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Express-KL2

COM Express Basic Size Type 2 Module with Mobile 7th Gen Intel Xeon and Core Processors
  • Details
  • Specification
  • Order information
  • Single/dual channel 18/24-bit LVDS and VGA
  • Six PCIe x1, one PCI, one PCIe x16 (muxed with DDI channel)
  • Three SATA, one PATA, eight USB 2.0 and GbE
  • Extreme Rugged Operating Temperature: -40°C to +85°C (selected SKUs)

ADLINK announces a new COM Express Type 2 Computer-on-Module, based on the highly popular Intel Core processors (formerly codenamed Skylake and Kaby Lake). The Express-SL2/KL2 supports all type 2 related legacy I/O and thereby allows customers to extend the production life of existing type 2 based systems for at least another 10 years.

Technical specifications
Processor Mobile 7th Generation Intel Xeon, and Core Processors - 14nm (formerly”Kaby Lake-H”)
Xeon E3-1505M v6 3.0/4.0GHz (Turbo), 45W(35W cTDP) (4C/GT2)
Xeon E3-1505L v6 2.2/3.0GHz (Turbo), 25W (4C/GT2)
Core i7-7820EQ 3.0/3.7GHz (Turbo), 45W(35W cTDP) (4C/GT2)
Core i5-7440EQ 2.9/3.6GHz (Turbo), 45W(35W cTDP) (4C/GT2)
Core i5-7442EQ 2.1/2.9GHz (Turbo), 25W (4C/GT2)
Core i3-7100E 2.9GHz (no Turbo), 35W (2C/GT2)
Core i3-7102E 2.1GHz (no Turbo), 25W (2C/GT2)

Supports: Intel VT, Intel TXT, Intel SSE4.2, Intel HT Technology, Intel 64 Architecture, Execute Disable Bit, Intel Turbo Boost Technology 2.0, Intel AVX2, Intel AES-NI, PCLMULQDQ Instruction, Intel Device Protection Technology with Intel Secure Key, Intel TSXNI

Note: Availability of features may vary between processor SKUs.
Memory 2400 MHz DDR4 memory in dual stacked SODIMM sockets

Note: Xeon with CM236 supports both ECC and non-ECC memory (Core i3 available with MOQ)
Embedded BIOS AMI EFI with CMOS backup in 16MB SPI BIOS with Intel AMT 11 support (depends on CPU/PCH)
Cache 8MB for Xeon/Core i7
6MB for Core i5
3MB for Core i3
2MB for Celeron
PCH CM238 (supports ECC and non-ECC memory and Intel AMT)
QM175 (supports Intel AMT )
HM175 (no Intel AMT support)
Expansion Busses PCIe x16 or 2 PCIe x8 or 1 PCIe x8 with 2 PCIe x4 (Gen3, muxed with DDI channel, build option)
6 PCI Express x1 (Gen3); AB connector, Lanes 0/1/2/3/4/5, supports x4, x2, x1 configurations
1 PCI bus
LPC bus, SMBus (system), I2C (user)
SEMA Board Controller Supports: Voltage/current monitoring, power sequence debug support, AT/ATX mode control, logistics and forensic information, flat panel control, general purpose I2C, failsafe BIOS (dual BIOS, opt. support), watchdog timer and fan control
Debug Headers 40-pin multipurpose flat cable connector for use with DB-40 debug module providing BIOS POST code LED, BMC access, SPI BIOS flashing, power testpoints, debug LEDs
GPU Feature Support Intel Generation 9 Graphics Core Architecture, supporting 3 independent and simultaneous display combinations of VGA, LVDS (or optional eDP), optional DisplayPort/HDMI outputs (DisplayPort/HDMI from DDI channel muxed with PEG port)
Encode/transcode HD content
Playback of high definition content including Blu-ray Disc
Playback of Blu-ray Disc 3D content using HDMI (1.4a spec compliant with 3D)
DirectX Video Acceleration (DXVA) support for accelerated video processing
HEVC/H.265, H.264, M/JPEG, MPEG2, VC1, WMV9, VP8/VP9 HW decode
HEVC/H.265, M/JPEG, MPEG2 HW encode
Advanced Scheduler 2.0, 1.0, XPDM support
DirectX 12, DirectX 11.3, DirectX 11, DirectX 10.1, DirectX 10, DirectX 9 support
OpenGL up to 4.4, OpenCL up to 2.1 support
Digital Display Interface DDI1/2 are muxed with PEG port, build option feature, supporting DisplayPort 1.2, HDMI 1.4, DVI

