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Express-CFR

COM Express Basic Size Type 6 Module
  • Details
  • Specification
  • Order information
  • Hexacore and quad-core Intel processors
  • Up to 96GB Dual Channel DDR4
  • Supports up to 3 independent displays
  • Extreme Rugged operating temperature: -40°C to +85°C (build option, selected SKUs)

The Express-CFR is COM Express COM.0 R3.0 Basic Size Type 6 module supporting the Hexa-core (6 cores) 64-bit 9th Generation Intel Core and Xeon processor (codename «Coffeelake Refresh-H») with Mobile Intel QM370, HM370, CM246 Chipset.

The Express-CFR has up to three SODIMM sockets supporting up to 96GB of DDR4 memory (two on top by default, one on bottom by build option) while still fully complying with PICMG COM.0 mechanical specifications. Modules equipped with the Xeon processor and CM246 Chipset support both ECC and non-ECC SODIMMs.

Technical specifications

Core System

CPU Mobile 9th Gen Intel Core, Intel Xeon, Pentium and Celeron Processors - 14nm process

Xeon E-2276ME 45W (35W cTDP), 6C/GT2
Xeon E-2276ML 25W, 6C/GT2
Xeon E-2254ME 45W (35W cTDP), 4C/GT2
Xeon E-2254ML 25W, 4C/GT2
Core i7-9850HE 45W (35W cTDP), 6C/GT2
Core i7-9850HL 25W, 6C/GT2
Core i3-9100HL 25W, 4C/GT2
Pentium G5600E 35W, 2C/GT1
Celeron G4930E 35W, 2C/GT1
Celeron G4932E 25W, 2C/GT1

Supports: Intel VT, Intel TXT, Intel SSE4.2, Intel HT Technology, Intel 64 Architecture, Execute Disable Bit, Intel Turbo Boost Technology 2.0, Intel AVX2, Intel AES-NI, PCLMULQDQ Instruction, Intel Secure Key and Intel TSX.

Note: Availability of the features may vary between processor SKUs.
Memory Up to 96GB 2133/2400 MHz DDR4 in three (superscript) SODIMM sockets (Xeon, Core i3, Pentium, Celeron paired with CM246 support both ECC and non-ECC memory)
* Three sockets by build option
Embedded BIOS AMI EFI with CMOS backup in 32/16MB SPI BIOS with Intel AMT 12.0 support
Cache 12MB for Xeon 6C, 8MB for Xeon 4C, 9MB for Core i7, 6MB for Core i3, 4MB for Pentium, 2MB for Celeron
Chipset Mobile CM246 (supports ECC memory and Intel AMT)
Mobile QM370 (supports Intel AMT )
Mobile HM370 (no support for Intel AMT )
Expansion Busses PCIe x16 or 2 PCIe x8 or 1 PCIe x8 with 2 PCIe x4 (Gen3)
6 PCI Express x1 (Gen3); AB connector, Lanes 0/1/2/3/4/5
2 PCI Express x1 (Gen3); CD connector, Lane 6/7
LPC bus, SMBus (system), I2C (user)
SEMA Board Controller Supports: Voltage/Current monitoring, Power Sequence debug support, AT/ATX mode control, Logistics and Forensic information, Flat Panel Control, General Purpose I2C, Failsafe BIOS (dual BIOS), Watchdog Timer and Fan Control
Debug Headers 40-pin multipurpose flat cable connector for use with DB-40 debug module providing BIOS POST code LED, BMC access, SPI BIOS flashing, power testpoints, debug LEDs
60-pin XDP header for ICE debug of CPU/chipset (optional)

Video

GPU Feature Support Intel Generation 9 LP Graphics Core Architecture, supporting 3 independent and simultaneous display combinations of DisplayPort/HDMI (or VGA), LVDS or eDP outputs
Hardware encode/transcode HD content (including HEVC 10-bit)
DirectX 12, DirectX 11.2, DirectX 11.1, DirectX 11, DirectX 10.1, DirectX 10,DirectX 9 support
OpenGL 4.5 support
OpenCL 2.1, 2.0/1.2 support
Digital Display Interface DDI1/2/3 supporting DisplayPort 1.2, HDMI 1.4, DVI

Notes:
DP1.2: max. resolution is 4096x2304 @ 60Hz, 24bpp
HDMI1.4: max. resolution is 4096x2160 @ 24Hz, 24bpp
VGA VGA support, in place of DDI3 channel (build option, max. resolution 1920x1200@60Hz)
LVDS Single/dual channel 18/24-bit LVDS from eDP-to-LVDS IC (max. resolution 1920x1200@60Hz in dual mode)
eDP 4 lane support optional, in place of LVDS (build option, max. resolution 4096x2304 @60Hz, 24bpp)

Audio

Chipset Intel HD Audio integrated in chipset
Audio Codec Located on carrier Express-BASE6 (ALC886 standard supported)

Ethernet

Intel MAC/PHY Intel I219LM/V with AMT 12.0 support (only LM version support AMT)
Interface 10/100/1000 GbE connection

