The Express-CFR is COM Express COM.0 R3.0 Basic Size Type 6 module supporting the Hexa-core (6 cores) 64-bit 9th Generation Intel Core and Xeon processor (codename «Coffeelake Refresh-H») with Mobile Intel QM370, HM370, CM246 Chipset.
The Express-CFR has up to three SODIMM sockets supporting up to 96GB of DDR4 memory (two on top by default, one on bottom by build option) while still fully complying with PICMG COM.0 mechanical specifications. Modules equipped with the Xeon processor and CM246 Chipset support both ECC and non-ECC SODIMMs.
Technical specifications | |
Core System |
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CPU |
Mobile 9th Gen Intel Core, Intel Xeon, Pentium and Celeron Processors - 14nm process Xeon E-2276ME 45W (35W cTDP), 6C/GT2 Xeon E-2276ML 25W, 6C/GT2 Xeon E-2254ME 45W (35W cTDP), 4C/GT2 Xeon E-2254ML 25W, 4C/GT2 Core i7-9850HE 45W (35W cTDP), 6C/GT2 Core i7-9850HL 25W, 6C/GT2 Core i3-9100HL 25W, 4C/GT2 Pentium G5600E 35W, 2C/GT1 Celeron G4930E 35W, 2C/GT1 Celeron G4932E 25W, 2C/GT1 Supports: Intel VT, Intel TXT, Intel SSE4.2, Intel HT Technology, Intel 64 Architecture, Execute Disable Bit, Intel Turbo Boost Technology 2.0, Intel AVX2, Intel AES-NI, PCLMULQDQ Instruction, Intel Secure Key and Intel TSX. Note: Availability of the features may vary between processor SKUs. |
Memory |
Up to 96GB 2133/2400 MHz DDR4 in three (superscript) SODIMM sockets (Xeon, Core i3, Pentium, Celeron paired with CM246 support both ECC and non-ECC memory) * Three sockets by build option |
Embedded BIOS | AMI EFI with CMOS backup in 32/16MB SPI BIOS with Intel AMT 12.0 support |
Cache | 12MB for Xeon 6C, 8MB for Xeon 4C, 9MB for Core i7, 6MB for Core i3, 4MB for Pentium, 2MB for Celeron |
Chipset |
Mobile CM246 (supports ECC memory and Intel AMT) Mobile QM370 (supports Intel AMT ) Mobile HM370 (no support for Intel AMT ) |
Expansion Busses |
PCIe x16 or 2 PCIe x8 or 1 PCIe x8 with 2 PCIe x4 (Gen3) 6 PCI Express x1 (Gen3); AB connector, Lanes 0/1/2/3/4/5 2 PCI Express x1 (Gen3); CD connector, Lane 6/7 LPC bus, SMBus (system), I2C (user) |
SEMA Board Controller | Supports: Voltage/Current monitoring, Power Sequence debug support, AT/ATX mode control, Logistics and Forensic information, Flat Panel Control, General Purpose I2C, Failsafe BIOS (dual BIOS), Watchdog Timer and Fan Control |
Debug Headers |
40-pin multipurpose flat cable connector for use with DB-40 debug module providing BIOS POST code LED, BMC access, SPI BIOS flashing, power testpoints, debug LEDs 60-pin XDP header for ICE debug of CPU/chipset (optional) |
Video |
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GPU Feature Support |
Intel Generation 9 LP Graphics Core Architecture, supporting 3 independent and simultaneous display combinations of DisplayPort/HDMI (or VGA), LVDS or eDP outputs Hardware encode/transcode HD content (including HEVC 10-bit) DirectX 12, DirectX 11.2, DirectX 11.1, DirectX 11, DirectX 10.1, DirectX 10,DirectX 9 support OpenGL 4.5 support OpenCL 2.1, 2.0/1.2 support |
Digital Display Interface |
DDI1/2/3 supporting DisplayPort 1.2, HDMI 1.4, DVI Notes: DP1.2: max. resolution is 4096x2304 @ 60Hz, 24bpp HDMI1.4: max. resolution is 4096x2160 @ 24Hz, 24bpp |
VGA | VGA support, in place of DDI3 channel (build option, max. resolution 1920x1200@60Hz) |
LVDS | Single/dual channel 18/24-bit LVDS from eDP-to-LVDS IC (max. resolution 1920x1200@60Hz in dual mode) |
eDP | 4 lane support optional, in place of LVDS (build option, max. resolution 4096x2304 @60Hz, 24bpp) |
Audio |
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Chipset | Intel HD Audio integrated in chipset |
Audio Codec | Located on carrier Express-BASE6 (ALC886 standard supported) |
Ethernet |
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Intel MAC/PHY | Intel I219LM/V with AMT 12.0 support (only LM version support AMT) |
Interface | 10/100/1000 GbE connection |
I/O Interfaces |
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USB | 4x USB 3.1 (USB 0, 1, 2, 3) and 4x USB 2.0 (USB 4, 5, 6, 7) |
SATA | Four ports SATA 6Gb/s (SATA0,1,2,3) |
Serial | 2 UART ports with console redirection |
GPIO/SD |
4 GPO and 4 GPI (GPI with interrupt) SD/GPIO muxed design, switched by BIOS setting SD functions as storage device only Note: USB 3.1 Gen2 support dependent on carrier design |
Super I/O | Supported on carrier if needed (standard support for W83627DHG-P) |
