cExpress-AR
COM Express Compact Size Type 6 Module with AMD Ryzen Embedded V2000 CPU (Zen 2 architecture)
Vendor:ADLINK Technology Inc.
- Details
- Specification
- Order information
- Up to 8 cores based on AMD Zen 2 architecture
- Up to 64GB Dual Channel DDR4
- Improved graphics performance (new Radeon Vega GPU)
- Extreme Rugged operating temperature: -45°C to +85°C
The cExpress-AR, featuring the new AMD Ryzen V2000 CPU with its high performance integrated Radeon graphics, is the first Type 6 module on the market to support an octa-core (8-core) embedded SoC, with up to 16 threads and an impressive turbo boost up to 4.2 GHz. Compared to earlier embedded quad-core V1000 processors, the additional cores combined with AMD’s Zen 2 architecture result in a more than two-fold performance increase and double the performance-per-watt efficiency.
ADLINK’s cExpress-AR provides standard support for up to 64GB DDR4 in two SO-DIMMs. ECC error correction based on selected SKUs and configurable TDP (down to 10W), while still offering 6 to 8 cores and passive cooling, make it well suited for mission critical application in harsh environments.
With integrated new generation AMD Radeon Vega graphics, the cExpress-AR supports up to four independent 4K displays via DisplayPort, HDMI, DVI and LVDS. The cExpress-AR, offers a range of high speed interfaces, including 2.5GbE Ethernet, 6 PCIe x1 Gen3 and 1 PCIe x8 Gen2 (configurable), and 4x USB 3.2 ports. These features are fully compatible with the COM Express Rev. 3 specification, allowing for existing systems to upgrade and gain in performance without changing the carrier design.
| Technical specifications | |
|
Core System |
|
|---|---|
| CPU |
New AMD Ryzen Embedded V2000 CPU - 7nm process AMD V2748 2.9/4.25GHz, 4MB L2, 35-54W (8C/7CU) AMD V2546 3.0/3.95GHz, 3MB L2, 35-54W (6C/6CU) AMD V2718 1.7/4.15GHz, 4MB L2, 10-25W (8C/7CU) AMD V2516 2.1/3.95GHz, 3MB L2, 10-25W (6C/6CU) |
| Memory |
Dual channel up to 3200 MT/s ECC/non-ECC DDR4 memory up to 64GB in two SODIMM sockets ECC, non-ECC support |
| Embedded BIOS | AMI UEFI with CMOS backup in 32 or 16MB SPI BIOS (dual BIOS by build option) |
| Cache | 4MB L2 for V2748/V2718, 3MB L2 for V2546/V2516 |
| Expansion Busses |
6 PCIe x1 Gen3: Lanes 0/1/2/3 (configurable to x1, x2, x4) and Lanes 4/5 (x1, x2) Note: PCIe switch by build option for additional x1 on Lanes 6/7 1 PCIe x8 Gen2: Lanes 16-23 (configurable to 1 x8, 2 x4) LPC bus, SMBus (system) , I2C (user) |
| SEMA Board Controller | Supports: Voltage/current monitoring, power sequence debug support, AT/ATX mode control, logistics and forensic information, flat panel control, general purpose I2C, watchdog timer, fan control and failsafe BIOS (dual BIOS by build option) |
| Debug Headers | 30-pin multipurpose flat cable connector for use with DB-30 x86 debug module providing BIOS POST code LED, EC access, SPI BIOS flashing, power testpoints, debug LEDs |
|
Video |
|
| GPU Feature Support |
AMD Radeon Vega Graphics, supporting 4 independent and simultaneous display combinations of DisplayPort/HDMI/LVDS, eDP or VGA outputs (4x 4K at DP, eDP) Hardware encode/decode (including HEVC 10-bit) DirectX 12 support OpenGL 4.6 and ES 3.X support OpenCL 2.1 support |
| Digital Display Interface |
DDI1/2/3 supporting DisplayPort 1.4, HDMI 2.1, DVI DisplayPort 1.4, max. resolution 4096x2160@60Hz HDMI 2.1, max. resolution 4096x2160 @60Hz (max. resolution support dependent on carrier) |