I/O Interfaces

USB 4x USB 3.1 (USB 0, 1, 2, 3) and 4x USB 2.0 (USB 4, 5, 6, 7)
SATA Four ports SATA 6Gb/s (SATA0,1,2,3)
Serial 2 UART ports with console redirection
GPIO/SD 4 GPO and 4 GPI (GPI with interrupt)
SD/GPIO muxed design, switched by BIOS setting
SD functions as storage device only

Note: USB 3.1 Gen2 support dependent on carrier design
Super I/O Supported on carrier if needed (standard support for W83627DHG-P)

TPM

Chipset Infineon
Type TPM 2.0

Power

Standard Input ATX = 12V ±5% / 5Vsb ±5% or AT = 12V ±5%
Wide Input ATX = 8.5-20 V / 5Vsb ±5% or AT = 8.5-20V
Management ACPI 5.0 compliant, Smart Battery support
Power States C1-C6, S0, S1, S3, S4, S5, S5 ECO mode (Wake-on-USB S3/S4, WOL S3/S4/S5)
ECO mode Supports deep S5 mode for power saving

Other

Form Factor PICMG COM.0, Rev 3.0 Type 6
Dimension Basic size: 125 mm x 95 mm
Operating Systems Standard Support: Windows 10 64-bit, Linux 64-bit
Extended Support (BSP): Linux 64-bit

Environmental and physical specifications

Operating temperature Standard: 0°C to +60°C
Extreme Rugged: -40°C to +85°C (build option for selected SKUs)
Storage temperature Standard: -20°C to +80°C
Extreme Rugged: -40°C to +85°C (build option for selected SKUs)
Humidity 5-90% RH operating, non-condensing
5-95% RH storage (and operating with conformal coating)
Shock and Vibration IEC 60068-2-64 and IEC-60068-2-27
MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D
HALT Thermal Stress, Vibration Stress, Thermal Shock and Combined Test
Model Description
Express-CFR-E-2276ME Basic size type 6 COM Express module with 9th Intel Xeon E-2276ME hexa core processor at 2.8/4.5GHz with CM246 chipset, 3 SO-DIMM with ECC/non-ECC support
Express-CFR-E-2254ME Basic size type 6 COM Express module with 9th Intel Xeon E-2254ME quad core processor at 2.6/3.8GHz with CM246 chipset, 3 SO-DIMM with ECC/non-ECC support
Express-CFR-E-2276ML Basic size COM Express Type 6 module with Intel Xeon E-2276ML hexa-core processor at 2.0/4.2GHz with CM246 Chipset, 3 SO-DIMM with ECC/non-ECC support
Express-CFR-E-2254ML Basic size COM Express Type 6 module with Intel Xeon E-2254ML quad-core processor at 1.7/3.5GHz with CM246 Chipset, 3 SO-DIMM with ECC/non-ECC support
Express-CFR-i7-9850HE Basic size type 6 COM Express module with 9th Intel Core i7-9850HE hexa core processor at 2.7/4.4GHz with QM370 chipset, 3 SO-DIMM
Express-CFR-i7-9850HL Basic size COM Express Type 6 module with 9th Gen Intel Core i7-9850HL hexa-core processor at 1.9/4.1GHz with QM370 Chipset, 3 SO-DIMM
Express-CFR-i3-9100HL Basic size type 6 COM Express module with 9th Intel Core i3-9100HL quad core processor at 1.6/2.9GHz with HM370 chipset, 2 SO-DIMM
Express-CFR-G5600E Basic size type 6 COM Express module with 9th Intel Pentium G5600E dual core processor at 2.6/3.1GHz with HM370 chipset, 2 SO-DIMM
Express-CFR-G4930E Basic size type 6 COM Express module with 9th Intel Celeron G4930E dual core processor at 2.4GHz with HM370 chipset, 2 SO-DIMM
Express-CFR-G4932E Basic COM Express Type6 module with 9th Intel Celeron G4932E processor with HM370 chipset
Express-CFR-i3-9100HL w/QM370 Basic COM Express Type6 module with 9th Intel Core i3-9100HL processor with QM370 chipset
Express-CFR-G5600E w/QM370 Basic COM Express Type6 module with 9th Intel Celeron G5600E processor with QM370 chipset
Express-CFR-G4930E w/QM370 Basic COM Express Type6 module with 9th Intel Celeron G4930E processor with QM370 chipset
Express‑CFR‑G4932E w/QM370 Basic COM Express Type6 module with 9th Intel Celeron G4932E  processor with QM370 chipset
  Note: SKUs that are not listed above can be supported on a project basis, or contact your local sales agent for further information
Accessories
HTS-CF-B Heatspreader for Express-CF/CFE with threaded standoffs for bottom mounting
HTS-CF-BT Heatspreader for Express-CF/CFE with through hole standoffs for top mounting
THS-CF-BL Low profile heatsink for Express-CF/CFE with threaded standoffs for bottom mounting
THS-CF-BTL Low profile heatsink for Express-CF/CFE with through hole standoffs for top mounting
THSH-CF-BL High profile heatsink for Express-CF/CFE with threaded standoffs for top mounting
THSF-CF-BL High profile heatsink with Fan for Express-CF/CFE with threaded standoffs for bottom mounting

Note: Express-CF and Express-CFR share the same thermal solution.
COM Express Type 6 Starter Kit Plus A starter kit for COM Express Type 6 module
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