Jasper is a COM Express carrier board and SBC for Type 6 Basic (125×95mm) and Compact (95×95mm) modules. It is designed for applications that require ruggedness, a high level of I/O, or extended product lifetime.
Notable features of Jasper include:
Jasper is available as a carrier board alone, for user integration with a COM of your choice, or as a ready to run «single-board computer» with an 11th generation Intel Xeon processor COM installed. Both Windows and Linux OS support are standard, while other OS support is available upon request.
Flexible Design to Fit Any Application
The most popular I/O on Jasper is provided on a single row of connectors along the front edge of the PCB. This arrangement supports dual connection modes. First Jasper can be used with traditional cables, with each cable providing a positive locking feature for increased shock and vibration resistance. Secondly the single row of connectors makes it easy to design and build I/O connector boards that match the end application’s exact requirements. For example a connector board with commercial connectors (RJ-45, USB type A, etc.) or MIL-DTL-38999 rugged circuit connectors can be plugged directly into the Jasper I/O connectors to create a «cable-free» solution. Such a connector board can dramatically reduce assembly time and cost for the end system.
Jasper was designed from the ground up with a comprehensive set of features to meet the challenges of rugged environments and applications:
Jasper supports installation of the COM and its heat spreader on the bottom side of the carrier. This enables more efficient mounting and heat dissipation, since the COM’s heat is directly coupled to the enclosure body instead of relying on a top-side heat sink to dissipate heat into the air inside. Jasper’s mounting plate surrounds the COM heat spreader to provide mounting stability for the entire board assembly.
Jasper includes dual PCIe minicard sockets with both PCIe and USB interfaces, supporting a wide range of I/O and communications/networking modules from Diamond as well as third party vendors. It includes an M.2 E key socket for installation of wifi and other networking modules. The PCIe/104 socket enables use with PCIe/104 Type 1 I/O modules using x1, x4, x8, and x16 PCIe links (depending on the capability of the installed COM) as well as PCIe/104 OneBank modules using the x1 lanes on the first connector bank.
The Jasper cable kit includes cables for all I/O and features on the board. All cables except for SATA have positive latching feature for resistance to shock and vibration.
|Compatibility||Supports COM Express Type 6 Basic & Compact modules|
|Rugged design||Latching connectors and thicker PCB|
|USB||2 USB 2.0, 3 USB3.1|
|Ethernet||2 Gigabit Ethernet|
|Serial||4 RS-232/422/485 ports|
|Video||2 HDMI, dual-channel 24-bit LVDS Display|
|PCIe MiniCard||Dual PCIe MiniCard sockets with PCIe, SATA, and USB support|
|Data acquisition||16 A/D, 4 D/A, 16 GPIO|
|PCIe/104||PCIe/104 expansion with PCIe x1 and x16 links|
M.2 (NVME/SATA) and SATA connectors for mass storage
M.2 E key socket for networking modules
|Power input||12V or 18-36VDC Input|
|Dimensions||5.75” x 4.00” / 146 x 102mm (3.5 inch form factor)|
Environmental and physical specifications
|Operating temperature||-40°C to +85°C (depending on installed COM)|
|JSP-BB01D||Jasper COM Carrier, low cost model, 18-36VDC In|
|JSP-BB02D||Jasper COM Carrier, PCIe/104 expansion, Digital I/O, 18-36VDC In|
|JSP-BB03A||Jasper COM Carrier, PCIe/104 and Data Acquisition, 18-36VDC In|
|JSP-11865MRE-64G-02D||Jasper SBC with Intel 11th Gen Xeon, 64GB RAM, DIO, 18-36VDC In|
|JSP‑11865MRE‑64G‑03A||Jasper SBC with Intel 11th Gen Xeon, 64GB RAM, DAQ, 18-36VDC In|
|6882210||Mounting Plate for Jasper Carrier|
|SDK‑JSP‑11865MRE‑LNX64||Linux Software Development Kit for Jasper Carrier/SBC|
|SDK‑JSP‑11865MRE‑W1064||Windows 10 Software Development Kit for Jasper Carrier/SBC|