M-Max HalfRack Chassis
Rugged 19/2” Rackmount Conduction-Cooled Enclosures Family for Computer Systems
Vendor:MicroMax Computer Intelligence
- Details
- Specification
- IP66-rated dust and moisture protection
- Configurable front panel
- Shock handling up to 40g, vibration up to 2.5g (for typical system)
- Operating temperature: -40 to +70 °C (for typical system)
The M-Max® HalfRack Chassis is 19/2″ form-factor rackmount conduction-cooled enclosures family for rugged computer systems development. The fully-ruggedized 19/2"-type aluminum chassis is fanless and uses natural convection and conduction cooling to comply with MIL-STD-810 standards.
Versatile mechanical design of the enclosure allows to combine several systems into one assembly side by side or by stacking, mount them on a flat surface or into a 19″ rack using appropriate mounting parts. Thereby providing reliable operation in tough environments.
| Technical specifications | |
| Material: |
Aluminum (enclosure) Steel (mounting brackets) |
| Versions: |
Height: 1U, 3U Length: 200 mm, 280 mm optional: 160 mm, 320 mm |
| Max heat dissipation: | From 25W (1U) to 90W (3U) |
| Power subsystem (HalfRack 1U): | +5 V @ 8 A, +12 V @ 5 A, +3.3 V @ 1 A |
| Power: |
+9 to +36 V DC (isolated) or +18 to +75 V DC (isolated) Complies with MIL-STD-704F AC adapter ~100 to 240 V (optional) |
| Connectors: | 1x D38999 (Power) |
| Weight: |
From 1800 g (1U, 200 mm) to 4700 g (3U, 280 mm) |
| Dimensions (W x H x L): |
220 x 44 x 200/280 mm (1U) 220 x 132 x 200/280 mm (3U) |
| PC/104 boards capacity: | 1 (1U), 4 (3U) |
| Form factor: | PC/104, 3.5”, COM Express |
|
Environmental and physical specifications for typical system |
|
|---|---|
| Dust/Moisture: | IP66 |
| Operating Temperature: |
-40 to +70 °C @ 25W (1U) -40 to +50 °C @ 90W (3U) |
| Humidity: | Operating: 5 to 95 % at +25 °C, non-condensing |
| Vibration: | Operating acceleration amplitude up to 2.5g (3–500 Hz) |
| Shock: | Maximum peak shock acceleration up to 40g |
