cExpress-TL
COM Express Compact Size Type 6 Module with 11th Gen Intel Core and Celeron Processors (formerly codename: Tiger Lake-UP3)
Vendor:ADLINK Technology Inc.
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- Specification
- Order information
ADLINK cExpress-TL, based on the 11th Gen Intel Core i7/i5/i3 and Celeron processor, is the first COM Express module to support PCI Express Gen 4 at 16 GT/s, effectively doubling the bandwidth of previous generations.
Additionally if features support for 2.5GbE Ethernet, leveraging existing Cat5e cable infrastructure being used for 1GbE Ethernet, it supports four USB 3.2 ports with transfer rates up to 10Gb/s. The modules have a configurable power range of 15 to 28 watts, which suits them for fanless space-constrained embedded applications. Typical industries in need of such high-performance/low-power characteristics are transport, medical, industrial automation and control, edge controllers, robotics and multi-camera-based AI.
cExpress-TL features the Intel Iris Xe, a new graphics core, and supporting AVX-512 Vector Neural Net Instructions (VNNI) can significantly improve the number of elements processed per cycle, providing AI inferencing performance that is up to 3x that of previously available from non-VNNI platforms. Intel Iris Xe provides 96 execution units and is able to be configured to support two 8K independent displays or four 4K independent display (HDMI/DP/eDP). Additional support includes In-Band ECC (IBECC), providing ECC level error correction on DDR4 SODIMM memories for mission critical or rugged applications.
| Technical specifications | |
|
Core System |
|
|---|---|
| CPU |
11th Gen Intel Core and Celeron Processors - Mobile 10nm++ process (formerly “Tiger Lake UP3”) Intel Core i7-1185G7E, 2.8(4.4)GHz, 12MB, 15-28W (4C/Iris Xe) Intel Core i5-1145G7E, 2.6 (4.1)GHz, 8MB, 15-28W (4C/Iris Xe) Intel Core i3-1115G4E, 3.0(3.9)GHz 6MB, 15-28W (2C/UHD) Intel Celeron 6305E, 1.8 GHz, 4MB, 15W (2C/UHD) Intel Core i7-1185GRE, 2.8 (4.4) GHz, 12MB, 15-28W (4C/Iris Xe) Intel Core i5-1145GRE, 2.6 (4.1) GHz, 8MB, 15-28W (4C/Iris Xe) Intel Core i3-1115GRE, 3.0 (3.9) GHz, 6MB, 15-28W (2C/UHD) Supports: Intel VT, Intel VT-d, Intel TXT, Intel SSE4.2, Intel HT Technology, Intel 64 Architecture, Execute Disable Bit, Intel Turbo Boost Technology 2.0, Intel AVX-512, Intel AVX2, Intel AES-NI, PCLMULQDQ Instruction, Intel Secure Key and Intel TSX-NI. Notes: Availability of features may vary between processor SKUs. Some of the SKUs listed above are supported by project basis only. Please contact us for availability. |
| Memory |
Dual channel DDR4 memory up to 3200 MT/s IBECC/non-ECC (BIOS selectable), max. 64GB (2x 32GB) in two SODIMM sockets One SO-DIMM on top side, one SO-DIMM on bottom side Intel In-Band ECC (IBECC), provides ECC protection without additional ECC device (i7-1185GRE, i5-1145GRE, i3-1115GRE support IBECC) |
| Embedded BIOS | AMI UEFI with CMOS backup in 32 or 16MB (TBC) SPI BIOS with Intel AMT 12.x support (dual BIOS by build option) |
| Cache | 12MB for Core i7, 8MB for Core i5, 6MB for Core i3, 4MB for Celeron |
| Expansion Busses |
5 PCIe x1 Gen3 (AB): Lanes 0/1/2/3 (configurable to 4 x1, 2 x2, 1 x4, 2 x1 + 1 x2, 1 x2 + 2 x1) and Lane 4 (x1 only) Note: PCIe switch build option available by project basis to offer more x1 lanes (Lanes 5, 6, 7) 1 PCIe x4 Gen4 (CD): Lanes 16-19 (only x4) LPC bus (through an ESPI-to-LPC bridge IC), SMBus (system) , I2C (user) |
| SEMA Board Controller | Supports: Voltage/current monitoring, power sequence debug support, AT/ATX mode control, logistics and forensic information, flat panel control, general purpose I2C, watchdog timer, fan control and failsafe BIOS (dual BIOS by build option) |
| Debug Headers | 30-pin multipurpose flat cable connector for use with DB-30 x86 debug module providing BIOS POST code LED, EC access, SPI BIOS flashing, power testpoints, debug LEDs |
|
Video |
|
