The Express-CF/CFE is the first COM Express COM.0 R3.0 Basic Size Type 6 module supporting the Hexa-core (6 cores) 64-bit 8th Generation Intel Core and Xeon processor (codename «Coffeelake-H») with Mobile Intel QM370, HM370, CM246 Chipset.
Whereas previous generations Intel Core i3 processors supported only dual cores with 3MB cache, the Intel Core i3-8100H is the first in its class to support 4 CPU cores with 6MB of cache. This major upgrade results in a more than 80% performance boost in MIPS (million instructions per second), and an almost doubling of memory/caching bandwidth, all at no significant cost increase compared to earlier generations. Intel Core i3 processors are widely recognized as the best valued processor and are therefore preferred in high-volume, cost-sensitive applications. They are popular choices in gaming, medical and industrial control to name a few.
These Hexa-core processors support up to 12 threads (Intel Hyper-Threading Technology) as well as an impressive turbo boost of up to 4.4GHz. These combined features make the Express- CF/CFE well suited to customers who need uncompromising system performance and responsiveness in a long product life solution.
The Express-CF/CFE has up to three SODIMM sockets supporting up to 48GB of DDR4 memory (two on top by default, one on bottom by build option) while still fully complying with PICMG COM.0 mechanical specifications. Modules equipped with the Xeon processor and CM246 Chipset support both ECC and non-ECC SODIMMs.
Integrated Intel Generation 9 Graphics includes features such as OpenGL 4.5, DirectX 12/11, OpenCL 2.1/2.0/1.2, Intel Clear Video HD Technology, Advanced Scheduler 2.0, 1.0, XPDM support, and DirectX Video Acceleration (DXVA) support for full H.265/HEVC 10-bit, MPEG2 hardware codec. In addition, High Dynamic Range is supported for enhanced picture color and quality and digital content protection has been upgraded to HDCP 2.2. Graphics outputs include LVDS and three DDI ports supporting HDMI/DVI/DisplayPort and eDP/VGA as a build option. The Express-CF/CFE is specifically designed for customers with high-performance processing graphics requirements who want to outsource the custom core logic of their systems for reduced development time. In addition to the onboard integrated graphics, a multiplexed PCIe x16 graphics bus is available for discrete graphics expansion.
Input/output features include eight PCIe Gen3 lanes that can be used for NVMe SSD and Intel Optane memory, allowing applications access to the highest speed storage solutions and include a single onboard Gigabit Ethernet port, USB 3.0 ports and USB 2.0 ports, and SATA 6 Gb/s ports. Support is provided for SMBus and I2C. The module is equipped with SPI AMI EFI BIOS with CMOS backup, supporting embedded features such as remote console, hardware monitor, and watchdog timer.
Technical specifications | |
Core System |
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CPU |
Mobile 8th Generation Intel Xeon® and Core™ Processors - 14nm process Xeon E-2176M, 2.7 (4.4)GHz, 12MB. 45W (35W cTDP), 6C/GT2 Core i7-8850H, 2.6 (4.3)GHz, 9MB, 45W (35W cTDP), 6C/GT2 Core i5-8400H, 2.5 (4.2)GHz, 8MB, 45W (35W cTDP), 4C/GT2 Core i3-8100H, 3.0GHz, 6MB, 45W (35W cTDP), 4C/GT2 Supports: Intel VT, Intel TXT, Intel SSE4.2, Intel HT Technology, Intel 64 Architecture, Execute Disable Bit, Intel Turbo Boost Technology 2.0, Intel AVX2, Intel AES-NI, PCLMULQDQ Instruction, Intel Secure Key and Intel TSX. Note: Availability of the features may vary between processor SKUs. |
Memory |
2133/2400 MHz DDR4 memory up to 48GB in three SODIMM sockets (Xeon paired with CM246 supports both ECC and non-ECC memory) (48GB is build support) |
Embedded BIOS | AMI EFI with CMOS backup in 32MB SPI BIOS with Intel AMT 12.0 support |
Cache | 12MB for Xeon, 9MB for Core i7, 8MB for Core i5, 6MB for Core i3 |
Chipset |
CM246 (supports ECC memory and Intel AMT) QM370 (supports Intel AMT ) HM370 (no support for Intel AMT ) |
Expansion Busses |
PCIe x16, 2 PCIe x8, or 1 PCIe x8 with 2 PCIe x4 (Gen3) 6 PCI Express x1 (Gen3); AB connector, Lanes 0/1/2/3/4/5 2 PCI Express x1 (Gen3); CD connector, Lane 6/7 LPC bus, SMBus (system), I2C (user) |
SEMA Board Controller | Supports: Voltage/Current monitoring, Power Sequence debug support, AT/ATX mode control, Logistics and Forensic information, Flat Panel Control, General Purpose I2C, Failsafe BIOS (dual BIOS), Watchdog Timer and Fan Control |
Debug Headers |
40-pin multipurpose flat cable connector for use with DB-40 debug module providing BIOS POST code LED, BMC access, SPI BIOS flashing, power testpoints, debug LEDs 60-pin XDP header for ICE debug of CPU/chipset |
