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MXC-2300

Intel Atom processor E3845 Fanless Expandable Embedded Computer with PCI/PCIe Slots
  • Details
  • Specification
  • Order information
  • Intel Atom processor E3845 with 4C @1.91 GHz SoC
  • 2x DDR3L SO-DIMM, supporting up to 8GB memory
  • 1 DisplayPort + 1 DVI-I
  • Extended temperature option: -20°C to 70°C (-4°F to 158°F)

Featuring the latest Intel Atom E3845 processor, the Matrix MXC-2300 series excels with minimal power consumption, exceptional 3D graphics, and powerful media acceleration, delivering a leading improvement in performance and cost-efficiency over any previous generation Atom-based system.

Features include dual-port CAN connectivity supported by a Philips SJA1000 controller that can run independently or bridged at the same time, bus arbitration and error detection with auto correction and re-transmission capability, and 16-CH isolated DI/O for general industrial control.

An increased total 3PCI/PCIe expansion slot count allows installation of a variety of off-the-shelf PCI/PCIe cards for configurable applications, and an internal PCI Express Mini Card socket and USIM slot support extension of additional functions, such as wireless connection.

In addition, the MXC-2300 series offers one DisplayPort and one DVI-I port for dual independent display with full HD, four USB 2.0 and one USB 3.0 ports, and 2 GbE LAN ports with teaming function.
With ADLINK's proprietary SEMA (Smart Embedded Management Agent) tool, the MXC-2300 maximizes manageability and security for a world of applications. Provide efficient remote monitoring of system activity and health in real time, system control over a robust secured channel, and fully manageable complete utilization of system resources.

With its ruggedized architecture, flexibility, and rich I/O capacity, the MXC-2300's minimal power consumption, abundant features, and leading performance and cost-efficiency make it the embedded system of choice for industrial automation, facility management, and intelligent transportation systems and applications demanding reliability in harsh environments.

Technical specifications
Processor Intel Atom Processor E3845 Processor, 1.91 GHz, 4 cores; 542/792 MHz graphics frequency (Base/Turbo)
Chipset Intel SoC (System on Chip)
Video DisplayPort: resolution up to 2560x1600
VGA: resolution up to 2560x1600
DVI: resolution up to 1920x1200
Memory 4GB DDR3L 1333 MHz SODIMM module, (up to 8 GB with 2 SODIMM sockets)
Expansion slots 2 PCI+1 PCIe x4 (MXC-2300CD-3E1, MXC-2300-3E1)
3 PCI (MXC-2300CD-3S, MXC-2300-3S)
Ethernet 2 Intel GbE ports (Intel Springville WGI210IT chipset)
Teaming function, Wake On LAN
Serial Ports 2 software-programmable RS-232/422/485 (COM 1&2) with auto-flow control, 2 RS-232 (COM 3&4)
USB 5 external USB ports (4 USB 2.0 + 1 USB 3.0) + 1 internal USB 2 .0
CAN 2 DB9 isolated CAN port with SjA1000 CAN controller (MXC-2300CD-3E1, MXC-2300CD-3S)
DIO 1 internal mini PCIe card socket (MXC-2300CD-3E1, MXC-2300CD-3S)
Mini PCIe 1 USIM socket for 3G communication (MXC-2300CD-3E1, MXC-2300CD-3S)
USIM 1 разъем для SIM-карты для связи 3G (MXC-2300CD-3E1, MXC-2300CD-3S)
Audio 1 MIC-in and 1 Line-out
WDT Hierarchical WDT supported
SEMA SEMA 2.2 (Smart Embedded Management Agent)
DC Input Built-in 9-32 VDC wide-range DC input
pluggable connectors with latch (GND, V-, V+), 2-pin remote power on/off switch
AC Input Optional 100 W external AC-DC adapter for AC input
SATA HDD 1x onboard SATA-II port for 2.5” HDD/SSD installation
CompactFlash 1 Type II CF socket CompactFlash socket
Optional Fan Module Optional fan module for heat dissipation, smart fan control
Dimensions 142 (W) x219 (D) x210(H) mm (WxDxH) (5.84” x 8.76” x 8.4)
Weight 3.5 kg (7.73 lbs)
Mounting Mounting

Environmental and physical specifications

Operating Temperature Standard: 0°C to 50°C (32˚F to 122˚F)
Extended temperature option: -20°C to 70°C (-4˚F to 158˚F) (w/industrial SSD or CF)
Storage Temperature -40°C to 85°C (-40˚F to 185˚F) (excl. HDD/SDD/CF)
Humidity ~95% @ 40°C (104˚F) (non-condensing)
Vibration Operating, 5 Grms, 5-500 Hz, 3 axes (w/ CF or SSD)
Operating, 0.5 Grms, 5-500 Hz, 3 axes (w/ HDD)
ESD Contact +/-4 KV and Air +/-8 KV
Shock Operating, 50 G, half sine 11 ms duration (w/ CF or SSD)
EMC CE and FCC Class A
Safety UL/cUL, CB
Model Description
MXC-2300CD-3E1 Bay Trail E3845 Fanless Expandable Embedded Computer with 2 PCI + 1PCIex4 slots,1miniPCIe slot, 9-32V DC input, 4GB DDR3L Memory, 16-CH isolated DIO, Dual-Port isolated CAN bus BIOS support Win 7
MXC-2300CD-3S Bay Trail E3845 Fanless Expandable Embedded Computer with 3PCI slots,1miniPCIe slot, 9-32V DC input, 4GB DDR3L Memory, 16-CH isolated DIO, Dual-Port isolated CAN b, BIOS support Win 7
MXC-2300-3E1 Bay Trail E3845 Fanless Expandable Embedded Computer with 2 PCI + 1PCIex4 slots, 9-32V DC input, 4GB DDR3L Memory, BIOS support Win 7
MXC-2300-3S Bay Trail E3845 Fanless Expandable Embedded Computer with 3 PCI slots, 9-32V DC input, 4GB DDR3L Memory, BIOS support Win 7
MXC‑2300‑3E1/no SEMA Bay Trail E3845 Fanless Expandable Embedded Computer with 2 PCI + 1PCIex4 slots, 9-32V DC input, 4GB DDR3L Memory, BIOS support Win 7, Without SEMA
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