Notes:
DP1.2: max. resolution 4096x2304 @ 60Hz, 24bpp
HDMI 1.4: max. resolution 4096x2160 @ 24Hz, 24bpp
VGA VGA support from DP-to-VGA IC
LVDS Single/dual channel 18/24-bit LVDS from eDP-to-LVDS IC (max. resolution 1920x1200@60Hz in dual mode)
eDP 4 lane support optional, in place of LVDS (build option, max. resolution 4096x2304 @60Hz, 24bpp)
Ethernet MAC integrated in QM170/HM170/CM236 Chipset
Intel® I219LM/V with AMT 11.0 support (only LM version supports AMT)
10/100/1000 GbE connection
Multi I/O and Storage USB: 8x USB 2.0 (USB 0-7)
SATA: 3x SATA 6Gb/s (SATA 0,1,2) Max. 4x SATA without PATA feature, build option
IDE (PATA): SATA-to-PATA IC on SATA port 3, Master only
GPIO/SD: 4x GPO and 4x GPI (GPI with interrupt)
Super I/O Supported on carrier if needed (standard support for W83627DHG-P)
TPM Chipset: Infineon
Type: TPM 2.0
Power Standard Input: ATX: 12V±5%, 5Vsb ±5% or AT: 12V±5%
Wide Input: ATX: 8.5-20V, 5Vsb ±5%; AT: 8.5-20V
Management: ACPI 5.0 compliant, Smart Battery support
Power States: C1-C6, S0, S1, S3, S4, S5 , S5 ECO mode (Wake-on-USB S3/S4, WOL S3/S4/S5)
ECO mode: Supports deep S5 mode for power saving
Operating Systems Standard Support
Windows 10 (64-bit), Linux (64-bit), VxWorks
Extended Support (BSP)
Linux 64-bit, VxWorks
Form Factor PICMG COM.0, Rev 2.1 Type 2
Dimension Basic size: 125 mm x 95 mm

Environmental and physical specifications

Operating temperature Standard: 0°C to 60°C
Extreme Rugged: -40°C to +85°C (selected SKUs, by project basis)

Humidity 5-90% RH operating, non-condensing
5-95% RH storage (and operating with conformal coating)
Shock and Vibration IEC 60068-2-64 and IEC-60068-2-27
MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D
HALT Thermal Stress, Vibration Stress, Thermal Shock and Combined Test
Model Description
Express‑KL2‑i7‑7820EQ Basic Size COM Express Type 2 module with Intel Core i7 - 7820EQ and GT2 level graphics, QM175 chipset
Express‑KL2‑i5‑7440EQ Basic Size COM Express Type 2 module with Intel Core i5 - 7440EQ and GT2 level graphics, QM175 chipset
Express-KL2-i3-7100E Basic Size COM Express Type 2 module with Intel Core i3 - 7100E and GT2 level graphics, HM175 chipset
HTS-SL2-B Heatspreader for Express-SL2 with threaded standoffs for bottom mounting
THS-SL2-B Low profile heatsink for Express-SL2 with threaded standoffs for bottom mounting
THSH-SL2-B High profile heatsink for Express-SL2 with threaded standoffs for bottom mounting
THSF-SL2-B High profile heatsink for Express-SL2 with threaded standoffs for top mounting

Note: Express-SL2 and Express-KL2 share the same thermal solutions.
COM Express Type 2 Starter Kit A starter kit for COM Express Type 2 module
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