| VGA |
Supported by build option through DP-to-VGA IC (in place of DDI3) Max. resolultion 1920x1200 @60Hz |
| LVDS |
Single/dual channel 18/24-bit LVDS from eDP-to-LVDS IC Max. resolution 1920x1200 @60Hz in dual mode |
| eDP |
Optional 4 lane eDP1.3 support, in place of LVDS Max. resolution 4096X2160@60Hz (max. resolution dependent on carrier) |
|
Audio |
|
| Chipset | AMD Audio coprocessor |
| Audio Codec | On carrier Express-BASE6 (ALC886 standard support) |
|
Ethernet |
|
| Intel MAC/PHY | Intel Ethernet Controller i225 Series (V/IT versions) |
| Interface | 2.5Gbit/s, 1000/100/10 Mbit/s Ethernet connection |
|
I/O Interfaces and storage |
|
| USB | 4x USB 3.2/2.0/1.1 (USB 0,1,2,3) and 4x USB 2.0/1.1 (USB 4,5,6,7) |
| SATA | 2x SATA 6Gb/s (SATA 0,1) |
| Serial | 2x UART ports with console redirection |
| GPIO |
4x GPO and 4x GPI from EC (GPI with interrupt TBC) Note: USB 3.2 Gen2 support dependent on carrier design. |
| Super I/O | Supported on carrier if needed (standard support for W83627DHG-P, other Super I/O support is by project basis) |
|
TPM |
|
| Chipset | Infineon |
| Type | TPM 2.0 (LPC based, build option) |
|
Power |
|
| Standard Input | ATX = 12V±5% / 5Vsb ±5% or AT = 12V±5% |
| Wide Input | ATX = 8.5-20 V / 5Vsb ±5% or AT=8.5-20V |
| Management | ACPI 5.0 compliant, Smart Battery support |
| Power States | S0, S3, S4, S5 , S5 ECO mode (Wake on USB S3/S4, WOL S3/S4/S5) |
| ECO mode | Supports deep S5 mode for power saving |
|
Other |
|
| Form Factor | PICMG COM.0: Rev 3.0 Type 6 |
| Dimension | Compact size: 95 mm x 95 mm |
| Operating Systems | Standard Support: Windows 10 IOT Enterprise 64-bit, Windows 10 64-bit, Ubuntu 20.04 (planning) |
|
Environmental and physical specifications |
|
| Operating temperature |
Standard: 0°C to 60°C Extreme Rugged: -45°C to 85°C (optional, selected SKUs) |
| Humidity |
5-90% RH operating, non-condensing 5-95% RH storage (and operating with conformal coating) |
| Shock and Vibration |
IEC 60068-2-64 and IEC-60068-2-27 MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D |
| HALT | Thermal Stress, Vibration Stress, Thermal Shock and Combined Test |
| Model | Description |
| cExpress‑AR‑V2748 | Compact COM Express Type 6 module with New AMD Ryzen V2748 at 2.9/4.15GHz, otca-core processor, Radeon Vega graphics with 7CU |
| cExpress‑AR‑V2546 | Compact COM Express Type 6 module with New AMD Ryzen V2546 at 3.0/3.95GHz, hexa-core processor, Radeon Vega graphics with 6CU |
| cExpress-AR-V2718 | Compact COM Express Type 6 module with New AMD Ryzen V2718 at 1.7/4.15GHz, otca-core processor, Radeon Vega graphics with 7CU |
| cExpress‑AR‑V2516 | Compact COM Express Type 6 module with New AMD Ryzen V2516 at 2.1/3.95GHz, hexa-core processor, Radeon Vega graphics with 6CU |
| Accessories | |
| HTS-cAR-B | Heatspreader for cExpress-AR with threaded standoffs for bottom mounting |
| HTS-cAR-BT | Heatspreader for cExpress-AR with through hole standoffs for top mounting |
| THS-cAR-B | Low profile heatsink for cExpress-AR with threaded standoffs for bottom mounting |
| THS-cAR-BT | Low profile heatsink for cExpress-AR with through hole standoffs for top mounting |
| THSH-cAR-B | High profile heatsink for cExpress-AR with threaded standoffs for bottom mounting |
| THSF-cAR-B | High profile heatsink with fan for cExpress-AR with threaded standoffs for bottom mounting |
