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Rugged Convection Cooled System with Intel Xeon Processor and MIL-DTL-38999 Connectors
  • Details
  • Specification
  • Order information
  • VITA 75 mount with passive convection cooling
  • Quad-core Intel Xeon Processor E3-1505M v6
  • 16GB DDR4-2400 with ECC soldered down
  • Operating temperature: -40°C to +75°C

Inside the tiny footprint of ADLINK’s HPERC lives the power of Intel Xeon processor and optional GPGPU parallel processing engine based on a NVIDIA Quadro MXM module. Dual removable secure erase RAID-0 SSDs provide 12Gb/s throughput and security for deployment in hostile environments.

Easy configuration and expansion allows for fast integration of custom rugged embedded applications. Uniquely-keyed MIL-DTL-38999 connectors provide a wide array of fast IO. The HPERC reserves connector pins for expansion interfaces. The GPGPU sits on a 16-lane 3rd generation PCI Express interface to enable image processing and other applications driven by AI and Deep Learning technologies.

Built with proven Ampro (acquired by ADLINK in 2008) reliability, the rugged capabilities of the HPERC are ideal for ground, air and sea deployments in military and aerospace. The HPERC systems survive shock, resist corrosion and galvanic oxidation, and perform in the humid jungle, the heat of the desert, and the bitter cold of frozen mountain passes.

In addition to Intel’s constantly evolving roadmap, NVIDIA’s many-core GPUs have transformed some areas of sensor processing, including radar, wide-area surveillance, and hyperspectral imaging, due the inherent suitability of parallel processing of those data sets. While this parallel processing paradigm has rapidly increased the processing capability within a given SWaP envelope, the real gains are yet to be exploited — the advent of Deep Learning will likely power the next wave of systems capabilities.

Image processing methods perform operations to enhance an image and/or extract useful information from it. Applications include pattern of life analysis, surveillance, reconnaissance, target identification, and geolocation in GPS-denied areas. For example, to collect tens of thousands of hours of aerial surveillance video and other theaters of operation. Turning what are often grainy, shaky videos taken by drones or satellites into clean image streams suitable for analysis — especially real-time analysis — poses a massive computational burden. According to NVIDIA and Motion DSP, GPUs can process such video seven times faster than CPU-only approaches.

Coupled with NVIDIA’s CUDA graphics processing and the OpenGL API, ADLINK’s HPERC, provides solution engineers with a powerful COTS (commercial off-the-shelf) sub-system with which they can design the next generation of image processing systems. More applications, including:

  • ISR platforms (intelligence, surveillance and reconnaissance)
  • Radar processing
  • Software-defined radio (SDR)
  • Sonar processing
  • Forward looking infrared radiometry (FLIR)

Technical specifications
CPU Intel Xeon E3-1505M v6 3.0GHz, Quad core
Chipset Intel CM238 Chipset
GPGPU NVIDIA Quadro P1000 MXM card with 4GB GDDR5 (optional)
NVIDIA Quadro T1000 MXM card with 4GB GDDR6 (optional)
Memory 16GB DDR4-2400 ECC soldered down
Expansion Busses MXM (PCIe x16 GEN3)
PCI/104 Express Type 2 (PCIe Gen2)
PCI Express Mini Card (PCIe Gen2)
Video 2x DVI and 1x VGA (3 simultaneous display outputs)
Audio 1x amplified stereo output
1x stereo input
LAN Chipset 4x Intel I210 Ethernet controller
LAN Speed 10/100/1000 Mbps
USB 6x USB 2.0
Serial Port 7x RS-232/422
GPIO 8x digital IO
Removable SATA 2x 2.5” SLC/MLC SSD on SATA 6 Gb/s
RAID 0/1 Intel RST
Removable SD 1x SDHC - SLC (up to 32 GB)
TPM Infineon SLB 9665XT2.0
Secure Erase Hardware input triggered
Software triggered
Power Input: 18-36VDC
Performance: S-States S3, S4
Thermal Internal Transfer: top-cover heatsink cooled (free air convection)
VITA 75.21 mount
Form Factor VITA-75.21 Finned Passive Convection
Dimension 304.8 (L) x 150 (W) x 130 (H) mm (with mounting brackets)
Weight 5.54 kg
IO Connectors MIL-DTL-38999 (uniquely-keyed)
Operating System Windows 10 (64-bit)
RHEL 7.3
(Please contact us for other OS support)

Environmental and physical specifications

Operating temperature -40°C to +75°C (ambient, with 30 CFM airflow)

With EGX-MXM-P1000: -40°C to +70°C ambient (Note: with 30 CFM airflow)
With EGX-MXM-T1000: -40°C to +69°C ambient (Note: with 43.6 CFM airflow)
Storage temperature -40°C to +85°C
Relative Humidity 95% at +60°C non-condensing
Altitude 0 to 50000 ft.
Certifications & Standards IEC60529 - IP-67
RTCA/DO-160G, Section 14, Category S
MIL-STD-810G - 516.6 Procedures I and V
MIL-STD-810G - 514.6 Procedure I Categories 4, 9, 11, 21
MIL-STD-810G - 501.5 Procedure II
MIL-STD-810G - 502.5, Procedure 1 and 2
Model Description
HPERC‑KBLMH‑100XN D38999, Finned, 3.0 GHz Gen7 Quad Core 45W E3-1505M v6, 16GB RAM, BIOS only
HPERC‑KBLMH‑100XN‑1 D38999, Finned, 3.0 GHz Gen7 Quad Core 45W E3-1505M v6, 16GB RAM, BIOS only, + NVIDIA Quadro Embedded P1000 MXM GPGPU Module
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