Video |
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GPU Feature Support |
Intel Generation 9 LP Graphics Core Architecture, supporting 3 independent and simultaneous display combinations of DisplayPort/HDMI (or VGA), LVDS or eDP outputs Hardware encode/transcode HD content (including HEVC 10-bit) DirectX 12, DirectX 11.2, DirectX 11.1, DirectX 11, DirectX 10.1, DirectX 10,DirectX 9 support OpenGL 4.5 support OpenCL 2.1, 2.0/1.2 support |
Digital Display Interface |
DDI1/2/3 supporting DisplayPort 1.2, HDMI 1.4, DVI Notes: DP1.2: max. resolution is 4096x2304 @ 60Hz, 24bpp HDMI1.4: max. resolution is 4096x2160 @ 24Hz, 24bpp |
VGA | VGA support, in place of DDI3 channel (build option, max. resolution 1920x1200@60Hz) |
LVDS | Single/dual channel 18/24-bit LVDS from eDP-to-LVDS IC (max. resolution 1920x1200@60Hz in dual mode) |
eDP | 4 lane support optional, in place of LVDS (build option, max. resolution 4096x2304 @60Hz, 24bpp) |
Audio |
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Chipset | Intel HD Audio integrated in chipset |
Audio Codec | Located on carrier Express-BASE6 (ALC886 standard supported) |
Ethernet |
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Intel MAC/PHY | Intel I219LM/V with AMT 12.0 support (only LM version support AMT) |
Interface | 10/100/1000 GbE connection |
I/O Interfaces |
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USB | 4x USB 3.1 (USB 0, 1, 2, 3) and 4x USB 2.0 (USB 4, 5, 6, 7) |
SATA | Four ports SATA 6Gb/s (SATA0,1,2,3) |
Serial | 2 UART ports with console redirection |
GPIO/SD |
4 GPO and 4 GPI (GPI with interrupt) SD/GPIO muxed design, switched by BIOS setting SD functions as storage device only Note: USB 3.1 Gen2 support dependent on carrier design |
Super I/O | Supported on carrier if needed (standard support for W83627DHG-P) |
TPM |
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Chipset | Infineon |
Type | TPM 2.0 |
Power |
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Standard Input | ATX = 12V ±5% / 5Vsb ±5% or AT = 12V ±5% |
Wide Input | ATX = 8.5-20 V / 5Vsb ±5% or AT = 8.5-20V |
Management | ACPI 5.0 compliant, Smart Battery support |
Power States | C1-C6, S0, S1, S3, S4, S5 , S5 ECO mode (Wake-on-USB S3/S4, WOL S3/S4/S5) |
ECO mode | Supports deep S5 mode for power saving |
Other |
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Form Factor | PICMG COM.0, Rev 3.0 Type 6 |
Dimension | Basic size: 125 mm x 95 mm |
Operating Systems |
Standard Support: Windows 10 64-bit, Linux 64-bit Extended Support (BSP): Linux 64-bit |
Environmental and physical specifications |
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Operating temperature | Standard: 0°C to +60°C |
Storage temperature | Standard: -20°C to +80°C |
Humidity |
5-90% RH operating, non-condensing 5-95% RH storage (and operating with conformal coating) |
Shock and Vibration |
IEC 60068-2-64 and IEC-60068-2-27 MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D |
HALT | Thermal Stress, Vibration Stress, Thermal Shock and Combined Test |
Model | Description |
Express-CF-i7-8850H | Basic COM Express Type6 module with 8th Intel Core i7-8850H processor at 2.6/4.3GHz with QM370 chipset |
Express-CF-i5-8400H | Basic COM Express Type6 module with 8th Intel Core i5-8400H processor at 2.5/4.2GHz with QM370 chipset |
Express-CF-i3-8100H | Basic COM Express Type6 module with 8th Intel Core i3-8100H processor at 2.6GHz with HM370 chipset |
Express-CF-i3-8100H-VGA | Basic COM Express Type6 module with 8th Intel Core i3-8100H processor at 2.6GHz with HM370 chipset, with VGA |
Express-CFE-E-2176M | Basic COM Express Type6 module with 8th Intel Xeon E-2176M processor at 2.7/4.4GHz with CM246 chipset |
Express‑CFE‑E‑2176M‑3DIMM | Basic COM Express Type6 module with 8th Intel Xeon E-2176M processor at 2.7/4.4GHz with CM246 chipset, with three SO-DIMM |
Accessories | |
HTS-CF-B | Heatspreader for Express-CF/CFE with threaded standoffs for bottom mounting |
HTS-CF-BT | Heatspreader for Express-CF/CFE with through hole standoffs for top mounting |
THS-CF-BL | Low profile heatsink for Express-CF/CFE with threaded standoffs for bottom mounting |
THS-CF-BTL | Low profile heatsink for Express-CF/CFE with through hole standoffs for top mounting |
THSH-CF-BL | High profile heatsink for Express-CF/CFE with threaded standoffs for bottom mounting |
THSF-CF-BL | High profile heatsink with Fan for Express-CF/CFE with threaded standoffs for bottom mounting |
Starter kit for COM Express Type 6 | COM Express Type 6 Starter Kit Plus |