model Description
ADL120S-6700TE 6th Generation Intel® Core™ i7 2.4GHz 4C/8T, 8MB
ADL120S-6100TE 6th Generation Intel® Core™ i3 2.7GHz 2C/4T, 4MB
DDR4-2133-8GB DDR4-2133 MHz 8GB Standard Temperature
DDR4-2133-16GB DDR4-2133 MHz 16GB Standard Temperature
DDR4-2133-8GB-EX DDR4-2133 MHz 8GB Extended Temperature
DDR4‑2133‑16GB‑EX DDR4-2133 MHz 16GB Extended Temperature
2280M.2-64GB 64GB 2280 M.2 SSD, MLC, Ext.
2280M.2-128GB 64GB 128GB 2280 M.2 SSD, MLC, Ext.
2280M.2-256GB 256GB 2280 M.2 SSD, MLC, Ext.
2280M.2-512GB 252GB 2280 M.2 SSD, MLC, Ext.
Hybrid/SLC M.2 Call for Hybrid and SLC M.2 SSD Options
ADL120-Fansink CPU Fansink (rated -40°C to 50°C)
2280M.2-WiFi 802.11ac/a/b/g/n 2T2R; Qualcomm QCA6174A + Adapter
ADL-ET Extended Temperature Screening (–40°C to +85°C)
ADL-UNDERFILL CPU BGA Underfill for mechanical and thermal stress
ADL-COATING CPU Conformal Coating for High Humidity
ADL-U/C/B CPU Underfill, Coating, and Bonding of High-Mass Components

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