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cExpress-TL

COM Express Compact Size Type 6 Module with 11th Gen Intel Core and Celeron Processors (formerly codename: Tiger Lake-UP3)
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ADLINK cExpress-TL, based on the 11th Gen Intel Core i7/i5/i3 and Celeron processor, is the first COM Express module to support PCI Express Gen 4 at 16 GT/s, effectively doubling the bandwidth of previous generations.

Additionally if features support for 2.5GbE Ethernet, leveraging existing Cat5e cable infrastructure being used for 1GbE Ethernet, it supports four USB 3.2 ports with transfer rates up to 10Gb/s. The modules have a configurable power range of 15 to 28 watts, which suits them for fanless space-constrained embedded applications. Typical industries in need of such high-performance/low-power characteristics are transport, medical, industrial automation and control, edge controllers, robotics and multi-camera-based AI.

cExpress-TL features the Intel Iris Xe, a new graphics core, and supporting AVX-512 Vector Neural Net Instructions (VNNI) can significantly improve the number of elements processed per cycle, providing AI inferencing performance that is up to 3x that of previously available from non-VNNI platforms. Intel Iris Xe provides 96 execution units and is able to be configured to support two 8K independent displays or four 4K independent display (HDMI/DP/eDP). Additional support includes In-Band ECC (IBECC), providing ECC level error correction on DDR4 SODIMM memories for mission critical or rugged applications.

Technical specifications

Core System

CPU 11th Gen Intel Core and Celeron Processors - Mobile 10nm++ process (formerly “Tiger Lake UP3”)

Intel Core i7-1185G7E, 2.8(4.4)GHz, 12MB, 15-28W (4C/Iris Xe)
Intel Core i5-1145G7E, 2.6 (4.1)GHz, 8MB, 15-28W (4C/Iris Xe)
Intel Core i3-1115G4E, 3.0(3.9)GHz 6MB, 15-28W (2C/UHD)
Intel Celeron 6305E, 1.8 GHz, 4MB, 15W (2C/UHD)
Intel Core i7-1185GRE, 2.8 (4.4) GHz, 12MB, 15-28W (4C/Iris Xe)
Intel Core i5-1145GRE, 2.6 (4.1) GHz, 8MB, 15-28W (4C/Iris Xe) Intel Core i3-1115GRE, 3.0 (3.9) GHz, 6MB, 15-28W (2C/UHD)

Supports: Intel VT, Intel VT-d, Intel TXT, Intel SSE4.2, Intel HT Technology, Intel 64 Architecture, Execute Disable Bit, Intel Turbo Boost Technology 2.0, Intel AVX-512, Intel AVX2, Intel AES-NI, PCLMULQDQ Instruction, Intel Secure Key and Intel TSX-NI.

Notes: Availability of features may vary between processor SKUs.
Some of the SKUs listed above are supported by project basis only. Please contact us for availability.
Memory Dual channel DDR4 memory up to 3200 MT/s IBECC/non-ECC (BIOS selectable), max. 64GB (2x 32GB) in two SODIMM sockets
One SO-DIMM on top side, one SO-DIMM on bottom side
Intel In-Band ECC (IBECC), provides ECC protection without additional ECC device (i7-1185GRE, i5-1145GRE, i3-1115GRE support IBECC)
Embedded BIOS AMI UEFI with CMOS backup in 32 or 16MB (TBC) SPI BIOS with Intel AMT 12.x support (dual BIOS by build option)
Cache 12MB for Core i7, 8MB for Core i5, 6MB for Core i3, 4MB for Celeron
Expansion Busses 5 PCIe x1 Gen3 (AB): Lanes 0/1/2/3 (configurable to 4 x1, 2 x2, 1 x4, 2 x1 + 1 x2, 1 x2 + 2 x1) and Lane 4 (x1 only)

Note: PCIe switch build option available by project basis to offer more x1 lanes (Lanes 5, 6, 7)
1 PCIe x4 Gen4 (CD): Lanes 16-19 (only x4)
LPC bus (through an ESPI-to-LPC bridge IC), SMBus (system) , I2C (user)
SEMA Board Controller Supports: Voltage/current monitoring, power sequence debug support, AT/ATX mode control, logistics and forensic information, flat panel control, general purpose I2C, watchdog timer, fan control and failsafe BIOS (dual BIOS by build option)
Debug Headers 30-pin multipurpose flat cable connector for use with DB-30 x86 debug module providing BIOS POST code LED, EC access, SPI BIOS flashing, power testpoints, debug LEDs

