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COM Express Basic Size Type 6 Module
  • Details
  • Specification
  • Order information
  • Intel Xeon and Core Processors
  • Up to 48GB Dual Channel DDR4
  • Supports up to 3 independent displays
  • Standard operating temperature: 0°C to 60°C

The Express-CF/CFE is the first COM Express COM.0 R3.0 Basic Size Type 6 module supporting the Hexa-core (6 cores) 64-bit 8th Generation Intel Core and Xeon processor (codename «Coffeelake-H») with Mobile Intel QM370, HM370, CM246 Chipset.

Whereas previous generations Intel Core i3 processors supported only dual cores with 3MB cache, the Intel Core i3-8100H is the first in its class to support 4 CPU cores with 6MB of cache. This major upgrade results in a more than 80% performance boost in MIPS (million instructions per second), and an almost doubling of memory/caching bandwidth, all at no significant cost increase compared to earlier generations. Intel Core i3 processors are widely recognized as the best valued processor and are therefore preferred in high-volume, cost-sensitive applications. They are popular choices in gaming, medical and industrial control to name a few.

These Hexa-core processors support up to 12 threads (Intel Hyper-Threading Technology) as well as an impressive turbo boost of up to 4.4GHz. These combined features make the Express- CF/CFE well suited to customers who need uncompromising system performance and responsiveness in a long product life solution.

The Express-CF/CFE has up to three SODIMM sockets supporting up to 48GB of DDR4 memory (two on top by default, one on bottom by build option) while still fully complying with PICMG COM.0 mechanical specifications. Modules equipped with the Xeon processor and CM246 Chipset support both ECC and non-ECC SODIMMs.

Integrated Intel Generation 9 Graphics includes features such as OpenGL 4.5, DirectX 12/11, OpenCL 2.1/2.0/1.2, Intel Clear Video HD Technology, Advanced Scheduler 2.0, 1.0, XPDM support, and DirectX Video Acceleration (DXVA) support for full H.265/HEVC 10-bit, MPEG2 hardware codec. In addition, High Dynamic Range is supported for enhanced picture color and quality and digital content protection has been upgraded to HDCP 2.2. Graphics outputs include LVDS and three DDI ports supporting HDMI/DVI/DisplayPort and eDP/VGA as a build option. The Express-CF/CFE is specifically designed for customers with high-performance processing graphics requirements who want to outsource the custom core logic of their systems for reduced development time. In addition to the onboard integrated graphics, a multiplexed PCIe x16 graphics bus is available for discrete graphics expansion.

Input/output features include eight PCIe Gen3 lanes that can be used for NVMe SSD and Intel Optane memory, allowing applications access to the highest speed storage solutions and include a single onboard Gigabit Ethernet port, USB 3.0 ports and USB 2.0 ports, and SATA 6 Gb/s ports. Support is provided for SMBus and I2C. The module is equipped with SPI AMI EFI BIOS with CMOS backup, supporting embedded features such as remote console, hardware monitor, and watchdog timer.

Technical specifications

Core System

CPU Mobile 8th Generation Intel Xeon® and Core™ Processors - 14nm process
Xeon E-2176M, 2.7 (4.4)GHz, 12MB. 45W (35W cTDP), 6C/GT2
Core i7-8850H, 2.6 (4.3)GHz, 9MB, 45W (35W cTDP), 6C/GT2
Core i5-8400H, 2.5 (4.2)GHz, 8MB, 45W (35W cTDP), 4C/GT2
Core i3-8100H, 3.0GHz, 6MB, 45W (35W cTDP), 4C/GT2

Supports: Intel VT, Intel TXT, Intel SSE4.2, Intel HT Technology, Intel 64 Architecture, Execute Disable Bit, Intel Turbo Boost Technology 2.0, Intel AVX2, Intel AES-NI, PCLMULQDQ Instruction, Intel Secure Key and Intel TSX.

Note: Availability of the features may vary between processor SKUs.
Memory 2133/2400 MHz DDR4 memory up to 48GB in three SODIMM sockets
(Xeon paired with CM246 supports both ECC and non-ECC memory)
(48GB is build support)
Embedded BIOS AMI EFI with CMOS backup in 32MB SPI BIOS with Intel AMT 12.0 support
Cache 12MB for Xeon, 9MB for Core i7, 8MB for Core i5, 6MB for Core i3
Chipset CM246 (supports ECC memory and Intel AMT)
QM370 (supports Intel AMT )
HM370 (no support for Intel AMT )
Expansion Busses PCIe x16, 2 PCIe x8, or 1 PCIe x8 with 2 PCIe x4 (Gen3)
6 PCI Express x1 (Gen3); AB connector, Lanes 0/1/2/3/4/5
2 PCI Express x1 (Gen3); CD connector, Lane 6/7
LPC bus, SMBus (system), I2C (user)
SEMA Board Controller Supports: Voltage/Current monitoring, Power Sequence debug support, AT/ATX mode control, Logistics and Forensic information, Flat Panel Control, General Purpose I2C, Failsafe BIOS (dual BIOS), Watchdog Timer and Fan Control
Debug Headers 40-pin multipurpose flat cable connector for use with DB-40 debug module providing BIOS POST code LED, BMC access, SPI BIOS flashing, power testpoints, debug LEDs
60-pin XDP header for ICE debug of CPU/chipset