| GPU Feature Support |
Intel Gen12 Graphics Core Architecture, supporting 4 independent and simultaneous display combinations of DisplayPort/HDMI/LVDS, eDP or VGA outputs (4x 4K60) Hardware encode/transcode of HD content (including HEVC) DirectX 12 support OpenGL 4.5, 4.4/4.3 and ES 2.0 support OpenCL 2.1, 2.0/1.2 support |
| Digital Display Interface | DDI1/2/3 supporting DisplayPort/HDMI/DVI |
| VGA |
Supported by build option through DP-to-VGA IC (in place of DDI3) Max. resolultion 1920x1200 @60Hz |
| LVDS |
Single/dual channel 18/24-bit LVDS from eDP-to-LVDS IC Max. resolution 1920x1200 @60Hz in dual mode |
| eDP |
Optional 4 lane eDP1.3 support, in place of LVDS Max. resolution 4K@60Hz |
|
Audio |
|
| Chipset | Intel HD Audio integrated in SoC |
| Audio Codec | On carrier Express-BASE6 (ALC886 standard support) |
|
Ethernet |
|
| Intel MAC/PHY |
LAN Controller, Intel i225 series (V/LM/IT versions) TSN supported by IT versions only on Linux, by project basis |
| Interface |
2.5Gbe, 1000/100/10 Mbit/s Ethernet connection GbE0_SDP available if TSN support enabled |
|
I/O Interfaces and storage |
|
| USB | 4x USB 3.2/2.0/1.1 (USB 0,1,2,3) and 4x USB 2.0/1.1 (USB 4,5,6,7) |
| SATA | 2x SATA 6Gb/s (SATA 0,1) |
| Serial | 2x UART ports with console redirection |
| GPIO |
4x GPO and 4x GPI from EC (GPI with interrupt) Note: USB 3.2 Gen2 support dependent on carrier design. |
| Super I/O | Supported on carrier if needed (standard support for W83627DHG-P, other Super I/O support is by project basis) |
|
TPM |
|
| Chipset | Infineon |
| Type | TPM 2.0 (LPC based, build option) |
|
Power |
|
| Standard Input | ATX = 12V±5% / 5Vsb ±5% or AT = 12V±5% |
| Wide Input | ATX = 8.5-20 V / 5Vsb ±5% or AT=8.5-20V |
| Management | ACPI 5.0 compliant, Smart Battery support |
| Power States | C1-C6, S0, S1, S3, S4, S5 , S5 ECO mode (Wake on USB S3/S4, WOL S3/S4/S5) |
| ECO mode | Supports deep S5 mode for power saving |
|
Other |
|
| Form Factor | PICMG COM.0: Rev 3.0 Type 6 |
| Dimension | Compact size: 95 mm x 95 mm |
| Operating Systems | Standard Support: Windows 10 IOT Enterprise 64-bit, Yocto Linux 64-bit, VxWorks 64-bit (TBC), Ubuntu (TBC) |
|
Environmental and physical specifications |
|
| Operating temperature |
Standard: 0°C to 60°C Extreme Rugged: -45°C to 85°C (optional, selected SKUs) |
| Storage temperature |
Standard: -20°C to 80°C Extreme Rugged: -45°C to 85°C (optional, selected SKUs) |
| Humidity |
5-90% RH operating, non-condensing 5-95% RH storage (and operating with conformal coating) |
| Shock and Vibration |
IEC 60068-2-64 and IEC-60068-2-27 MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D |
| HALT | Thermal Stress, Vibration Stress, Thermal Shock and Combined Test |
| Model | Description |
| cExpress‑TL‑i7‑1185G7E | Compact COM Express Type 6 module with 11th Gen Intel® Core™ i7-1185G7E at 2.8/4.4GHz, Quad-core with Intel Iris® Xe graphics |
| cExpress-TL-i5-1145G7E | Compact COM Express Type 6 module with 11th Gen Intel® Core™ i5-1145G7E at 2.6/4.1GHz, Quad-core with Intel Iris® Xe graphics |
| cExpress-TL-i3-1115G4E | Compact COM Express Type 6 module with 11th Gen Intel® Core™ i3-1115G4E at 3.0/3.9GHz, Dual-core with Intel UHD graphics |
| cExpress-TL-6305E | Compact COM Express Type 6 module with 11th Gen Intel® Celeron® 6305E at 1.8GHz, Dual-core with Intel UHD graphics |
| Accessories | |
| HTS-cTL-B | Heatspreader for cExpress-TL with threaded standoffs for bottom mounting |
| HTS-cTL-BT | Heatspreader for cExpress-TL with through hole standoffs for top mounting |
| THS-cTL-B | Low profile heatsink for cExpress-TL with threaded standoffs for bottom mounting |
| THS-cTL-BT | Low profile heatsink for cExpress-TL with through hole standoffs for top mounting |
| THSH-cTL-B | High profile heatsink for cExpress-TL with threaded standoffs for bottom mounting |
| THSF-cTL-B | High profile heatsink with fan for cExpress-TL with threaded standoffs for bottom mounting |