Video

GPU Feature Support Intel Gen12 Graphics Core Architecture, supporting 4 independent and simultaneous display combinations of DisplayPort/HDMI/LVDS, eDP or VGA outputs (4x 4K60)
Hardware encode/transcode of HD content (including HEVC)
DirectX 12 support
OpenGL 4.5, 4.4/4.3 and ES 2.0 support
OpenCL 2.1, 2.0/1.2 support
Digital Display Interface DDI1/2/3 supporting DisplayPort/HDMI/DVI
VGA Supported by build option through DP-to-VGA IC (in place of DDI3)
Max. resolultion 1920x1200 @60Hz
LVDS Single/dual channel 18/24-bit LVDS from eDP-to-LVDS IC
Max. resolution 1920x1200 @60Hz in dual mode
eDP Optional 4 lane eDP1.3 support, in place of LVDS
Max. resolution 4K@60Hz

Audio

Chipset Intel HD Audio integrated in SoC
Audio Codec On carrier Express-BASE6 (ALC886 standard support)

Ethernet

Intel MAC/PHY LAN Controller, Intel i225 series (V/LM/IT versions)
TSN supported by IT versions only on Linux, by project basis
Interface 2.5Gbe, 1000/100/10 Mbit/s Ethernet connection
GbE0_SDP available if TSN support enabled

I/O Interfaces and storage

USB 4x USB 3.2/2.0/1.1 (USB 0,1,2,3) and 4x USB 2.0/1.1 (USB 4,5,6,7)
SATA 2x SATA 6Gb/s (SATA 0,1)
Serial 2x UART ports with console redirection
GPIO 4x GPO and 4x GPI from EC (GPI with interrupt)

Note: USB 3.2 Gen2 support dependent on carrier design.
Super I/O Supported on carrier if needed (standard support for W83627DHG-P, other Super I/O support is by project basis)

TPM

Chipset Infineon
Type TPM 2.0 (LPC based, build option)

Power

Standard Input ATX = 12V±5% / 5Vsb ±5% or AT = 12V±5%
Wide Input ATX = 8.5-20 V / 5Vsb ±5% or AT=8.5-20V
Management ACPI 5.0 compliant, Smart Battery support
Power States C1-C6, S0, S1, S3, S4, S5 , S5 ECO mode (Wake on USB S3/S4, WOL S3/S4/S5)
ECO mode Supports deep S5 mode for power saving

Other

Form Factor PICMG COM.0: Rev 3.0 Type 6
Dimension Compact size: 95 mm x 95 mm
Operating Systems Standard Support: Windows 10 IOT Enterprise 64-bit, Yocto Linux 64-bit, VxWorks 64-bit (TBC), Ubuntu (TBC)

Environmental and physical specifications

Operating temperature Standard: 0°C to 60°C
Extreme Rugged: -45°C to 85°C (optional, selected SKUs)
Storage temperature Standard: -20°C to 80°C
Extreme Rugged: -45°C to 85°C (optional, selected SKUs)
Humidity 5-90% RH operating, non-condensing
5-95% RH storage (and operating with conformal coating)
Shock and Vibration IEC 60068-2-64 and IEC-60068-2-27
MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D
HALT Thermal Stress, Vibration Stress, Thermal Shock and Combined Test
Model Description
cExpress‑TL‑i7‑1185G7E Compact COM Express Type 6 module with 11th Gen Intel® Core™ i7-1185G7E at 2.8/4.4GHz, Quad-core with Intel Iris® Xe graphics
cExpress-TL-i5-1145G7E Compact COM Express Type 6 module with 11th Gen Intel® Core™ i5-1145G7E at 2.6/4.1GHz, Quad-core with Intel Iris® Xe graphics
cExpress-TL-i3-1115G4E Compact COM Express Type 6 module with 11th Gen Intel® Core™ i3-1115G4E at 3.0/3.9GHz, Dual-core with Intel UHD graphics
cExpress-TL-6305E Compact COM Express Type 6 module with 11th Gen Intel® Celeron® 6305E at 1.8GHz, Dual-core with Intel UHD graphics
Accessories
HTS-cTL-B Heatspreader for cExpress-TL with threaded standoffs for bottom mounting
HTS-cTL-BT Heatspreader for cExpress-TL with through hole standoffs for top mounting
THS-cTL-B Low profile heatsink for cExpress-TL with threaded standoffs for bottom mounting
THS-cTL-BT Low profile heatsink for cExpress-TL with through hole standoffs for top mounting
THSH-cTL-B High profile heatsink for cExpress-TL with threaded standoffs for bottom mounting
THSF-cTL-B High profile heatsink with fan for cExpress-TL with threaded standoffs for bottom mounting
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