GPU Feature Support Intel Generation 9 LP Graphics Core Architecture, supporting 3 independent and simultaneous display combinations of DisplayPort/HDMI (or VGA), LVDS or eDP outputs
Hardware encode/transcode HD content (including HEVC 10-bit)
DirectX 12, DirectX 11.2, DirectX 11.1, DirectX 11, DirectX 10.1, DirectX 10,DirectX 9 support
OpenGL 4.5 support
OpenCL 2.1, 2.0/1.2 support
Digital Display Interface DDI1/2/3 supporting DisplayPort 1.2, HDMI 1.4, DVI

DP1.2: max. resolution is 4096x2304 @ 60Hz, 24bpp
HDMI1.4: max. resolution is 4096x2160 @ 24Hz, 24bpp
VGA VGA support, in place of DDI3 channel (build option, max. resolution 1920x1200@60Hz)
LVDS Single/dual channel 18/24-bit LVDS from eDP-to-LVDS IC (max. resolution 1920x1200@60Hz in dual mode)
eDP 4 lane support optional, in place of LVDS (build option, max. resolution 4096x2304 @60Hz, 24bpp)


Chipset Intel HD Audio integrated in chipset
Audio Codec Located on carrier Express-BASE6 (ALC886 standard supported)


Intel MAC/PHY Intel I219LM/V with AMT 12.0 support (only LM version support AMT)
Interface 10/100/1000 GbE connection

I/O Interfaces

USB 4x USB 3.1 (USB 0, 1, 2, 3) and 4x USB 2.0 (USB 4, 5, 6, 7)
SATA Four ports SATA 6Gb/s (SATA0,1,2,3)
Serial 2 UART ports with console redirection
GPIO/SD 4 GPO and 4 GPI (GPI with interrupt)
SD/GPIO muxed design, switched by BIOS setting
SD functions as storage device only

Note: USB 3.1 Gen2 support dependent on carrier design
Super I/O Supported on carrier if needed (standard support for W83627DHG-P)


Chipset Infineon
Type TPM 2.0


Standard Input ATX = 12V ±5% / 5Vsb ±5% or AT = 12V ±5%
Wide Input ATX = 8.5-20 V / 5Vsb ±5% or AT = 8.5-20V
Management ACPI 5.0 compliant, Smart Battery support
Power States C1-C6, S0, S1, S3, S4, S5 , S5 ECO mode (Wake-on-USB S3/S4, WOL S3/S4/S5)
ECO mode Supports deep S5 mode for power saving


Form Factor PICMG COM.0, Rev 3.0 Type 6
Dimension Basic size: 125 mm x 95 mm
Operating Systems Standard Support: Windows 10 64-bit, Linux 64-bit
Extended Support (BSP): Linux 64-bit

Environmental and physical specifications

Operating temperature Standard: 0°C to +60°C
Storage temperature Standard: -20°C to +80°C
Humidity 5-90% RH operating, non-condensing
5-95% RH storage (and operating with conformal coating)
Shock and Vibration IEC 60068-2-64 and IEC-60068-2-27
MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D
HALT Thermal Stress, Vibration Stress, Thermal Shock and Combined Test
Model Description
Express-CF-i7-8850H Basic COM Express Type6 module with 8th Intel Core i7-8850H processor at 2.6/4.3GHz with QM370 chipset
Express-CF-i5-8400H Basic COM Express Type6 module with 8th Intel Core i5-8400H processor at 2.5/4.2GHz with QM370 chipset
Express-CF-i3-8100H Basic COM Express Type6 module with 8th Intel Core i3-8100H processor at 2.6GHz with HM370 chipset
Express-CF-i3-8100H-VGA Basic COM Express Type6 module with 8th Intel Core i3-8100H processor at 2.6GHz with HM370 chipset, with VGA
Express-CFE-E-2176M Basic COM Express Type6 module with 8th Intel Xeon E-2176M processor at 2.7/4.4GHz with CM246 chipset
Express‑CFE‑E‑2176M‑3DIMM Basic COM Express Type6 module with 8th Intel Xeon E-2176M processor at 2.7/4.4GHz with CM246 chipset, with three SO-DIMM
HTS-CF-B Heatspreader for Express-CF/CFE with threaded standoffs for bottom mounting
HTS-CF-BT Heatspreader for Express-CF/CFE with through hole standoffs for top mounting
THS-CF-BL Low profile heatsink for Express-CF/CFE with threaded standoffs for bottom mounting
THS-CF-BTL Low profile heatsink for Express-CF/CFE with through hole standoffs for top mounting
THSH-CF-BL High profile heatsink for Express-CF/CFE with threaded standoffs for bottom mounting
THSF-CF-BL High profile heatsink with Fan for Express-CF/CFE with threaded standoffs for bottom mounting
Starter kit for COM Express Type 6 COM Express Type 6 Starter Kit Plus
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