TPM |
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Chipset | Infineon |
Type | TPM 2.0 |
Power |
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Standard Input | ATX = 12V ±5% / 5Vsb ±5% or AT = 12V ±5% |
Wide Input | ATX = 8.5-20 V / 5Vsb ±5% or AT = 8.5-20V |
Management | ACPI 5.0 compliant, Smart Battery support |
Power States | C1-C6, S0, S1, S3, S4, S5, S5 ECO mode (Wake-on-USB S3/S4, WOL S3/S4/S5) |
ECO mode | Supports deep S5 mode for power saving |
Other |
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Form Factor | PICMG COM.0, Rev 3.0 Type 6 |
Dimension | Basic size: 125 mm x 95 mm |
Operating Systems |
Standard Support: Windows 10 64-bit, Linux 64-bit Extended Support (BSP): Linux 64-bit |
Environmental and physical specifications |
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Operating temperature |
Standard: 0°C to +60°C Extreme Rugged: -40°C to +85°C (build option for selected SKUs) |
Storage temperature |
Standard: -20°C to +80°C Extreme Rugged: -40°C to +85°C (build option for selected SKUs) |
Humidity |
5-90% RH operating, non-condensing 5-95% RH storage (and operating with conformal coating) |
Shock and Vibration |
IEC 60068-2-64 and IEC-60068-2-27 MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D |
HALT | Thermal Stress, Vibration Stress, Thermal Shock and Combined Test |
Model | Description |
Express-CFR-E-2276ME | Basic size type 6 COM Express module with 9th Intel Xeon E-2276ME hexa core processor at 2.8/4.5GHz with CM246 chipset, 3 SO-DIMM with ECC/non-ECC support |
Express-CFR-E-2254ME | Basic size type 6 COM Express module with 9th Intel Xeon E-2254ME quad core processor at 2.6/3.8GHz with CM246 chipset, 3 SO-DIMM with ECC/non-ECC support |
Express-CFR-E-2276ML | Basic size COM Express Type 6 module with Intel Xeon E-2276ML hexa-core processor at 2.0/4.2GHz with CM246 Chipset, 3 SO-DIMM with ECC/non-ECC support |
Express-CFR-E-2254ML | Basic size COM Express Type 6 module with Intel Xeon E-2254ML quad-core processor at 1.7/3.5GHz with CM246 Chipset, 3 SO-DIMM with ECC/non-ECC support |
Express-CFR-i7-9850HE | Basic size type 6 COM Express module with 9th Intel Core i7-9850HE hexa core processor at 2.7/4.4GHz with QM370 chipset, 3 SO-DIMM |
Express-CFR-i7-9850HL | Basic size COM Express Type 6 module with 9th Gen Intel Core i7-9850HL hexa-core processor at 1.9/4.1GHz with QM370 Chipset, 3 SO-DIMM |
Express-CFR-i3-9100HL | Basic size type 6 COM Express module with 9th Intel Core i3-9100HL quad core processor at 1.6/2.9GHz with HM370 chipset, 2 SO-DIMM |
Express-CFR-G5600E | Basic size type 6 COM Express module with 9th Intel Pentium G5600E dual core processor at 2.6/3.1GHz with HM370 chipset, 2 SO-DIMM |
Express-CFR-G4930E | Basic size type 6 COM Express module with 9th Intel Celeron G4930E dual core processor at 2.4GHz with HM370 chipset, 2 SO-DIMM |
Express-CFR-G4932E | Basic COM Express Type6 module with 9th Intel Celeron G4932E processor with HM370 chipset |
Express-CFR-i3-9100HL w/QM370 | Basic COM Express Type6 module with 9th Intel Core i3-9100HL processor with QM370 chipset |
Express-CFR-G5600E w/QM370 | Basic COM Express Type6 module with 9th Intel Celeron G5600E processor with QM370 chipset |
Express-CFR-G4930E w/QM370 | Basic COM Express Type6 module with 9th Intel Celeron G4930E processor with QM370 chipset |
Express‑CFR‑G4932E w/QM370 | Basic COM Express Type6 module with 9th Intel Celeron G4932E processor with QM370 chipset |
Note: SKUs that are not listed above can be supported on a project basis, or contact your local sales agent for further information | |
Accessories | |
HTS-CF-B | Heatspreader for Express-CF/CFE with threaded standoffs for bottom mounting |
HTS-CF-BT | Heatspreader for Express-CF/CFE with through hole standoffs for top mounting |
THS-CF-BL | Low profile heatsink for Express-CF/CFE with threaded standoffs for bottom mounting |
THS-CF-BTL | Low profile heatsink for Express-CF/CFE with through hole standoffs for top mounting |
THSH-CF-BL | High profile heatsink for Express-CF/CFE with threaded standoffs for top mounting |
THSF-CF-BL |
High profile heatsink with Fan for Express-CF/CFE with threaded standoffs for bottom mounting Note: Express-CF and Express-CFR share the same thermal solution. |
COM Express Type 6 Starter Kit Plus | A starter kit for COM Express Type 6 module |