Vendor:
Featuring the latest Intel Atom E3845 processor, the Matrix MXC-2300 series excels with minimal power consumption, exceptional 3D graphics, and powerful media acceleration, delivering a leading improvement in performance and cost-efficiency over any previous generation Atom-based system.
Features include dual-port CAN connectivity supported by a Philips SJA1000 controller that can run independently or bridged at the same time, bus arbitration and error detection with auto correction and re-transmission capability, and 16-CH isolated DI/O for general industrial control.
An increased total 3PCI/PCIe expansion slot count allows installation of a variety of off-the-shelf PCI/PCIe cards for configurable applications, and an internal PCI Express Mini Card socket and USIM slot support extension of additional functions, such as wireless connection.
In addition, the MXC-2300 series offers one DisplayPort and one DVI-I port for dual independent display with full HD, four USB 2.0 and one USB 3.0 ports, and 2 GbE LAN ports with teaming function.
With ADLINK's proprietary SEMA (Smart Embedded Management Agent) tool, the MXC-2300 maximizes manageability and security for a world of applications. Provide efficient remote monitoring of system activity and health in real time, system control over a robust secured channel, and fully manageable complete utilization of system resources.
With its ruggedized architecture, flexibility, and rich I/O capacity, the MXC-2300's minimal power consumption, abundant features, and leading performance and cost-efficiency make it the embedded system of choice for industrial automation, facility management, and intelligent transportation systems and applications demanding reliability in harsh environments.
| Technical specifications | |
| Processor | Intel Atom Processor E3845 Processor, 1.91 GHz, 4 cores; 542/792 MHz graphics frequency (Base/Turbo) |
| Chipset | Intel SoC (System on Chip) |
| Video |
DisplayPort: resolution up to 2560x1600 VGA: resolution up to 2560x1600 DVI: resolution up to 1920x1200 |
| Memory | 4GB DDR3L 1333 MHz SODIMM module, (up to 8 GB with 2 SODIMM sockets) |
| Expansion slots |
2 PCI+1 PCIe x4 (MXC-2300CD-3E1, MXC-2300-3E1) 3 PCI (MXC-2300CD-3S, MXC-2300-3S) |
| Ethernet |
2 Intel GbE ports (Intel Springville WGI210IT chipset) Teaming function, Wake On LAN |
| Serial Ports | 2 software-programmable RS-232/422/485 (COM 1&2) with auto-flow control, 2 RS-232 (COM 3&4) |
| USB | 5 external USB ports (4 USB 2.0 + 1 USB 3.0) + 1 internal USB 2 .0 |
| CAN | 2 DB9 isolated CAN port with SjA1000 CAN controller (MXC-2300CD-3E1, MXC-2300CD-3S) |
| DIO | 1 internal mini PCIe card socket (MXC-2300CD-3E1, MXC-2300CD-3S) |
| Mini PCIe | 1 USIM socket for 3G communication (MXC-2300CD-3E1, MXC-2300CD-3S) |
| USIM | 1 разъем для SIM-карты для связи 3G (MXC-2300CD-3E1, MXC-2300CD-3S) |
| Audio | 1 MIC-in and 1 Line-out |
| WDT | Hierarchical WDT supported |
| SEMA | SEMA 2.2 (Smart Embedded Management Agent) |
| DC Input |
Built-in 9-32 VDC wide-range DC input pluggable connectors with latch (GND, V-, V+), 2-pin remote power on/off switch |
| AC Input | Optional 100 W external AC-DC adapter for AC input |
| SATA HDD | 1x onboard SATA-II port for 2.5” HDD/SSD installation |
| CFast | 1x CFast |
| Optional Fan Module | Optional fan module for heat dissipation, smart fan control |
| Dimensions | 142 (W) x219 (D) x210(H) mm (WxDxH) (5.84” x 8.76” x 8.4) |
| Weight | 3.5 kg (7.73 lbs) |
| Mounting | Mounting |
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Environmental and physical specifications |
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|---|---|
| Operating Temperature |
Standard: 0°C to 50°C (32˚F to 122˚F) Extended temperature option: -20°C to 70°C (-4˚F to 158˚F) (w/industrial SSD or CF) |
| Storage Temperature | -40°C to 85°C (-40˚F to 185˚F) (excl. HDD/SDD/CF) |
| Humidity | ~95% @ 40°C (104˚F) (non-condensing) |
| Vibration |
Operating, 5 Grms, 5-500 Hz, 3 axes (w/ CF or SSD) Operating, 0.5 Grms, 5-500 Hz, 3 axes (w/ HDD) |
| ESD | Contact +/-4 KV and Air +/-8 KV |
| Shock | Operating, 50 G, half sine 11 ms duration (w/ CF or SSD) |
| EMC | CE and FCC Class A |
| Safety | UL/cUL, CB |
| Model | Description |
| MXC-2300CD-3E1 | Bay Trail E3845 Fanless Expandable Embedded Computer with 2 PCI + 1PCIex4 slots,1miniPCIe slot, 9-32V DC input, 4GB DDR3L Memory, 16-CH isolated DIO, Dual-Port isolated CAN bus BIOS support Win 7 |
| MXC-2300CD-3S | Bay Trail E3845 Fanless Expandable Embedded Computer with 3PCI slots,1miniPCIe slot, 9-32V DC input, 4GB DDR3L Memory, 16-CH isolated DIO, Dual-Port isolated CAN b, BIOS support Win 7 |
| MXC-2300-3E1 | Bay Trail E3845 Fanless Expandable Embedded Computer with 2 PCI + 1PCIex4 slots, 9-32V DC input, 4GB DDR3L Memory, BIOS support Win 7 |
| MXC-2300-3S | Bay Trail E3845 Fanless Expandable Embedded Computer with 3 PCI slots, 9-32V DC input, 4GB DDR3L Memory, BIOS support Win 7 |
| MXC‑2300‑3E1/no SEMA | Bay Trail E3845 Fanless Expandable Embedded Computer with 2 PCI + 1PCIex4 slots, 9-32V DC input, 4GB DDR3L Memory, BIOS support Win 7, Without SEMA |
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